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41. 发明专利

JPS6260290A SUBSTRATE FOR FLEXIBLE PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPS6260290A
公开(公告)日：1987-03-16
申请号：JP20036985
申请日：1985-09-10
申请人： HITACHI CHEMICAL CO LTD
发明人： TAKAHASHI HIROSHI , TAKANEZAWA SHIN
IPC分类号： C08G59/00 , C08L7/00 , C08L21/00 , C08L33/00 , C08L33/02 , C08L63/00 , C09J121/00 , C09J163/00 , H05K1/03 , H05K3/28 , H05K3/38

42. 发明专利

JPS60225491A METHOD OF PRODUCING PRINTED BOARD 失效
公开(公告)号：JPS60225491A
公开(公告)日：1985-11-09
申请号：JP8231084
申请日：1984-04-24
申请人： HITACHI CHEMICAL CO LTD
发明人： MOROZUMI NAOHIRO , NAKAO KIYOSHI , TAKAHASHI HIROSHI , TAKANEZAWA SHIN , NAKASO AKISHI
IPC分类号： H05K3/18

43. 发明专利

JPS60911B2 失效
公开(公告)号：JPS60911B2
公开(公告)日：1985-01-10
申请号：JP7046280
申请日：1980-05-26
申请人： HITACHI CHEMICAL CO LTD
发明人： UOZU NOBUO , TAKANEZAWA SHIN
IPC分类号： B32B15/04 , B32B7/12 , B32B15/08 , B32B15/092 , C09J129/14 , H05K1/03 , H05K3/44

44. 发明专利

JPS58164294A SUBSTRATE FOR PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPS58164294A
公开(公告)日：1983-09-29
申请号：JP4837082
申请日：1982-03-25
申请人： HITACHI CHEMICAL CO LTD
发明人： TAKAHASHI HIROSHI , UOZU NOBUO , TAKANEZAWA SHIN , MOROZUMI NAOHIRO
IPC分类号： H05K3/42

45. 发明专利

JPS58164289A METHOD OF PRODUCING SUBSTRATE FOR PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPS58164289A
公开(公告)日：1983-09-29
申请号：JP4836982
申请日：1982-03-25
申请人： HITACHI CHEMICAL CO LTD
发明人： TAKAHASHI HIROSHI , UOZU NOBUO , TAKANEZAWA SHIN , MOROZUMI NAOHIRO , YUGAWA MASAO , SATOU EIKICHI
IPC分类号： H05K1/03 , H05K3/18 , H05K3/38

46. 发明专利

JP2012116890A Flame-retardant resin composition, and prepreg and laminate using the same 审中-公开
标题翻译：阻燃树脂组合物，使用它们的预制和层压体
公开(公告)号：JP2012116890A
公开(公告)日：2012-06-21
申请号：JP2010265598
申请日：2010-11-29
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： MORITA KOJI , MURAI AKIRA , TAKANEZAWA SHIN , INOUE YASUO
IPC分类号： C08L101/02 , B32B15/08 , B32B27/00 , B32B27/38 , C08G59/20 , C08G77/04 , C08J5/24 , C08K3/22 , C08L63/00 , C08L83/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has insulation property, heat resistance and the like, particularly excellent flame retardancy without using a large quantity of hydroxides or low-melting glass, and is suitably used for electronic components, etc., and to provide a prepreg and a laminate using the resin composition.SOLUTION: The flame-retardant resin composition contains a resin (A) having an aromatic ring and a silicone condensate (B) as essential components, wherein the silicone condensate (B) is a compound having a phenyl group and an alkoxy group, has a condensation reaction rate of ≥50%, and is liquid at 20°C. There are also provided the prepreg and laminate using the resin composition.
摘要翻译：要解决的问题：为了提供具有绝缘性，耐热性等的特别优异的阻燃性而不使用大量氢氧化物或低熔点玻璃的热固性树脂组合物，并且适用于电子部件，并且使用该树脂组合物提供预浸料和层压材料。解决方案：阻燃树脂组合物含有具有芳环的树脂（A）和作为必需组分的硅氧烷缩合物（B），其中硅氧烷缩合物（B）是具有苯基和烷氧基的化合物，缩合反应率≥50％，在20℃下为液体。还提供了使用树脂组合物的预浸料和层压材料。版权所有（C）2012，JPO＆INPIT

47. 发明专利

JP2002040266A OPTICAL WIRING BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002040266A
公开(公告)日：2002-02-06
申请号：JP2000230189
申请日：2000-07-31
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWAZOE HIROSHI , ARIGA SHIGEHARU , TAKANEZAWA SHIN , TAKAHASHI ATSUSHI
IPC分类号： G02B6/00 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide an optical wiring board in which exposure of a fiber or the like for connecting devices is easy, which can be simply manufactured, in which breakage of an optical fiber at whole laying parts, particularly at an intersecting wiring part, does not occur and air does not remain inside the substrate and further to provide a manufacturing method of the optical wiring board. SOLUTION: The optical wiring board is constituted by laminating a first photosensitive resin layer, an optical fiber wiring layer and a second photosensitive resin layer in this sequence. The manufacturing method of the optical wiring board is constituted of a process in which the optical fiber wiring layer of a prescribed shape is laid on the first photosensitive resin layer, a process in which the second photosensitive resin layer is formed on the optical fiber wiring layer, a process in which selected positions of the first photosensitive resin layer and the second photosensitive resin layer are exposed and a process in which unexposed parts of the first photosensitive resin layer and the second photosensitive resin layer are removed.

48. 发明专利

JPH11186720A MANUFACTURING MULTILAYERED WIRING BOARD 失效
公开(公告)号：JPH11186720A
公开(公告)日：1999-07-09
申请号：JP35026997
申请日：1997-12-19
申请人： HITACHI CHEMICAL CO LTD
发明人： HATAKEYAMA SHUICHI , TAKANEZAWA SHIN , MORITA MASAKI , YAMADERA TAKASHI
IPC分类号： G03F7/32 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered wiring board which is superior in layer wiring reliability by forming high quality vias, without leaving undeveloped parts. SOLUTION: In a multilayered wiring board manufacturing method, having steps of providing a photosensitive insulation resin layer on an inner layer conductors formed on an insulation board, making the exposure and developing via a photo tool to form vias, circuit-working including the plating of the surface of the photosensitive insulation resin layer to form a conductor wiring, developing with the use of a developing soln. contg. inorg. or org. filler pref. having a means grain size of 0.02-70 μm.

49. 发明专利

JPH11103175A PRODUCTION OF MULTILAYER WIRING BOARD EMPLOYING THERMOSETTING OR UV-CURABLE RESIN COMPOSITION 失效
公开(公告)号：JPH11103175A
公开(公告)日：1999-04-13
申请号：JP21549098
申请日：1998-07-30
申请人： HITACHI CHEMICAL CO LTD
发明人： TAKANEZAWA SHIN , MORITA MASAKI , TAKEUCHI KAZUMASA , YAMADERA TAKASHI , HATAKEYAMA SHUICHI
IPC分类号： H05K3/46 , C08K5/3415 , C08K5/3437 , C08L21/00 , C08L61/06 , C08L61/28 , C08L79/00 , C08L101/00
摘要： PROBLEM TO BE SOLVED: To provide a heat resistant insulation layer in which a maleimide compound is UV-curable and thermosetting at low temperature by employing a resin composition containing specified quantity of a bismaleimide compound, other resin component, and a thermosetting accelerator or a UV-curing starting agent, i.e., an acrydine compound represented by a specified structural formula, in the insulation layer. SOLUTION: A thermosetting or UV-curable resin compound containing (A) 5-90 wt.% of bismaleimide compound, (B) 10-95 wt.% of other resin component and (C) 0.1-30 pts.wt. of an acrydine compound, i.e., a thermosetting accelerator or a UV-curing starting agent, represented by formula I or II for total 100 pts.wt. of (A) and (B) is employed in the insulation layer of a multilayer wiring board. In the formula I, R2 , R3 , R4 , R5 , R6 , R7 , R8 and R9 represents, independently, hydrogen, halogen, alkyl group or alkoxy group of 1-8C, and R1 represents alkyl group of 1-8C. In the formula II, R10 represents alkylene group of 1-12C. An insulation layer thus obtained is excellent in heat resistance and employed for production of a multilayer wiring board.

50. 发明专利

JPH10163629A MANUFACTURE OF MULTI-LAYER PRINTED WIRING BOARD 失效
公开(公告)号：JPH10163629A
公开(公告)日：1998-06-19
申请号：JP31836596
申请日：1996-11-28
申请人： HITACHI CHEMICAL CO LTD
发明人： FUKAI HIROYUKI , HAMA MASAYUKI , TAKANEZAWA SHIN
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To omit a plating pretreatment, by forming a multi-layer by repeating such process as a via hole is formed on an insulation layer comprising a plating catalyser on an insulation substrate where the first circuit layer is already formed and then copper is plated on the surface of insulation layer and on the inside wall of via hole, in this order. SOLUTION: An insulation layer 3 comprising a plating catalyst is formed (b) on an insulation substrate 2 where the first circuit layer 1 is already formed (a), and a via hole 4 for connecting the first circuit layer 1 and the second circuit layer 5 together is formed on an insulation layer 3 (c). The second circuit layer 5 is formed in the same manner as the first circuit layer 1 (e), to provide a 3-layer printed wiring board comprising a power source layer and/or a ground layer G, the first circuit layer 1, and the second circuit layer 5. For further multiplication in layers, processes starting with formation of insulation layer, (b)-(e), are repeated. As a result, a plating pretreatment can be omitted, thus the cost for multi-layer printed wiring boards by build-up method is significantly reduced.

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