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41. 发明专利

JPH10317073A WIRING COATING FOR FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH10317073A
公开(公告)日：1998-12-02
申请号：JP17645298
申请日：1998-06-23
申请人： TOSHIBA CORP
发明人： ISHIGAMI TAKASHI , KAWAI MITSUO , OBATA MINORU , SATO MICHIO , YAMANOBE TAKASHI , MAKI TOSHIHIRO , ANDO SHIGERU , YAGI NORIAKI
IPC分类号： C22B34/12 , C23C14/34 , H01L21/28 , H01L21/285 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To obtain wiring coating for forming a semiconductor device capable of improving reliability in the electrodes, the contact part, barrier layer or the like by executing coating formation using a target composed of a high purity metallic material of Ti, Zr, Hf or the like in which the content of Al is regulated to specified value. SOLUTION: A target composed of a high purity metallic material of one kind among Ti, Zr and Hf in which the contet of Al is regulated to

42. 发明专利

JPH10282071A ELECTROMAGNETIC ULTRASONIC TRANSDUCER 失效
公开(公告)号：JPH10282071A
公开(公告)日：1998-10-23
申请号：JP9258097
申请日：1997-04-10
申请人： TOSHIBA CORP
发明人： SATO MICHIO , WATABE KAZUMI , OCHIAI MAKOTO
IPC分类号： G01N29/04 , H04R1/06
摘要： PROBLEM TO BE SOLVED: To restrict decrease of an S/N ratio of detection signals due to mixing of transmission signals, construct a compact structure and enhance detection sensitivity to ultrasonic waves. SOLUTION: The electromagnetic ultrasonic transducer has a magnet assembly 2, a transmission copper wire (first wire) 5 for applying Lorentz force generation electric signals to a material to be inspected, and a detection copper wire (second wire) 6 for receiving electric signals corresponding to reflected ultrasonic signals. The magnet assembly 2 has a plurality of plate-like magnets 4...4 applying Lorentz force generation magnetic signals to the material to be inspected which are layered into one body. The transmission copper wire 5 and detection copper wire 6 are independently arranged at a side face of the magnet assembly 2 at the side of the material to be inspected in a direction of magnetization.

43. 发明专利

JPH0853756A HIGH-PURITY METALLIC MATERIAL 失效
公开(公告)号：JPH0853756A
公开(公告)日：1996-02-27
申请号：JP18514195
申请日：1995-07-21
申请人： TOSHIBA CORP
发明人： ISHIGAMI TAKASHI , KAWAI MITSUO , OBATA MINORU , SATO MICHIO , YAMANOBE TAKASHI , MAKI TOSHIHIRO , ANDO SHIGERU , YAGI NORIAKI
IPC分类号： C22B34/12 , C22B34/14 , C22C14/00 , C22C16/00 , C22C28/00 , C23C14/34 , H01L21/285 , H01L21/3205 , H01L23/52
摘要： PURPOSE:To produce a high-purity metallic material by which a joint leak, etc., are prevented when the electrode and contact of a highly integrated semiconductor device are formed and further by which the function of a barrier layer is not deteriorated when the layer is formed. CONSTITUTION:This high-purity metallic material consists of one kind of metal selected from Ti, Zr and Hf. The high-purity metallic materials contain

44. 发明专利

JPH06117914A LASER DOPPLER TYPE VIBROMETER 失效
公开(公告)号：JPH06117914A
公开(公告)日：1994-04-28
申请号：JP26763092
申请日：1992-10-06
申请人： TOSHIBA CORP
发明人： OCHIAI MAKOTO , SATO MICHIO
IPC分类号： G01H9/00 , G01P15/03
摘要： PURPOSE:To provide the vibrometer strong against disturbance such as vibration or the fluctuation of air. CONSTITUTION:In the vibrometer, laser beam 2f having two wavelengths is outputted from a laser beam source 12 and inputted to a deflecting beam splitter 3 through the 1/2 wavelength plate 15 of a laser beam splitting means 13 to be split into beams 2c, 2d. One laser beam 2c is passed through a 1/4 wavelength plate 16b and an optical system 7 to irradiate a vibration object 8 and the scattered beam 2e from the vibration object 8 is directed to the deflecting beam splitter 3 through the optical system 7 and the 1/4 wavelength plate 16b. The other laser beam 2d is applied to a mirror 14 serving as a laser beam reflecting means through the 1/4 wavelength plate 16a and the laser beam 2d reflected from the mirror 4 is again directed to the deflecting beam splitter 3 through the 1/4 wavelength plate 16a. The beam 2d and the scattered beam 2e are allowed to interfere with each other by an analyser 17 to form an interference beat signal which is, in turn, made to enter a photodetector 9.

45. 发明专利

JPH05295531A 失效
公开(公告)号：JPH05295531A
公开(公告)日：1993-11-09
申请号：JP10142792
申请日：1992-04-21
申请人： TOSHIBA CORP
发明人： YAMANOBE TAKASHI , SATO MICHIO , ISHIGAMI TAKASHI , OBATA MINORU , KAWAI MITSUO , YAGI NORIAKI , MAKI TOSHIHIRO , ANDO SHIGERU
IPC分类号： C23C14/14 , C23C14/34
摘要： PURPOSE:To produce a high purity and high quality Ti-W sputtering target suitable for use as a target material at the time of forming electrode contact part or barrier layer of a semiconductor device. CONSTITUTION:This Ti-W sputtering target has a fine mixed structure contg. Ti phase having

46. 发明专利

JPH05229812A SILICON SINTERED PRODUCT AND BOARD FORMED FROM THE SAME AND USED FOR HOLDING WAFER, SPATTERING TARGET AND SILICON WAFER 失效
公开(公告)号：JPH05229812A
公开(公告)日：1993-09-07
申请号：JP31370392
申请日：1992-11-24
申请人： TOSHIBA CORP
发明人： SATO MICHIO , KOMATSU TORU , YAMANOBE TAKASHI , KUDO ISAO , FUKAZAWA MIHARU
IPC分类号： C01B33/02 , C04B35/628 , C23C14/34 , H01L21/203 , H01L21/673 , H01L21/68
摘要： PURPOSE:To provide a silicon sintered product having a high density, a high strength and excellent processability, and to provide a board for holding wafers and a spattering target, which can be produced from the sintered product at low costs in high raw material yields. CONSTITUTION:The silicon sintered product of this invention is characterized by being a silicon sintered product which is formed by compression-molding silicon powder heated within a temperature range of from 1200 deg.C to the melting point of the silicon under vacuum and subsequently sintering the molded product, and in which the crystal particle diameter of the sintered product is

47. 发明专利

JPH05214523A SPUTTERING TARGET AND ITS MANUFACTURE 失效
公开(公告)号：JPH05214523A
公开(公告)日：1993-08-24
申请号：JP5425992
申请日：1992-02-05
申请人： TOSHIBA CORP
发明人： SATO MICHIO , YAMANOBE TAKASHI , ISHIGAMI TAKASHI , KAWAI MITSUO , YAGI NORIAKI , MAKI TOSHIHIRO , OBATA MINORU , ANDO SHIGERU
IPC分类号： B22F3/14 , C04B35/58 , C22C1/05 , C23C14/06 , C23C14/34 , H01L21/28 , H01L21/285
摘要： PURPOSE:To manufacture a semiconductor product having high quality and high precision by reducing the quantity of particles to be generated at the time of sputtering and, furthermore, reducing the content of aluminum to prevent its mixing into a formed film owing to its high density and high strength. CONSTITUTION:The objective sputtering target is a one having a fine mixed structure having high density in which metallic silicides are bonded in a chain shape to form a metallic silicide phase and silicon phases are incontinuously present on the gaps among the metallic silicide phases and having

48. 发明专利

JPH0540029A FURNACE INTERIOR INSPECTING DEVICE 失效
公开(公告)号：JPH0540029A
公开(公告)日：1993-02-19
申请号：JP19662591
申请日：1991-08-06
申请人： TOSHIBA CORP
发明人： KARASAWA HIROICHI , SATO MICHIO
IPC分类号： G01B17/00
摘要： PURPOSE:To detect the accurate position of an ultrasonic transducer by correcting position signals from position detectors by using displacement signals from a displacement detecting means. CONSTITUTION:The mechanism section 4 of a driving device 3 which three- dimensionally drives an ultrasonic transducer 2 in liquid sodium is equipped with position detectors 5a, 5b, and 5c. The detectors 5a, 5b, and 5c can detect the positional components of the transducer 2 along X-, Y-, and Z-axes orthogonally crossing each other. A displacement detecting means 9 detects the acceleration components of the device 3 along, for example, X-, Y-, and Z-axes by means of acceleration sensors 11a, 11b, and 11c and integration circuits 12a, 12b, and 12c respectively integrate detected acceleration components and find displaced components. A position correction circuit 10 corrects position signals from the detectors 5a, 5b, and 5c by using displacement signals found by the displacement detecting means 9 and sends corrected position signals to a picture processing circuit 7.

49. 发明专利

JPH04160358A ULTRASONIC FLAW DETECTOR 失效
公开(公告)号：JPH04160358A
公开(公告)日：1992-06-03
申请号：JP28469990
申请日：1990-10-23
申请人： TOSHIBA CORP
发明人： YOSHIOKA KENTA , SATO MICHIO
IPC分类号： G01N29/00 , G01N29/04
摘要： PURPOSE:To achieve the automation of inspection by facilitating mechanical scanning and to perform highly accurate flaw detection without being affected by noise by transmitting laser beam through an optical fiber and an image fiber. CONSTITUTION:Ultrasonic waves 6 are oscillated from the surface of a material to be inspected receiving the irradiation with a laser pulse 19. A part of ultrasonic waves 6 impinge against a flaw 7 to be reflected and reflected ultrasonic waves 8 are generated to vibrate the surface of the material 4 to be inspected. The laser beam 21 oscillated from a laser oscillator 11 is divided into two directions through a lens 12b and a beam splitter 13. One laser beam 22 is reflected from a mirror 27 through a mirror 14 and the beam splitter 13 to be entered to an image fiber 28. The other divided beam 23 is converged to the surface 20 of the material 4 to be inspected and the reflected laser beam 23 from the surface 20 is converged through the beam splitter 13 and a lens 15 and reflected by the mirror 27 to be entered to the image fiber 28. By this method, the reflected ultrasonic waves 8 can be detected.

50. 发明专利

JPH03162570A SPUTTERING TARGET AND PRODUCTION THEREOF 失效
公开(公告)号：JPH03162570A
公开(公告)日：1991-07-12
申请号：JP29979189
申请日：1989-11-20
申请人： TOSHIBA CORP
发明人： SATO MICHIO , OZAWA NORIO , KAWAI MITSUO
IPC分类号： B41M5/26 , C23C14/34 , G11B7/24 , G11B7/26
摘要： PURPOSE:To produce the sputtering target which can form thin films having a uniform compsn. by hot pressing a powder mixture composed of elements, such as Ag and Cu, and Te, sintering the molding at the temp. below the eutectic temp., thereby forming a Te alloy having a specific density ratio. CONSTITUTION:The raw material powder is prepd. by mixing >=1 kinds of the elements of Ag, Cu, Au, Zn, Cd, Ga, ln, Tl, Ge, Sn, Pb, As, Sb, Bi, and Se, and the Te. The fluctuation in the compsn. ratio (Te/M atom ratio, M is the above-mentioned element) is preferably set within + or -0.05. The total ratio of the above-mentioned elements is preferably

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