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    • 52. 发明专利
    • DISTRIBUTED AMPLIFIER
    • JPH06125224A
    • 1994-05-06
    • JP29795892
    • 1992-10-09
    • NIPPON TELEGRAPH & TELEPHONE
    • KIMURA SHUNJIIMAI YUUKINAKAMURA MAKOTO
    • H03F1/18H03F1/42H03F3/60
    • PURPOSE:To compensate the deterioration of an output impedance and to improve the gain frequency characteristic by connecting a series circuit of a resistor and a capacitor to an output terminating circuit in parallel to a terminating resistor. CONSTITUTION:A drain side terminating circuit 13 is constructed by connecting a series circuit consisting of a capacitor 14 and a resistor 15 in parallel to a terminating resistor 8. The impedance of the circuit 13 has the frequency characteristic to show a low level at the high frequency side and a high level at the low frequency side respectively. Thus the circuit 13 compensates the frequency characteristic of the characteristic impedance of a distribution constant circuit at the drain side. That is, the resistance value of the resistor 8 and a bias circuit 10 are properly set at different levels so that the impedance is increased at the low frequency side. Thus the gain is increased at the low frequency side. At the same time, the resistance value of the resistor 15 is properly set so that the increase of the gain is suppressed at the high frequency side.
    • 54. 发明专利
    • PULSE OPERATING TYPE HIGH POWER AMPLIFYING DEVICE
    • JPS58141016A
    • 1983-08-22
    • JP2280782
    • 1982-02-17
    • NIPPON TELEGRAPH & TELEPHONE
    • NAKAMURA MAKOTO
    • H03F3/22H03F3/58
    • PURPOSE:To reduce the power consumption and size of an HPA, to reduce the heating value of a collector, and to prolong the life of a TWT, by using an anode power source as a pulse type AC power source of high frequency (20- 100kHz) and interrupting the pulse type AC power source by a burst control signal from a TDMA, etc. CONSTITUTION:An electron beam is led out of a cathode 2 heated by a heater power source 1 by the pulse type anode power source 6 and accelerated by a body power source 7 to be collected to a collector 5 by a collector power source 8, so that the kinetic energy of the electron beam is supplied to an input signal to perform amplifying operation. The electron beam is brought under interruption control by controlling the pulse type anode power source 6 by a control signal generator 9. For TDMA communication, its control signal is supplied by the burst control signal of a TDMA device. Normally, prescribed high voltages are applied to the body electrode 4 and collector electrode 5. When, however, the pulse type anode power source 6 is not turned on, the TWT is only applied with a voltage and no beam current flows.
    • 59. 发明专利
    • Inspection and manufacturing method of semiconductor device
    • 半导体器件的检测和制造方法
    • JP2013044644A
    • 2013-03-04
    • JP2011182583
    • 2011-08-24
    • Fujitsu Ltd富士通株式会社
    • NAKAMURA MAKOTO
    • G01N23/223
    • PROBLEM TO BE SOLVED: To provide an inspection and manufacturing method of a semiconductor device which enable accurate detection of attachments on a sample surface.SOLUTION: The surface of a sample 11 where a reflection coating 13 and a thin film 14 are formed in order on a substrate 12 is irradiated with an incident X-ray 82a at an incident angle θ shallower than a critical angle θc of the reflection coating 13, and the irradiation of the incident X-ray 82a is used to detect a fluorescent X-ray 83 emitted from attachments 86 on the thin film 14 surface, thereby detecting the attachments 86 on the sample 11 surface.
    • 要解决的问题:提供能够准确检测样品表面上的附着物的半导体器件的检查和制造方法。 解决方案:在基板12上依次形成反射涂层13和薄膜14的样品11的表面以入射角θθ照射入射角θθ,入射角θθ比临界角θc高 反射涂层13和入射的X射线82a的照射用于检测从薄膜14表面上的附件86发射的荧光X射线83,从而检测样品11表面上的附着物86。 版权所有(C)2013,JPO&INPIT
    • 60. 发明专利
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • JP2012222040A
    • 2012-11-12
    • JP2011083744
    • 2011-04-05
    • Fujitsu Ltd富士通株式会社
    • NAKAMURA MAKOTO
    • H01L25/04H01L25/18
    • H01L2224/04105H01L2224/19H01L2224/24137H01L2224/32225H01L2224/73267H01L2224/92244H01L2924/3512H01L2924/35121H01L2924/00012
    • PROBLEM TO BE SOLVED: To provide a technique for repeatedly forming barrier films on a surface of a metallic component.SOLUTION: A method of manufacturing a semiconductor device comprises steps of: forming a lower barrier film 20 on a substrate 15; forming a seed film on the lower barrier film; forming a conductive member on a part of a region of the seed film; forming an upper barrier film 28 on the top surface of the conductive member; removing the seed film in the region where the conductive member is not formed and exposing the lower barrier film in the region where the seed film is removed; forming a lateral barrier film 30 on the side surfaces of the conductive member with lower barrier film exposed; and removing the lower barrier film in the region where the conductive member and the lateral barrier film are not formed.
    • 要解决的问题:提供在金属部件的表面上重复形成阻挡膜的技术。 解决方案:一种制造半导体器件的方法包括以下步骤:在衬底15上形成下阻挡膜20; 在下阻挡膜上形成种子膜; 在种子膜的一部分区域上形成导电构件; 在导电构件的顶表面上形成上阻挡膜28; 在未形成导电部件的区域中除去种子膜,并在去除种子膜的区域中露出下阻挡膜; 在导电构件的侧表面上形成侧面阻挡膜30,其中下阻挡膜暴露; 并且在未形成导电构件和横向阻挡膜的区域中去除下阻挡膜。 版权所有(C)2013,JPO&INPIT