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    • 42. 发明专利
    • Polishing apparatus, and method for manufacturing semiconductor device
    • 抛光装置和制造半导体器件的方法
    • JP2005262406A
    • 2005-09-29
    • JP2004080812
    • 2004-03-19
    • Toshiba Corp株式会社東芝
    • MINAMI FUKUGAKUYANO HIROYUKI
    • B24B57/02B24B37/00B24C3/32B44C1/22H01L21/00H01L21/304
    • B24C3/322B24C11/005H01L21/6708
    • PROBLEM TO BE SOLVED: To provide a polishing apparatus which can polish a film to be processed, which film exists on any surfaces of a semiconductor substrate. SOLUTION: The polishing apparatus comprises turning mechanisms (11a, 11b, 11c) for turning the semiconductor substrate (10) having films to be processed, which films are accumulated thereon, and a supply unit (12) for supplying a polishing fluid on the surface to be polished of the film to be processed. The supply unit has a polishing powder jetting nozzle (13), an additive supply port (14), and a water supply port (15). The polishing fluid is supplied toward at least one of the front surface, the side surface, and the back surface of the semiconductor substrate. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了提供一种抛光装置,该抛光装置可以在半导体衬底的任何表面上存在薄膜,该膜可以被抛光。 解决方案:抛光装置包括用于转动具有聚集在其上的膜的待处理膜的半导体衬底(10)的转动机构(11a,11b,11c)和用于供应抛光流体的供应单元(12) 在要被加工的薄膜被抛光的表面上。 供给单元具有抛光粉末喷射喷嘴(13),添加剂供给口(14)和供水口(15)。 向半导体衬底的前表面,侧表面和后表面中的至少一个提供抛光流体。 版权所有(C)2005,JPO&NCIPI
    • 43. 发明专利
    • Photosensitive resin composition for sandblasting and its use
    • 感光树脂组合物及其用途
    • JP2005084537A
    • 2005-03-31
    • JP2003318775
    • 2003-09-10
    • Asahi Kasei Electronics Co Ltd旭化成エレクトロニクス株式会社
    • ADACHI TERUHIKOTOMITA HIROO
    • G03F7/029B24C1/04C08F2/50C08F290/06G03F7/004G03F7/027
    • B24C11/005
    • PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for sandblasting having excellent alkaline developing property and resolution, excellent adhesion property with a substrate, excellent resistance against sandblasting, sharpness of an image and easy microprocessing property. SOLUTION: The photosensitive resin composition for sandblasting contains an alkali-soluble polymer compound by ≥20 mass% and ≤80 mass%, an ethylenically unsaturated addition polymerizable monomer by ≥5 mass% and ≤50 mass%, a bisacylphosphine oxide compound as a photopolymerization initiator by ≥0.1 mass% and ≤10 mass%, a urethane prepolymer of ≥10 mass% and ≤70 mass% obtained from a polymer having a hydroxyl group at the molecular end, polyisocyanate and a compound having both of a functional group having active hydrogen and an ethylenically unsaturated bond. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种具有优异的碱性显影性和分辨率,与基材的优异粘附性,优异的耐喷砂性,图像清晰度和容易的微处理性能的喷砂用感光性树脂组合物。 解决方案:喷砂用感光性树脂组合物含有≥20质量%且≤80质量%的碱溶性高分子化合物,≥5质量%且≤50质量%的烯属不饱和可加成单体,双酰基氧化膦化合物 作为光聚合引发剂,≥0.1质量%和≤10质量%,由分子末端具有羟基的聚合物获得的≥10质量%和≤70质量%的氨基甲酸酯预聚物,多异氰酸酯和具有功能性 基团具有活性氢和烯属不饱和键。 版权所有(C)2005,JPO&NCIPI
    • 47. 发明专利
    • Process of removing burr
    • 删除流程的过程
    • JPS5937052A
    • 1984-02-29
    • JP14331382
    • 1982-08-20
    • Toshiba Corp
    • NAKADA JIYUNJI
    • B24B49/16B24C1/00B24C1/08
    • B24C1/083B24C11/005
    • PURPOSE: To improve performance of burr removing and facilitate cleaning by a method wherein suspension liquid containing synthetic resin, water and boundary surface active agent is injected against a product to be worked in the process of removing resin burr from a semiconductor device.
      CONSTITUTION: A synthetic resin abrasive 5 composed of non-saturated polyester resin etc. has sharp edges, is mixed in water 6 with its 5 to 30wt%, non-ion boundary surface active agent of 0.001 to 1wt% is added, resulting in making suspension liquid 7 with decreased surface tension and then the liquid is injected toward a semi-conductor device 15 from a gun 11 along with the compressed air 12. Under this injection, the resin burr 17 formed on the lead frame 16 shows a crack 18 due to a striking action of the abrasive material 5, the water with less surface tension penetrates into the crack, peeling-off of the resin is promoted along with a vibration due to impact and the performance of burr removing is improved. The boundary surface active agent may prevent charging of static electricity and adhesion of the removed burr and then facilitate the cleaning at the later process.
      COPYRIGHT: (C)1984,JPO&Japio
    • 目的:通过在从半导体器件除去树脂毛刺的工序中将含有合成树脂,水和边界表面活性剂的悬浮液注入待加工的产品的方法来提高毛刺去除的性能并促进清洗。 构成:由非饱和聚酯树脂等构成的合成树脂研磨剂5具有锋利的边缘,在水6中混合其5〜30重量%,非离子界面活性剂为0.001〜1重量%,从而制成 具有降低的表面张力的悬浮液7,然后将液体与压缩空气12一起从枪11向半导体装置15注入。在该注入下,形成在引线框16上的树脂毛刺17显示出裂纹18 对于研磨材料5的冲击作用,具有较小表面张力的水渗透到裂纹中,树脂的剥离以及由于冲击引起的振动而提高,并且提高了除毛的性能。 边界表面活性剂可以防止静电的充电和去除的毛刺的粘附,并且在稍后的过程中促进清洁。
    • 49. 发明专利
    • Abrasive waterjet working apparatus and working method
    • 磨砂水处理装置和工作方法
    • JP2014065128A
    • 2014-04-17
    • JP2012213225
    • 2012-09-26
    • Sugino Machine Ltd株式会社スギノマシン
    • OGAWA MASARUTERA NOBUYUKITSUNEMOTO SHINJI
    • B24C11/00B24C5/02B24C7/00B24C9/00
    • B24C11/005B24C3/04B24C11/00
    • PROBLEM TO BE SOLVED: To provide an abrasive waterjet working apparatus which has improved working accuracy and working efficiency by attaining excellent fluidity of an abrasive inside a nozzle.SOLUTION: An abrasive waterjet working apparatus 100 works a workpiece W by spraying the workpiece W with an abrasive waterjet AWJ composed by mixing a high-pressure working liquid Q with an abrasive G. The working apparatus includes: an abrasive waterjet nozzle 1 for spraying the abrasive waterjet AWJ; a high-pressure water supply device 101 for supplying the nozzle with the working liquid Q; and an abrasive supply device 8 for supplying the abrasive G to the working liquid Q. The abrasive G is composed of a coated abrasive G3 obtained by coating a surface of an abrasive material G1 made of abrasive grain with a water repellent material or a fluidity enhancing material G2. The abrasive supply device 8 supplies the abrasive waterjet nozzle 1 with the coated abrasive G3.
    • 要解决的问题:提供一种通过在喷嘴内获得磨料的优异流动性而提高加工精度和工作效率的磨料水射流加工装置。解决方案:磨料水射流加工装置100通过用工件W喷涂工件W来工作W 通过将高压工作液体Q与研磨剂G混合而组成的磨料喷水AWJ。工作装置包括:用于喷射磨料水刀AWJ的磨料水射流喷嘴1; 用于向喷嘴供给工作液Q的高压供水装置101; 以及用于将研磨剂G供给到工作液体Q的研磨剂供给装置8.研磨剂G由涂布的研磨剂G3构成,所述研磨剂G3通过用防水材料涂布由磨料颗粒制成的研磨材料G1的表面或流动性增强而得到 材料G2。 磨料供给装置8向磨料喷水喷嘴1供给涂覆的磨料G3。