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51. 发明专利

JP2003142243A INDUCTION HEATING DEVICE 审中-公开
公开(公告)号：JP2003142243A
公开(公告)日：2003-05-16
申请号：JP2001340734
申请日：2001-11-06
申请人： KOYO THERMO SYS KK
发明人： FUJIYAMA CHIKAHIDE , ISHIBASHI SATOYUKI
IPC分类号： H05B6/10 , F27D11/06 , H01L21/02 , H01L21/324
摘要： PROBLEM TO BE SOLVED: To provide a compact and energy saving induction heating device which can prevent overheat of a heating coil. SOLUTION: A heat insulation material 2 is arranged between a heating coil 1 and a heating plate 3 heated by induction heating of the heating coil 1. The heating coil 1 is protected from heating due to the radiation heat of the heating plate 3 by the heat insulation material 3.

52. 发明专利

JP2002295977A CONTINUOUS KILN 失效
公开(公告)号：JP2002295977A
公开(公告)日：2002-10-09
申请号：JP2001095182
申请日：2001-03-29
申请人： KOYO THERMO SYS KK
发明人： MORIMOTO IWAO
IPC分类号： F27B9/12 , F27B9/02
摘要： PROBLEM TO BE SOLVED: To provide a continuous kiln in which a temperature fall rate in a gradually cooling part can be set to an arbitrary rate and in-plane temperature distribution of a material to be heated can be uniformly adjusted. SOLUTION: In the gradually cooling part composed of a plurality of zones, an air passage 7 facing the lower surface and the side surfaces of the furnace wall of the gradually cooling part, an air supply device 10 for supplying air to the air passage 7, a regulating valve 9 for adjusting air volume, a heating means 3 for heating each prescribed area of areas obtained by dividing the zones along the advancing direction and the widthwise direction thereof and a control means for controlling the regulating valve 9 and the heating means 3. In this structure, an amount of radiation for radiating heat in accordance with a heat exchange with air for each zone is changed to set the temperature fall rate in the gradually cooling part to a desired prescribed rate.

53. 发明专利

JP2002267367A HEATING FURNACE 失效
公开(公告)号：JP2002267367A
公开(公告)日：2002-09-18
申请号：JP2001063492
申请日：2001-03-07
申请人： KOYO THERMO SYS KK
发明人： TAKEDA HIROYUKI
IPC分类号： B23K1/008 , C21D1/74 , F27B9/02 , F27B9/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a heating furnace to enable high efficient and uniform feed of purge gas through an air outlet to a space between baffle plates and improve a cut-off effect between outside air and the interior of a furnace by purge gas through simple constitution. SOLUTION: A plurality of the air outlets 1b through which purge gas is supplied to a space between the adjoining baffle plates 4 are formed in a top plate 1a of a purge chamber 1. A space above the air outlets 1b is airtightly closed by a closing member 5, a gas feed opening 7 connected to a gas feed source is airtightly connected to the closing member 5 and a gas feed space 2 to feed in a dispersed manner purge gas to the air outlets 1b through the gas feed opening 7.

54. 发明专利

JP2002195762A HEAT TREATMENT APPARATUS 失效
公开(公告)号：JP2002195762A
公开(公告)日：2002-07-10
申请号：JP2000387607
申请日：2000-12-20
申请人： KOYO THERMO SYS KK
发明人： KUMAGAI YOSUKE
IPC分类号： F27D3/12 , F27D7/04
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment apparatus wherein an opening adjustment with adjusting means is facilitated. SOLUTION: A mounting plate (mounting means) 7, insertable into a heating chamber 5, is provided, on which there are mounted a plurality of adjusting plates (adjusting means) 9 which adjust the volume of hot air flowing in the heating chamber 5, by performing at least one opening adjustment of an inlet hole 5a1 and an exhaust hole 5b1 for uniformizing the temperature distribution in the heating chamber 5.

55. 发明专利

JP2002181461A BUBBLING DEVICE FOR CONTROLLING IN-FURNACE PRESSURE 失效
公开(公告)号：JP2002181461A
公开(公告)日：2002-06-26
申请号：JP2000376196
申请日：2000-12-11
申请人： KOYO THERMO SYS KK
发明人： UKITA AKIHIRO
IPC分类号： F27D19/00 , G05D16/00
摘要： PROBLEM TO BE SOLVED: To provide a device maintaining an in-furnace pressure of a heat treatment furnace to be constant. SOLUTION: A gas introduction chamber 8 having a port 9 introducing the gas exhausted from the heat treatment furnace is provided at the outer periphery of a bubbling tank 1 holding an oil liquid, and the chamber and the tank are made to communicate with each other by a gas outlet hole 1e provided in a boundary wall 1d between them and to hold the oil liquid in common. Inside the bubbling tank 1, a multihole plate 11 immersed in the oil liquid and disposed horizontally above the gas outlet hole 1e is provided.

56. 发明专利

JP2002181459A HEAT TREATMENT FURNACE 失效
公开(公告)号：JP2002181459A
公开(公告)日：2002-06-26
申请号：JP2000382571
申请日：2000-12-15
申请人： KOYO THERMO SYS KK
发明人： ITO MAKOTO , FUKUYAMA YOSHIHARU
IPC分类号： F27D11/02 , H01L21/22 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment furnace to easily reduce the size of the structure of the heat treatment furnace and simplify and be easily handled at low cost. SOLUTION: The outside surface of a process tube 2 is covered by a soaking member (an equalizing means) 3. By the soaking member 3, a radiation heat from a heater 1 is evenly conducted to the process tube 2, and a treatment temperature in the process tube 2 is uniformalized.

57. 发明专利

JP2002144076A REFLOW FURNACE AND ITS TREATING METHOD 失效
公开(公告)号：JP2002144076A
公开(公告)日：2002-05-21
申请号：JP2000337563
申请日：2000-11-06
申请人： KOYO THERMO SYS KK
发明人： ISHIBASHI SATOYUKI
IPC分类号： B23K31/02 , B23K1/00 , B23K1/008 , B23K3/04 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a reflow furnace and its treating method with which solder reflow treatment can efficiently be performed and also, a desirable temperature profile can be realized in high accuracy. SOLUTION: In the outside of a vertical type closable process tube 4, a cylindrical first heater (heating means) 1, a second heater (heating means) 2 and a cylindrical water jacket (cooling means) 3 are disposed, and the inner space of this process tube 4 is divided into a main heating zone A, a pre-heating zone B and a cooling zone C, respectively. A boat (elevating means) 7 loading a semi-conducting wafer (material to be treated) 8 is disposed in the above inner space, and the above boat 7 is elevated/lowered to the pre-heating zone B, the main heating zone A and the cooling zone C, in order with a control part (control means) 11 and this boat is stopped in each zone according to a desirable treating time condition.

58. 发明专利

JP2001291676A HEAT TREATMENT SYSTEM FOR SEMICONDUCTOR WAFER 失效
公开(公告)号：JP2001291676A
公开(公告)日：2001-10-19
申请号：JP2000109481
申请日：2000-04-11
申请人： KOYO THERMO SYS KK
发明人： MORIKAWA KIYOHIKO , FUKUYAMA YOSHIHARU
IPC分类号： F27D19/00 , F27D7/06 , F27D21/02 , H01L21/22
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment system for semiconductor wafer, in which electrical components can be arranged in the system and maintenance/inspection work of the electrical components can be carried out easily and efficiently. SOLUTION: Inside of a load chamber 3 is sectioned along one sidewall 1a by a partition wall 24 to form a section chamber 23. The partition wall 24 is provided with a maintenance/inspection opening 25 and a door 26 for opening/closing the opening 25. A clean unit 11 is fixed to the section chamber side of the door 26. Electrical components for controlling driving the system are disposed on the back face side of the clean unit 11 in the section chamber 23.

59. 发明专利

JP2001291675A FIXING STRUCTURE OF THERMOCOUPLE 失效
公开(公告)号：JP2001291675A
公开(公告)日：2001-10-19
申请号：JP2000109480
申请日：2000-04-11
申请人： KOYO THERMO SYS KK
发明人： MORIKAWA KIYOHIKO , FUKUYAMA YOSHIHARU
IPC分类号： G01K1/14 , F27D21/00 , H01L21/205 , H01L21/22 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To provide a fixing structure of thermocouple in a vertical furnace for heating a semiconductor wafer, by means of which a thermocouple can be fixed within a prescribed range, regardless of manufacturing errors. SOLUTION: Lateral pipe section 7b of a thermocouple 7 is supported, on the other side of a port 8a, to move vertically through a flange 10 and an O-ring 9 with the one end side of the port 8a as a fulcrum. Since the fixing position can be adjusted vertically, angular error is absorbed with respect to a longitudinal pipe section 7a, thus reducing required accuracy errors.

60. 发明专利

JP2001267261A ELECTRIC HEATER IN HEAT TREATMENT EQUIPMENT FOR SEMICONDUCTOR 失效
公开(公告)号：JP2001267261A
公开(公告)日：2001-09-28
申请号：JP2000070092
申请日：2000-03-14
申请人： KOYO THERMO SYS KK
发明人： AITANI TAKASHI , TOMINO TAKAYUKI
IPC分类号： H05B3/44 , H01L21/22 , H01L21/324
摘要： PROBLEM TO BE SOLVED: To reduce power consumption by reducing heat loss from the outer circumferential surface of a shell. SOLUTION: This heater 1 in a heat treatment equipment for semiconductor comprises a tubular heater body 2 made of a ceramic thermal insulation material and mounted with heater elements 8, and a metallic shell 2 covering the outer circumferential surface of the heater body 2. A pouch 11 made of a heat resistant cloth and encapsulating a large number of micro hollow spherical bodies 10 made of micro porous thermal insulation material is interposed between the outer circumferential surface of the heater body 2 and a shell 5. Inside diameter of the micro hollow spherical body 10 is shorter than the mean free path of gas molecules in the air.

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