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51. 发明专利

JPH11300625A CUP-LIKE GRINDING WHEEL, GRINDING DEVICE AND METHOD FOR GRINDING SUBSTRATE 失效
公开(公告)号：JPH11300625A
公开(公告)日：1999-11-02
申请号：JP11485498
申请日：1998-04-24
申请人： EBARA CORP
发明人： MATSUO NAONORI , HIYAMA HIROKUNI , WADA TAKETAKA , HIROKAWA KAZUTO
IPC分类号： B24B7/04 , B24D7/06
摘要： PROBLEM TO BE SOLVED: To prevent the excessive grinding or cutting of a substrate to be ground caused by the edge part of a grinding wheel by providing a chamfered or tapered surface in the edge part of the grinding wheel in a device for pressing the substrate to be ground to the surface of the ring-shaped grinding wheel and grinding the substrate by mutual motions thereof. SOLUTION: A cup-like grinding wheel 10 suitably used for grinding a substrate to be ground such as a semiconductor wafer or various hard disks includes a ring-shaped grinding wheel 15 provided in the lower surface of a disk grinding wheel supporting member 11, and grinds the substrate by rubbing the substrate on its surface via grinding solution. In this case, entire edge parts 17 and 19 in the inner and outer peripheral surfaces of the lower surface of the grinding wheel 15 are formed to have specified round shapes (chamfered or tapered surfaces). Thus, the excessive grinding of the substrate by the edge parts of the grinding wheel 15 is prevented, and the cutting-off of the edge parts caused by impacts applied when the edge parts go over the outer peripheral of the substrate to be ground is prevented.

52. 发明专利

JPH11300609A SUBSTRATE POLISHING DEVICE 失效
公开(公告)号：JPH11300609A
公开(公告)日：1999-11-02
申请号：JP11674398
申请日：1998-04-27
申请人： EBARA CORP
发明人： HIROKAWA KAZUTO , HIYAMA HIROKUNI , WADA TAKETAKA , MATSUO NAONORI
IPC分类号： B24B41/047
摘要： PROBLEM TO BE SOLVED: To provide a substrate polishing device allowing a grinding wheel to follow a warp of a polished surface of a polished substrate even with the warp and absorbing reaction generated by friction between the polished substrate and the grinding wheel in course of polishing so as to being the surface of the grinding wheel appropriately in contact with the surface of the polished substrate to attain uniform polishing. SOLUTION: In a substrate polishing device making a grinding wheel 1 abut to a substrate 5 to be polished to polish the substrate 5 by the relative motion of the substrate 5 tu be polished and grinding wheel 1, the grinding wheel 1 is fitted to a support body 2 through an elastic body 3. The grinding wheel 1 comprises a large number of pellet-like grindstones arranged in annular shape, and each pellet-like grindstone is fitted to the support body 2 through the elastic body 3. The grinding wheel 1 is supported to the support body 2 through a spherical seat bearing.

53. 发明专利

JPH11179652A POLISHING DEVICE AND METHOD 失效
公开(公告)号：JPH11179652A
公开(公告)日：1999-07-06
申请号：JP36395297
申请日：1997-12-17
申请人： EBARA CORP
发明人： WADA TAKETAKA , HIYAMA HIROKUNI , HIROKAWA KAZUTO , MATSUO NAONORI
IPC分类号： B24B37/30 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and method whereby nonuniformity of polishing can be easily corrected, and to polish so as to adjust a stock removable in aimed partial region of a polishing surface. SOLUTION: This device has a turntable 5 sticking a polishing cloth 6 in an upper surface and a top ring 1, a polishing object 4 is interposed between the turntable 5 and the top ring 1, and by pressing with prescribed force, the polishing object 4 is polished into flatness and mirror finished. Here, in a hold surface with the top ring 1 holding the polishing object, a plurality of vacuum suction possible openings 10 , 20 are provided, a plurality of the openings 10 , 20 are divided into a plurality of regions C1 , C2 , C3 , and vacuum suction is made possible in each region.

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