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    • 43. 发明专利
    • Thermosetting resin composition and manufacturing method therefor
    • 热固性树脂组合物及其制造方法
    • JP2004346288A
    • 2004-12-09
    • JP2003148191
    • 2003-05-26
    • Matsushita Electric Works Ltd松下電工株式会社
    • YODA HIROYOSHIITO NAOKI
    • C08L63/00C08G59/18C08K3/00
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a thermosetting resin composition to obtain a cured product that has good appearance, high transparency, excellent heat resistance, and a small thermal expansion coefficient.
      SOLUTION: In this method for manufacturing a thermosetting resin composition, a thermosetting resin comprising an alicyclic epoxy resin is dissolved and mixed into an alcoholic organic solvent in which inorganic particles having a particle size ≤70 nm are dispersed, the solvent is then removed from the mixture, and a curing agent is added and mixed. The inorganic particles are uniformly dispersed without aggregation in the thermosetting resin. A cured product from the composition gives good appearance and excellent heat resistance, is highly transparent due to the fact that the dispersed inorganic particles are all nanoparticles having a particle size of ≤70 nm, and has a small thermal expansion coefficient similar to ceramic materials, and hardly generate stress distortion, due to the fact that the composition is a composite of the resin and the inorganic particles.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种制备热固性树脂组合物以获得具有良好的外观,高透明度,优异的耐热性和小的热膨胀系数的固化产物的方法。 解决方案:在制造热固性树脂组合物的方法中,将包含脂环族环氧树脂的热固性树脂溶解并混合到其中分散有粒径≤70nm的无机颗粒的醇有机溶剂中,然后将溶剂 从混合物中除去固化剂并混合。 无机颗粒均匀分散而不凝聚在热固性树脂中。 由于分散无机粒子全部为粒径≤70nm的纳米粒子,且具有与陶瓷材料相似的热膨胀系数小的事实,来自该组合物的固化物具有良好的外观和优异的耐热性,是高度透明的, 并且由于组合物是树脂和无机颗粒的复合物的事实,几乎不产生应力变形。 版权所有(C)2005,JPO&NCIPI
    • 45. 发明专利
    • MANUFACTURING METHOD OF PELTIER MODULE
    • JPH10215005A
    • 1998-08-11
    • JP1412197
    • 1997-01-28
    • MATSUSHITA ELECTRIC WORKS LTD
    • YODA HIROYOSHIYAMAZAKI KEIICHIHASHIMOTO NOBORU
    • H01L35/16H01L35/32
    • PROBLEM TO BE SOLVED: To obtain a Peltier module whose material loss is small, whose yield is high, which can be manufactured by an easy operation and which can reduce a defect rate. SOLUTION: In a manufacturing method, a Peltier module is manufactured by a process in which a plurality of P-type thermoelectric conversion elements 2 are formed on a substrate 1 for preliminary molding, by a process in which the respective P-type thermoelectric conversion elements 2 on the substrate 1 for preliminary molding are transferred to respective electrodes 4 on the surface of an insulating substrate 3 so as to manufacture a P-type thermoelectric-conversion-element arranging substrate 5, by a process in which a plurality of N-type thermoelectric conversion elements 6 are formed on the substrate 1 for preliminary molding, by a process in which the respective N-type thermoelectric conversion elements 6 on the substrate 1 for preliminary molding are transferred to the respective electrodes 4 on the surface of the insulating substrate 3 so as to manufacture an N-type thermoelectric- conversion-element arranging substrate 7, and by a process in which the P-type thermoelectric- conversion-element arranging substrate 5 and the N-type thermoelectric-conversion-element arranging substrate 7 are arranged so as to be faced, in which the N-type thermoelectric conversion elements 6 are bonded respectively to the respective electrodes 4 on the P-type thermoelectric-conversion-element arranging substrate 5 and in which the P-type thermoelectric conversion elements 2 are bonded respectively to the respective electrode 4 on the N-type thermoelectric-conversion-element arranging substrate 7.