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41. 发明专利

JPH11195552A THIN-TYPE CAPACITOR AND PRODUCTION OF THE SAME 失效
公开(公告)号：JPH11195552A
公开(公告)日：1999-07-21
申请号：JP1340398
申请日：1998-01-06
申请人： HOKURIKU ELECT IND
发明人： AZUMA KOJI , NAGARE ICHIRO , ISHIYAMA ICHIRO , YAMAZAKI MORIKATSU
IPC分类号： H01G4/12 , H01B1/16 , H01B3/12 , H01G4/33 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a thin-type capacitor having a crystal film of a ferroelectric substance which can be formed with a simple structure and at a relatively low temperature, and production of the same. SOLUTION: A predetermined circuit pattern 11 and a lower electrode 14 which extends from the circuit pattern 11 are formed on the top of an insulating substrate 12, with a titanium film 18 of a predetermined shape which is formed on the lower electrode 14. Formed on the titanium 18 are a crystalline forroelectric film 20 and an upper electrode 24, via which the crystalline forroelectric film 20 and the circuit pattern 11 are connected.

42. 发明专利

JPH1174104A MULTIPLY CONNECTED NETWORK CHIP PART AND ITS MANUFACTURE 失效
公开(公告)号：JPH1174104A
公开(公告)日：1999-03-16
申请号：JP23402097
申请日：1997-08-29
申请人： HOKURIKU ELECT IND
发明人： AZUMA KOJI , ISHIYAMA ICHIRO , NAGARE ICHIRO , YAMAZAKI MORIKATSU
IPC分类号： H01C1/14 , H01C7/00 , H01C13/00 , H01C17/06 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a multiply connected network chip part whose fixing area is small as compared with that of the conventional one. SOLUTION: A plurality of through-holes 11a-11f for connection which penetrate the chip-like substrates 31 -33 are formed through a laminate 5 where a plurality of chip-like substrates 31 , 32 , 33 are stacked and built into an unified body. Electrode portions serving as a plurality of soldering lands are formed on the substrate surface, which is positioned outside the laminating direction of the chip-like substrate 33 positioned at one end of the laminating direction of the laminate 5, corresponding to the through-holes 11a-11f for connection. Conductive paths 12a-12f are formed in the through-holes 11a-11f, respectively and electrically connected to the respective electrode portions. Electrode portions 91a , 91d ,... of electric element members 21 ,... formed on the chip-like substrates 31 -33 are connected electrically to the corresponding electrode portions via the conductive paths 12a-12f.

43. 发明专利

JPH1154366A CAPACITOR AND ITS MANUFACTURE 失效
公开(公告)号：JPH1154366A
公开(公告)日：1999-02-26
申请号：JP22080097
申请日：1997-07-31
申请人： HOKURIKU ELECT IND
发明人： AZUMA KOJI , FUKUHISA KOJI , NAGARE ICHIRO , OBARA YOZO , ISHIYAMA ICHIRO , YAMAZAKI MORIKATSU
IPC分类号： H01G4/30
摘要： PROBLEM TO BE SOLVED: To obtain an extremely high dielectric constant, by a method wherein an oxide film of an electrode metal is formed on one electrode surface and a dielectric film is formed thereon by thermal spraying. SOLUTION: An oxygen divided pressure of the thermal spraying atmosphere is regulated so that an oxide film 14 such as Cu2 O or the like is formed on a surface of one electrode 10, where dielectric film of BaTiO3 is thermally sprayed. Then, an oxide film of CuO is formed on a surface of the electrode 10 and a thermally sprayed dielectric film 12 is joined firmly to the electrode 10 via an oxide film 14. With respect to this capacitor, when the dielectric film 12 is formed on a surface of the electrode 10 by thermal spraying, as the oxide film 14 is formed on a surface of the electrode 10 to form the dielectric film 12, joint strength of the dielectric film is high, and also as the dielectric 12 ejects powders of BaTiO3 by thermal spraying, they are densely melted and adhered to the electrode 10 and the permittivity is close to that of solid BaTiO3 .

44. 发明专利

JPH1153944A DIELECTRIC FILM AND ITS MANUFACTURE 失效
公开(公告)号：JPH1153944A
公开(公告)日：1999-02-26
申请号：JP22079997
申请日：1997-07-31
申请人： HOKURIKU ELECT IND
发明人： AZUMA KOJI , FUKUHISA KOJI , NAGARE ICHIRO , ISHIYAMA ICHIRO , YAMAZAKI MORIKATSU
IPC分类号： H01B3/00
摘要： PROBLEM TO BE SOLVED: To provide high permitivity by forming conductive materials on each of powder particles such that the metallic conductive materials are stuck partly onto each of surfaces of the dielectric powder, that the metallic conductive materials jointed to each other between neighboring powder particles, and that a short circuit does not happen between front and back surfaces. SOLUTION: Island-like conductive materials 22 of a Ni-In intermetallic compound are jointed to surfaces of a dielectric film 26. The conductive material 22 joints with another conductive material 22 present on a surface of a neighboring dielectric substance 20 particle and cakes the dielectric substances to form the dielectric film 26. Electrodes 24, 25 of copper foil are jointed, respectively to the front and back surfaces of the dielectric film 26 and the conductive materials 22 being formed, as island shapes on surfaces of the dielectric substances 20 to such a degree as not to cause short circuit between the electrodes 24, 25, the amount and density of the conductive materials 22 are set according to desired permittivity. The dielectric film 26 has high binding strength and temperature for binding can be made extremely low, when an intermetallic compound is used as a binder for binding the dielectric substance 20 particles.

45. 发明专利

JPH10321418A MULTIPLY LAMINATED CHIP COMPONENT 失效
公开(公告)号：JPH10321418A
公开(公告)日：1998-12-04
申请号：JP13231797
申请日：1997-05-22
申请人： HOKURIKU ELECT IND
发明人： NAGARE ICHIRO , AZUMA KOJI , ISHIYAMA ICHIRO , YAMAZAKI MORIKATSU
IPC分类号： H01C1/142 , H01C7/00 , H01C13/02 , H01G4/38
摘要： PROBLEM TO BE SOLVED: To provide a multiply laminated chip component capable of shortening a pitch distance between connection electrodes shorter than before. SOLUTION: The electric elements 3 such as resistors, capacitors, and the like are formed on at least one face of the chip substrates 2 and a plurality of unit-chip component 6 having a pair of connection electrode 4 electrically connected to the electric elements 3 at the both end of the chip substrate 2 are unified in lamination through an insulation layer 7 comprising preimpregnation. A pair of connection electrodes 4 of each unit-chip component 6 have the connection electrode section 4a on the lamination face 8 extending in the lamination direction of the laminate formed by laminating the unit-chip components 6 and the insulation layer 7.

46. 发明专利

JPH10294643A SURFACE ACOUSTIC WAVE ELEMENT AND PRODUCTION THEREOF 失效
公开(公告)号：JPH10294643A
公开(公告)日：1998-11-04
申请号：JP11622897
申请日：1997-04-18
申请人： HOKURIKU ELECT IND
发明人： DOI AKIRA , ISHIYAMA ICHIRO , TATE TOSHIO
IPC分类号： H03H9/25
摘要： PROBLEM TO BE SOLVED: To contribute to the miniaturization of element with simple structure, to suppress low sprious outside bands and to reduce dispersion in the characteristics of products as well. SOLUTION: On a piezoelectric substrate 12, interdigital electrodes 13 and 14 and a reflector 15 are formed and the substrate 12 is housed in a package 20. The gap between the end face part of substrate 12 in the arranging direction of interdigital electrodes 13 and 14 and the reflector 15 and the inner surface of package 20 is filled with a damping agent 24 such as silicon resin. The damping agent 24 is projected rather than the element forming surface of substrate 12.

47. 发明专利

JPH10190197A DOUBLE-LAYERED CIRCUIT BOARD 失效
公开(公告)号：JPH10190197A
公开(公告)日：1998-07-21
申请号：JP34353196
申请日：1996-12-24
申请人： HOKURIKU ELECT IND
发明人： NAGARE ICHIRO , OBARA YOZO , AZUMA KOJI , ISHIYAMA ICHIRO , YAMAZAKI MORIKATSU
IPC分类号： H05K3/28
摘要： PROBLEM TO BE SOLVED: To easily trim a circuit board by using a drill or laser beam from a window hole without giving influences to the other part of the circuit board by incorporating a functional material constituting an electronic element section and forming the window hole for exposing at least part of the functional material through an external layer coating the functional material. SOLUTION: On the surface of an insulating substrate 8 composed of a thermosetting glass epoxy, etc., a conductive pattern 9 and, at the same time, the electrodes 10 and 10 of an electronic element section 1 are formed and a functional material 2 which fulfills a prescribed function as a resistance element, capacitor, inductor, etc., connected to the electrodes 10 is printed on the electrodes 10 and 10 and baked. Then, for example, an epoxy resin is applied to the surface of the material 2 as the insulating protective film 5 of the material 2 and insulating layers 11 and 11 are formed by applying and drying, for example, an epoxy resin as an external layer 3. In addition, a conductive pattern and electrodes are formed on the surfaces of the insulating layers 11 and a window hole 14 is formed through one insulating layer 11 coating the material 2 for exposing part of the material 2.

48. 发明专利

JPH10173307A CIRCUIT SUBSTRATE 失效
公开(公告)号：JPH10173307A
公开(公告)日：1998-06-26
申请号：JP33231196
申请日：1996-12-12
申请人： HOKURIKU ELECT IND
发明人： YAMAZAKI MORIKATSU , ISHIYAMA ICHIRO , NAGARE ICHIRO
IPC分类号： H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a circuit substrate with which mounting density can be enhanced by reducing the standardized mounting area of the CR circuit at least on a filter, a transmission circuit and a resonance circuit. SOLUTION: A lower conductive layer 2, a dielectric layer 3 and the upper conductive layer 4 are laminated on the surface of an insulating substrate 1 in this sequence. A circuit substrate, having as CR circuit part 6 formed by laminating a part of a resistor 5, is formed on the upper conductive layer 4, and a lower conductive layer 8 and an upper conductive layer 9 are formed on the upper and the lower surfaces of a dielectric layer 7 which is an insulated substrate. A circuit substrate, having a CR circuit part 11 formed by laminating a part of a resistor 10, is formed at least on either one of the lower conductive layer 8 or the upper conductive layer 9, and a plurality of layers of the circuit substrate are overlaid via an insulating layer.

49. 发明专利

JPH10173300A CIRCUIT BOARD 失效
公开(公告)号：JPH10173300A
公开(公告)日：1998-06-26
申请号：JP33231396
申请日：1996-12-12
申请人： HOKURIKU ELECT IND
发明人： NAGARE ICHIRO , ISHIYAMA ICHIRO , YAMAZAKI MORIKATSU
IPC分类号： H05K1/16 , H05K1/02 , H05K1/09 , H05K3/22
摘要： PROBLEM TO BE SOLVED: To provide a circuit board which can be trimmed without producing burrs or chips and where a conductor provided onto a comparatively thin synthetic resin board can be precisely trimmed. SOLUTION: A circuit board comprises a synthetic resin insulating board 1 and a conductive metal circuit pattern 2 provided onto the board 1, wherein a trimming region 4 formed of conductive paint is provided to a part of a device 3 which forms the inductor or antenna of the circuit pattern 2, and a circuit pattern 6 of conductive metal is provided to an insulating board 5 of synthetic resin. In this case, a capacitor 8 composed of the insulating board 5 and a pair of opposed electrodes 7 and 7 which sandwich the board 5 between them is provided, and a trimming region 9 of conductive paint is provided to a part of either or both of the opposed electrodes 7 and 7 of the capacitor 8.

50. 发明专利

JPH08279405A MANUFACTURE OF CHIP ELECTRONIC COMPONENT 失效
公开(公告)号：JPH08279405A
公开(公告)日：1996-10-22
申请号：JP10833395
申请日：1995-04-06
申请人： HOKURIKU ELECT IND
发明人： HIRAMATSU SHIGERU , TANAKA KEIICHI , ISHIYAMA ICHIRO , SHIMADA MASATO , KUROKAWA HIROYUKI
IPC分类号： H01C17/06
摘要： PURPOSE: To easily divide in the simple step and to scarcely generate a burr. CONSTITUTION: A board fixing film 25 formed with an adhesive layer 20 is provided, and a ceramic board 12 formed many lateral and longitudinal electronic elements such as resistors is laminated on the layer 20 of the film 25. The surface of the board 12 is coated with wax 26 dissolved in solvent at the ambient temperature by heating it to about it to about 150 deg.C and cooled to the ambient temperature, then the board 12 is heated to remove the solvent 27 in the wax 26 and diced to be divided at each chip electronic component 10.

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