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41. 发明专利

JPH03116953A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH03116953A
公开(公告)日：1991-05-17
申请号：JP25595589
申请日：1989-09-29
申请人： NITTO DENKO CORP
发明人： NISHIOKA TSUTOMU , KITAMURA FUJIO , OIZUMI SHINICHI , IGARASHI KAZUMASA , TAKI HIDEAKI , NAKAO MINORU
IPC分类号： H01L23/29 , C08G59/20 , H01L23/31
摘要： PURPOSE:To improve a semiconductor device in reliability of moisture resistance by a method wherein the semiconductor device is sealed up with epoxy resin composition composed of a main component which is, at least, partially formed of specific epoxy resin and a setting agent component. CONSTITUTION:A semiconductor device is sealed up with epoxy resin composition composed of a main component which is, at least, partially formed of specific epoxy resin represented by a formula I and a setting agent component. In the formula I, at least one of R1-R4 is an aryl group, the rest are hydrogen atoms or methyl groups, and R5-R8 are hydrogen atoms or methyl groups. When epoxy resin represented by the formula I where an aryl group is introduced into a part of epoxy resin possessed of a biphenyl skeleton is used as sealing resin, the sealing resin can be made low in moisture absorption. By this setup, a semiconductor device can be improved in reliability of moisture resistance.

42. 发明专利

JPH03116951A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH03116951A
公开(公告)日：1991-05-17
申请号：JP25595389
申请日：1989-09-29
申请人： NITTO DENKO CORP
发明人： OIZUMI SHINICHI , KITAMURA FUJIO , KAWAMOTO NORIO , YAMANAKA KAZUTO , TABATA HARUO , TAKI HIDEAKI
IPC分类号： H01L23/29 , C08G59/62 , C08L63/00 , H01L23/31
摘要： PURPOSE:To improve a semiconductor device in package crack resistance under a high temperature on solder-mounting of a semiconductor element by a method wherein the semiconductor element is sealed up with epoxy resin composition composed of a main component of epoxy resin and a setting agent component which is, at least, partially formed of specific phenolic resin. CONSTITUTION:A semiconductor device is composed of a sealing resin 1, a lead frame 2, a package 3, a die bonding pad 4, a semiconductor element 7, and a bonding wire 8. The semiconductor element 7 is sealed up with epoxy resin composition composed of a main component of epoxy resin and a setting agent component which is, at least, partially formed of phenolic resin represented by a formula I. In the formula I, R denotes a hydrocarbon substituting group whose number of carbon atoms is 1-4 and (n) is an integer of 10-15. As mentioned above, the epoxy resin composition sealing resin 1 is suppressed in moisture absorption property, whereby the package 3 can be improved in moisture resistance. By this setup, a semiconductor device of this design can be improved in package crack resistance at a high temperature on solder- mounting.

43. 发明专利

JP2002292753A METHOD FOR MANUFACTURING POROUS FILM 失效
公开(公告)号：JP2002292753A
公开(公告)日：2002-10-09
申请号：JP2001095231
申请日：2001-03-29
申请人： NITTO DENKO CORP
发明人： TAKADA MASAKATSU , ICHIKAWA TOMOAKI , OIZUMI SHINICHI
IPC分类号： C08J9/28 , B29C48/90 , B29C67/20 , H01M2/16 , B29C47/90
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a porous film which has a more uniform thickness and also a high strength and nevertheless, a high porosity and an outstanding air permeability, compared to a conventional porous film. SOLUTION: This method for manufacturing a porous film comprises at least the steps of melting and kneading a polyolefin resin and a composition containing a solvent, then cooling the extrusion into sheet-like moldings after an extruding process and treating the sheet-like moldings by rolling, followed by stretching and solvent removing processes. In this method, the rolling process is performed by sequentially carrying out a heating/pressurizing step and a cooling/pressurizing step. This method is characterized in that the rolling factor T obtained by calculation in formula (1) which represents the build-up amount of a pressurizing force in the heating and pressurizing step and the cooling and pressurizing step, is 1,000 or more per 100 mm of the width of the sheet-like moldings immediately before rolling. Rolling factor T [N.h] = pressurizing force N × pressurizing time [h] (1) (wherein, the pressurizing force is a force to act on an object to be rolled in a compression direction and the pressurizing time is time over which the pressurizing force works).

44. 发明专利

JP2001260217A PRODUCING METHOD FOR POROUS FILM 失效
公开(公告)号：JP2001260217A
公开(公告)日：2001-09-25
申请号：JP2000079847
申请日：2000-03-22
申请人： NITTO DENKO CORP
发明人： ICHIKAWA TOMOAKI , OIZUMI SHINICHI
IPC分类号： C08J9/00 , B29C55/18 , H01M2/16
摘要： PROBLEM TO BE SOLVED: To provide a producing method for a porous film, in which void content and air permeability are moderate and mechanical strength is high and furthermore working efficiency of rolling is increased. SOLUTION: In the producing method for the porous film, a mixture consisting of a polyolefin composition and a solvent is melted and kneaded and the obtained molten kneaded material is extruded into a sheet shape and thereafter the same is cooled and the obtained sheetlike molded material is rolled. Two or more sheets of sheetlike molded material are overlapped and rolled by using a double belt press.

45. 发明专利

JP2000313759A PRODUCTION OF POROUS FILM 失效
公开(公告)号：JP2000313759A
公开(公告)日：2000-11-14
申请号：JP12296599
申请日：1999-04-28
申请人： NITTO DENKO CORP
发明人： OIZUMI SHINICHI , ICHIKAWA TOMOAKI
IPC分类号： C08J9/00 , B29C67/20
摘要： PROBLEM TO BE SOLVED: To provide a method for producing porous films having high mechanical strength, large specific surface area and large pore volume, and also excellent in ion permeability and high-speed electric charge and discharge characteristics. SOLUTION: This method for producing a porous film comprises the following steps: melting and kneading a resin composition comprising a polyolefin resin and solvent; molding the thus obtained molten/kneaded product into sheet-like forms through a cooled sizing die, heating, cooling, and continuously rolling the thus obtained sheet-like molded forms using a belt press machine where damming up portions are provided at the respective ends of the upper belt and/or lower belt, and thereafter, carrying out orientation and desolvation treatment of the forms thus worked.

46. 发明专利

JP2000272019A PRODUCTION OF POROUS FILM 失效
公开(公告)号：JP2000272019A
公开(公告)日：2000-10-03
申请号：JP8558699
申请日：1999-03-29
申请人： NITTO DENKO CORP
发明人： ICHIKAWA TOMOAKI , OIZUMI SHINICHI , YAMAMOTO KAZUNARI , NOMI TOSHISUKE
IPC分类号： C08J9/00 , B29C67/20 , B29K23/00 , B29K105/04 , C08J9/28 , C08L23/02 , H01M2/16
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a porous film which is high in strength and low in heat shrinkage and is applicable to a separator for a secondary cell. SOLUTION: In a method for producing a porous film in which a polyolefin resin containing an ultra-high molecular weight polyolefin resin is heated in a solvent, dissolved, kneaded, molded into gelatinous sheet 0.5-20 mm in thickness, rolled, stretched biaxially, and desolvated, a total draw ratio defined by the product of a roll ratio and a draw ratio is adjusted at 50-400 in terms of an area ratio, and the ratio of roll ratio/draw ratio is adjusted at 1-15.

47. 发明专利

JP2000103974A THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS USING THE SAME 失效
公开(公告)号：JP2000103974A
公开(公告)日：2000-04-11
申请号：JP27973299
申请日：1999-09-30
申请人： NITTO DENKO CORP
发明人： HOSOKAWA TOSHITSUGU , NISHIOKA TSUTOMU , IKEMURA KAZUHIRO , HARADA TADAAKI , MISUMI SADAHITO , TANIGUCHI TAKASHI , OIZUMI SHINICHI , YAMANE MINORU
IPC分类号： C08K9/10 , C08G18/02 , C08G59/62 , C08L63/00 , C08L101/00 , C08L101/16
摘要： PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition having excellent storage stability, capable of providing a semiconductor apparatus suppressed in the formation of voids and having excellent soldering resistance by making the composition include a thermosetting resin, a curing agent and a curing promoter- containing microcapsule. SOLUTION: This composition comprises (A) a thermosetting resin (preferably an epoxy resin), (B) a curing agent (preferably a phenol resin) and (C) a curing promoter-containing microcapsule having a coated core/shell structure in which a core part composed of a curing promoter is coated with a shell part constituted of a polyurea consisting of an isocyanate compound of formula I and an isocyanate compound of formula II and formed by their mixture in the molar ratio of (formula I/formula II) of 80/20-30/70. Consequently, the composition capable of being melted and mixed, having low viscosity of the whole system, being sufficiently kneaded and accordingly comprising uniformly mixed and dispersed components is obtained and can be expected to have utility as a sealing material for a semiconductor.

48. 发明专利

JP2000063628A SEMICONDUCTOR SEALING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME 失效
公开(公告)号：JP2000063628A
公开(公告)日：2000-02-29
申请号：JP14867199
申请日：1999-05-27
申请人： NITTO DENKO CORP
发明人： TANIGUCHI TAKASHI , YAMANE MINORU , NISHIOKA TSUTOMU , HARADA TADAAKI , HOSOKAWA TOSHITSUGU , IKEMURA KAZUHIRO , MISUMI SADAHITO , OIZUMI SHINICHI
IPC分类号： C08L63/00 , C08G59/40 , C08K3/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition capable of obtaining semiconductor devices having high reliability which does not cause fluctuations of positioning of semiconductor elements due to the resin flow at the time of sealing and chip chilling such as dislocation of wiring. SOLUTION: A semiconductor sealing resin composition which comprises an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler possesses such properties that (X) the viscosity expressed by a flow tester viscosity at 175 deg.C is 100-500 P; (Y) the minimum melt viscosity in the temperature variance in viscosity at a shear rate of 5(1/s) measured by a dynamic viscoelasticity measuring device is 1×105 P or less; and (Z) the viscosity ratio (Z1/Z2) of the viscosity (Z1) at 90 deg.C to the viscosity (Z2) at 110 deg.C at a shear rate of 5 (1/s) measured by a dynamic viscoelasticity measuring device is 2.0 or more.

49. 发明专利

JPH11343332A MICROCAPSULAR CURING AGENT, MICROCAPSULAR CURE ACCELERATOR, THEIR PREPARATION, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING 失效
公开(公告)号：JPH11343332A
公开(公告)日：1999-12-14
申请号：JP15342998
申请日：1998-06-02
申请人： NITTO DENKO CORP
发明人： HOSOKAWA TOSHITSUGU , NISHIOKA TSUTOMU , MISUMI SADAHITO , YAMANE MINORU , HARADA TADAAKI , IKEMURA KAZUHIRO , TANIGUCHI TAKASHI , OIZUMI SHINICHI
IPC分类号： B01J13/14 , C08G59/40 , C08G59/62 , C08G59/68 , C08L61/06 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain a microcapsular curing agent excellent in storage stability and proof against long-term deterioration in the capacity of a curing reaction by selecting a microcapsular curing agent having a core/shell structure in which the reactive amino groups present in the shell are blocked. SOLUTION: There is provided a microcapsular curing agent having a core/ shell structure in which the core comprising a curing agent is coated with the shell comprising a polymer having structural units represented by the formula, and the reactive amino groups present in the shell are blocked with an acidic compound such as formic acid. This agent is obtained by dissolving a curing agent being a core component in a polyisocyanate being a shell component to form an oil phase, dispersing the oil phase in an aqueous medium to form an O/W emulsion, effecting the interfacial polymerization of a polyamine dissolved in the aqueous phase with the polyisocyanate to form a dispersion of microcapsules in which the shell comprises a polyurea, and blocking the amino groups with a blocking agent. In the formula, R is a divalent or trivalent organic group; and R1 and R2 are each H or a monovalent organic group.

50. 发明专利

JPH1044294A OPTICAL FILM AND LIQUID CRYSTAL DISPLAY DEVICE 失效
公开(公告)号：JPH1044294A
公开(公告)日：1998-02-17
申请号：JP22038396
申请日：1996-08-01
申请人： NITTO DENKO CORP
发明人： MIYAUCHI KAZUHIKO , KOJIMA KATSUHIDE , SATAKE MASAYUKI , TANAKA YOSHIKAZU , OIZUMI SHINICHI , YAMAOKA HISASHI
IPC分类号： G02B5/30 , B32B7/02 , B32B7/10 , C09J7/02 , C09J133/00 , C09J201/00 , G02F1/1335
摘要： PROBLEM TO BE SOLVED: To provide an optical film in which cutting processability and optical function maintainability in a high temperature atmosphere are compatible by providing a pressure sensitive adhesive layer having a specific value of a modulus at a specific ratio at a specific temperature on one or both side surfaces of an optical film material. SOLUTION: An adhesive layer 3 having 2 to 6g/mm of 100% modulus at 90 deg.C and 3 to 7g/mm of 1000% modulus is provided on one side or both side surfaces of an optical film material 2. A protective film 1 is provided on an upper portion of the material 2, and a separator 4 is provided underneath a lower portion of the layer 3. Particularly acrylic polymer of the acrylic polymer has excellent transparency, weather resistance and heat resistance and uses one or more types of acrylic ester and methacrylic ester having a glass transition temperature of -10 deg.C or lower as monomer of a main component for developing suitable wettability and flexibility. At a viewpoint of preventiveness of stringiness or desizing residue of the adhesive layer at the time of cutting and processing the optical film, its weight-average molecular weight of 1,000,000 to 3,000,000 is particularly preferable.

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