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    • 48. 发明专利
    • CONDUCTIVE RESIN COMPOSITION
    • JP2000095947A
    • 2000-04-04
    • JP26557598
    • 1998-09-21
    • UNITIKA LTD
    • WAKAMURA KAZUYUKIKAMIYA KENJINEGI YUKINARI
    • H01B1/24C08K3/04C08K3/32C08K7/06C08L101/00H01Q17/00
    • PROBLEM TO BE SOLVED: To obtain a conductive resin composition which can give a molding having a high conductivity, excellent electromagnetic shielding properties, a high rigidity, and a reduced tendency to warp by incorporating a thermoplastic resin such as a polyamide resin with a carbon fiber and an expandable graphite. SOLUTION: This composition comprises 100 pts.wt. thermoplastic resin such as a polyamide resin, 5-40 pts.wt. carbon fiber having a fiber length of 40 μm to 7 mm and a fiber diameter of 6-8 μm, 5-60 pts.wt. expandable graphite having a size of 1-100 μm, and at most 50 pts.wt. bromine-containing flame retardant such as brominated polystyrene or a red phosphor flame retardant. The polyamide resin is desirably one having a relative viscosity of 1.4-4.0 (in 96% sulfuric acid in a concentration of 1 g/dl at 25 deg.C) and a crystalline polyamide/noncrystalline polyamide ratio of 50/50 to 95/5 by weight. The expandable graphite used is one obtained by treating a natural scaly graphite with e.g. a mixed acid such as concentrated sulfuric acid/concentrated nitric acid, washing and dehydrating the treated graphite and expanding the obtained product at 800-1,200 deg.C at an expansion ratio of 10-200 on the basis of the volume of the starting graphite and having a size of 1-100 μm.