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41. 发明专利

JP2012222340A Layered chip package and method of manufacturing same 有权
标题翻译：层状芯片包装及其制造方法
公开(公告)号：JP2012222340A
公开(公告)日：2012-11-12
申请号：JP2011241855
申请日：2011-11-04
申请人： Headway Technologies Inc , Sae Magnetics(H K )Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , IKEJIMA HIROSHI , IIJIMA ATSUSHI
IPC分类号： H01L25/065 , H01L23/52 , H01L25/07 , H01L25/18
CPC分类号： H01L21/561 , H01L23/3121 , H01L24/24 , H01L24/82 , H01L24/92 , H01L24/94 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/19 , H01L2224/24145 , H01L2224/32145 , H01L2224/73267 , H01L2224/94 , H01L2224/97 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06565 , H01L2225/1035 , H01L2225/1058 , H01L2924/07802 , H01L2924/12042 , H01L2924/18162 , H01L2924/00 , H01L2224/03 , H01L2224/83 , H01L2224/82 , H01L2224/83005
摘要： PROBLEM TO BE SOLVED: To easily implement a package capable of providing, even if it includes a malfunctioning semiconductor chip, the same functions as those in the case where no malfunctioning semiconductor chip is included.SOLUTION: A layered chip package 1M includes a main body 2 and wiring 3. The main body 2 includes a main part 2M including a plurality of stacked layer portions, and a plurality of terminals disposed on the top and bottom surfaces of the main part 2M. The wiring 3 includes a plurality of lines (wires W) connected to the plurality of terminals. The plurality of lines includes a plurality of common lines and a plurality of layer-dependent lines. Each of the plurality of layer portions includes: a plurality of common electrodes connected to the plurality of common lines; a plurality of non-contact electrodes that are connected to the plurality of layer-dependent lines and are not in contact with a semiconductor chip in the layer portion; and a selective connection electrode selectively connected to only the layer-dependent line that the layer portion uses among the plurality of layer-dependent lines. The layer-dependent lines are greater than the common lines in maximum width.
摘要翻译：要解决的问题：即使包括故障半导体芯片，也能够容易地实现能够提供与包含故障半导体芯片的情况相同的功能。解决方案：层叠芯片封装1M包括主体2和布线3.主体2包括：主体部分2M，包括多个堆叠层部分;多个端子，设置在该主体部分的顶表面和底表面上主要部分2M。布线3包括连接到多个端子的多条线（布线W）。多条线包括多个公共线和多个依赖于层的线。多个层部分中的每一个包括：多个公共电极，连接到多个公共线; 多个非接触电极，其连接到所述多个层相关线并且不与所述层部分中的半导体芯片接触; 以及选择性连接电极，其仅选择性地连接到所述层部分在所述多个层相关线中使用的与层相关的线。层相关线大于最大宽度的公共线。版权所有（C）2013，JPO＆INPIT

42. 发明专利

JP2012178207A Magnetic head for perpendicular magnetic recording that includes sensor for detecting contact with recording medium 有权
标题翻译：用于磁记录的磁头包括用于用记录介质检测接触的传感器
公开(公告)号：JP2012178207A
公开(公告)日：2012-09-13
申请号：JP2011200204
申请日：2011-09-14
申请人： Headway Technologies Inc , Sae Magnetics(H K )Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , SATO KAZUKI , IIJIMA ATSUSHI
IPC分类号： G11B5/31 , G11B21/21
CPC分类号： G11B5/40 , G11B5/11 , G11B5/1278 , G11B5/3116 , G11B5/314 , G11B5/315 , G11B5/607 , G11B5/6076
摘要： PROBLEM TO BE SOLVED: To enable control of the distance between a playback head unit and a recording head unit and the surface of a recording medium, and detection of contact of a part of the medium facing surface with the recording medium, without interruption of protrusion of the part of the medium facing surface.SOLUTION: A magnetic head includes a playback head unit 8, a recording head unit 9, heaters 82, 92, an expansion layer 84 that makes part of a medium facing surface 2 protrude, and a sensor 85 that detects contact of the part of the medium facing surface 2 with the recording medium. The recording head unit 9 includes a main magnetic pole 15, a recording shield 16, and a return magnetic path section 30. The return magnetic path section 30 includes a yoke layer 31 located on the rear side in a direction of movement of the recording medium relative to the main magnet pole 15, a first coupling part 32 that couples the yoke layer 31 and the recording shield 16 to each other, and a second coupling part 35 that is located away from the medium facing surface 2 and couples the yoke layer 31 and the main magnetic pole 15 to each other.
摘要翻译：要解决的问题：为了能够控制回放头单元与记录头单元之间的距离和记录介质的表面，以及检测介质面向表面的一部分与记录介质的接触，没有中断面向介质表面的部分突出。解决方案：磁头包括重放头单元8，记录头单元9，加热器82,92，使面向介质的表面2的一部分突出的扩展层84和检测到接触的传感器85 介质面2的一部分与记录介质。记录头单元9包括主磁极15，记录屏蔽16和返回磁路部分30.返回磁路部分30包括位于记录介质的移动方向的后侧的磁轭层31 相对于主磁极15，将轭铁层31和记录屏蔽16彼此连接的第一耦合部分32和位于远离介质相对表面2并耦合轭铁层31的第二耦合部分35 和主磁极15彼此。版权所有（C）2012，JPO＆INPIT

43. 发明专利

JP2012178195A Piezoelectric element, manufacturing method thereof and head gimbal assembly mounted with the piezoelectric element 有权
标题翻译：压电元件，其制造方法和头部组件与压电元件安装
公开(公告)号：JP2012178195A
公开(公告)日：2012-09-13
申请号：JP2011040095
申请日：2011-02-25
申请人： Tdk Corp , Sae Magnetics(H K )Ltd , Tdk株式会社 , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI HIROFUMI , SUGA TAKESHI , MAEJIMA KAZUHIKO
IPC分类号： G11B21/21 , G11B21/10 , H01L41/18 , H01L41/187 , H01L41/22
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric element whose reliability is improved by suppressing the occurrence of a crack in a piezoelectric film, a manufacturing method thereof, and a head gimbal assembly mounted with the piezoelectric element.SOLUTION: In a piezoelectric actuator 40 relating to this invention, a boundary B between a first protective film 314 and a second protective film 315 on the protective film 314 formed in one direction of a piezoelectric part 310 is in the shape of a circular arc, and the entire boundary is a curved part. In the case that the boundary B has the curved part in this way, when the piezoelectric actuator 40 is handled, for example, when the piezoelectric actuator 40 is mounted on a suspension 22, the concentration of bending stress near the boundary B is relaxed in comparison with when the boundary B is in the shape of a straight line. In the result, the damage of a piezoelectric film 311 near the boundary B is significantly reduced to suppress the occurrence of a crack so that the reliability of the piezoelectric actuator 40 can be improved.
摘要翻译：要解决的问题：提供一种通过抑制压电膜中的裂纹的发生而提高可靠性的压电元件，其制造方法和安装有压电元件的头部万向节组件。解决方案：在本发明的压电致动器40中，形成在压电部件310的一个方向上的保护膜314上的第一保护膜314和第二保护膜315之间的边界B为圆弧，整个边界是弯曲部分。在边界B以这种方式具有弯曲部分的情况下，例如当压电致动器40被安装在悬架22上时，当压电致动器40被处理时，边界B附近的弯曲应力的集中被放宽当边界B处于直线的形状时进行比较。结果，边界B附近的压电膜311的损伤显着减小，以抑制裂缝的发生，从而能够提高压电致动器40的可靠性。版权所有（C）2012，JPO＆INPIT

44. 发明专利

JP2012156478A Memory device and method of manufacturing the same 有权
标题翻译：存储器件及其制造方法
公开(公告)号：JP2012156478A
公开(公告)日：2012-08-16
申请号：JP2011176676
申请日：2011-08-12
申请人： Headway Technologies Inc , Sae Magnetics(H K )Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , IIJIMA ATSUSHI
IPC分类号： H01L25/065 , H01L23/52 , H01L25/07 , H01L25/18
CPC分类号： H01L25/18 , H01L23/49811 , H01L24/96 , H01L25/0657 , H01L25/50 , H01L2224/94 , H01L2225/0651 , H01L2225/06513 , H01L2225/06551 , H01L2225/06572 , H01L2924/07802 , H01L2924/14 , H01L2224/03 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a memory device having a configuration of high enough versatility to surely ensure connection to the outside irrespective of the size of a controller chip and a multilayer chip package, and a method of manufacturing the memory device.SOLUTION: A memory device 140 includes a multilayer chip package 90 and a controller plate 110. A plurality of memory chips 50 are stacked one upon another in the multilayer chip package 90. An interposed chip 51 is stacked between the multilayer chip package 90 and the controller plate 110. A plurality of opposing wiring electrodes 113 are formed on opposing surfaces of the controller plate 110. A plurality of outside wiring electrodes 112 are formed on the rear sides of the opposing surfaces. The interposed chip 51 includes a plurality of interposed wiring electrodes. The plurality of interposed wiring electrodes are formed by a common arrangement pattern.
摘要翻译：要解决的问题：提供具有足够高通用性的配置的存储器件，以及确保与外部的连接，而不管控制器芯片和多层芯片封装的尺寸如何，以及制造存储器件的方法。解决方案：存储器件140包括多层芯片封装90和控制器板110.多层存储器芯片50在多层芯片封装90中彼此堆叠。插入的芯片51堆叠在多层芯片封装 90和控制板110.多个相对的布线电极113形成在控制板110的相对表面上。多个外部布线电极112形成在相对表面的后侧。插入的芯片51包括多个插入的布线电极。多个插入的布线电极通过公共布置图形形成。版权所有（C）2012，JPO＆INPIT

45. 发明专利

JP2012142063A Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive 有权
标题翻译：薄膜磁头，其制造方法，头部组件和硬盘驱动
公开(公告)号：JP2012142063A
公开(公告)日：2012-07-26
申请号：JP2011157436
申请日：2011-07-19
申请人： Headway Technologies Inc , Sae Magnetics(H K )Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , SATO KAZUKI , IIJIMA ATSUSHI
IPC分类号： G11B5/31
CPC分类号： G11B5/1278 , G11B5/3123 , G11B5/4853 , Y10T29/49021
摘要： PROBLEM TO BE SOLVED: To reduce the electric resistance of a thin-film coil within a restriction range of the read/write separation without increasing the magnetic path length and suppress protrusion of a part of the ABS.SOLUTION: A thin-film magnetic head 300 is constructed such that a main magnetic pole layer 26, a write shield layer 60, a gap layer 27, a lower thin-film coil 10, and an upper thin-film coil 55 are laminated on a substrate 1. The lower thin-film coil 10 has a first coil layer 11 and a second coil layer 12. The first coil layer 11 has turn parts 11e, 11c. In the first coil layer 11, magnetic pole corresponding parts 11e1, 11c1 corresponding to an arrangement space of the main magnetic pole layer 26 are thinner than magnetic pole non-corresponding parts 11e2, 11c2 other than the magnetic pole corresponding parts.
摘要翻译：要解决的问题：为了在读/写分离的限制范围内减小薄膜线圈的电阻，而不增加磁路长度并抑制ABS的一部分的突出。解决方案：薄膜磁头300被构造成使得主磁极层26，写入屏蔽层60，间隙层27，下部薄膜线圈10和上部薄膜线圈55 层叠在基板1上。下部薄膜线圈10具有第一线圈层11和第二线圈层12.第一线圈层11具有转向部11e，11c。在第一线圈层11中，与主磁极层26的配置空间对应的磁极对应部11e1,11c1比磁极对应部分以外的磁极非对应部11e2,11c2薄。版权所有（C）2012，JPO＆INPIT

46. 发明专利

JP2014215607A 光モジュールパッケージ有权
标题翻译：光学模块封装
公开(公告)号：JP2014215607A
公开(公告)日：2014-11-17
申请号：JP2013116961
申请日：2013-06-03
申请人：新科實業有限公司SAE Magnetics(H.K.)Ltd. , Sae Magnetics(H K )Ltd , 新科實業有限公司SAE Magnetics(H.K.)Ltd. , 東莞新科技術研究開発有限公司SAE Technologies Development Dongguan Co.,Ltd. , Sae Technologies Development Dongguan Co Ltd , 東莞新科技術研究開発有限公司SAE Technologies Development Dongguan Co.,Ltd.
发明人： FUKAYA HIROSHI , LIANG NAIKANG
IPC分类号： G02B6/30
CPC分类号： G02B6/30
摘要：【課題】ファイバユニットを接着剤や樹脂を用いてハウジングに固定する必要がなく、しかも、光ファイバをチューブ状の部材に挿通することなく製造できるようにして製造に要する手間や時間を軽減する。【解決手段】光モジュールパッケージ200はハウジング本体1、カバー体2、第1、第2の保持部材10,30およびファイバユニット9を有する。第1、第2の保持部材10,30は直接対向状態において、ファイバユニット9の外形寸法に応じたユニット収容部を内側に形成する。ハウジング本体1は、第1、第2の保持部材10,30の外表面であって、互いに対向するように配置された2つの対向表面の配置間隔に設定された係止突起4、4、3、3を有し、係止突起4、4、3、3に挟まれたスペースが第1、第2の保持部材10,30の収容スペース16に設定されている。【選択図】図1
摘要翻译：要解决的问题：通过消除将纤维单元固定到具有粘合剂或树脂的壳体的需要以及需要将光纤插入管状构件中，来减少制造光学模块封装的工作量和时间长度。解决方案：光学模块封装 200具有壳体1，盖体2，第一保持构件10和第二保持构件30以及纤维单元9.根据本发明的第一和第二保持构件10和30以直接相对的状态形成在单元容纳空间内纤维单元9的外部尺寸。壳体1具有接合突起4,4,3，其布置成在第一和第二保持构件10和30的外表面上以两个相对的间隔表面，并且接合突起4和4与接合突起3和3之间的间隔设置成形成用于第一和第二保持构件10和30的容纳空间16。

47. 发明专利

JP2014106985A Manufacturing method of head gimbal assembly, manufacturing method of flexure constituting head gimbal assembly, and flexure sheet used for manufacturing of head gimbal assembly and flexure 有权
标题翻译：头部组件的制造方法，挠性构件头组件的制造方法以及用于制造头部组件和弯曲件的挠曲片
公开(公告)号：JP2014106985A
公开(公告)日：2014-06-09
申请号：JP2012257267
申请日：2012-11-26
申请人： Sae Magnetics(H K )Ltd , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： YAMANOI KOYU
IPC分类号： G11B21/10 , G11B21/21
摘要： PROBLEM TO BE SOLVED: To enhance accuracy of commonality in respective operation performances of a pair of piezoelectric elements, and to make the piezoelectric elements maintain the same operation performance.SOLUTION: When manufacturing a head gimbal assembly (HGA) 1, at first, in a flexure manufacturing step, a pair of piezoelectric element parts are bonded to the surface of a base insulation layer on a flexure substrate, and a flexure 6 of a structure with piezoelectric elements is manufactured; next, in a suspension manufacturing step, the flexure 6 is connected to a load beam 3 and a base plate 2, and thereby a suspension 50 is manufactured; and then, in a slider attachment step, a head slider 60 is attached to the suspension 50. Consequently, the HGA 1 can be manufactured.
摘要翻译：要解决的问题：提高一对压电元件的各自的操作性能的通用性的精度，并且使压电元件保持相同的操作性能。解决方案：当制造头万向架组件（HGA）1时，首先，弯曲制造步骤，将一对压电元件部分粘接到挠曲基板上的基底绝缘层的表面，并制造具有压电元件的结构的挠曲件6; 接下来，在悬架制造工序中，挠曲件6连接到负载梁3和基板2，由此制造悬架50; 然后，在滑块安装步骤中，磁头滑块60附接到悬架50上。因此，可以制造HGA 1。

48. 发明专利

JP2014035785A Magnetic head for vertical magnetic recording including main magnetic pole and shield 有权
标题翻译：用于垂直磁记录的磁头，包括主磁极和屏蔽
公开(公告)号：JP2014035785A
公开(公告)日：2014-02-24
申请号：JP2013150289
申请日：2013-07-19
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド , Sae Magnetics(H K )Ltd , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , SATO KAZUKI , ARAKI HIRONORI , TANEMURA SHIGEKI , SHIMIZU TATSUYA
IPC分类号： G11B5/31
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3146 , G11B5/315
摘要： PROBLEM TO BE SOLVED: To provide a magnetic head for vertical magnetic recording capable of preventing a problem caused from a skew without degrading the function of recording shield while increasing the recording performance.SOLUTION: A main magnetic pole 15 includes a slant portion in a lower end portion 15L. A recording shield 16 has a first slant plane 16Bb facing to the slant portion and a second slant plane 16Bc located being separated away from a medium-facing plane 80 further than the first slant plane 16Bb. The first slant plane 16Bb has a first end disposed on the medium-facing plane 80 and a second end opposite thereto. The second slant plane 16Bc has a third end connected to the second end and a fourth end opposite thereto. The second slant plane 16Bc has an angle formed by the medium-facing plane 80 with respect to a vertical direction larger than that of the first slant plane 16Bb. The distance between any position on the second slant plane 16Bc and the main magnetic pole 15 gets larger as the any position gets closer to the fourth end.
摘要翻译：要解决的问题：提供一种用于垂直磁记录的磁头，其能够在增加记录性能的同时，防止由偏斜引起的问题而不降低记录屏蔽的功能。解决方案：主磁极15包括下部的倾斜部分端部15L。记录屏蔽件16具有面向倾斜部分的第一倾斜平面16Bb和位于远离第一倾斜平面16Bb的中间平面80分开的第二倾斜平面16Bc。第一倾斜面16Bb具有设置在面向介质的平面80上的第一端和与其相对的第二端。第二斜面16Bc具有连接到第二端的第三端和与其相对的第四端。第二倾斜面16Bc具有相对于比第一倾斜面16Bb大的垂直方向由介质面向平面80形成的角度。随着任何位置越靠近第四端，第二倾斜平面16Bc上的任何位置与主磁极15之间的距离越大。

49. 发明专利

JP2013258395A Thin film piezoelectric element, manufacturing method of thin film piezoelectric element, microactuator, head gimbal assembly, and disk driving device including head gimbal assembly 有权
标题翻译：薄膜压电元件，薄膜压电元件的制造方法，微处理器，头部组件和包括头部组件的盘驱动装置
公开(公告)号：JP2013258395A
公开(公告)日：2013-12-26
申请号：JP2013084961
申请日：2013-04-15
申请人： Sae Magnetics(H K )Ltd , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： KUMA ISAMU , PANJALAK ROKRAKTHONG , HATA KENJIRO , NISHIYAMA KAZUSHI , IIZUKA DAISUKE , IIJIMA ATSUSHI
IPC分类号： H01L41/09 , G11B21/10 , G11B21/21 , H01L41/187 , H01L41/316
摘要： PROBLEM TO BE SOLVED: To provide a thin film piezoelectric element, a manufacturing method of the thin film piezoelectric element, a microactuator, a head gimbal assembly, and a disk driving device including the head gimbal assembly.SOLUTION: A thin film piezoelectric element 200 includes: a substrate 201; and a piezoelectric thin film lamination part 210 formed on the substrate 201. The piezoelectric thin film lamination part 210 includes: an upper electrode layer 214; a bottom electrode layer 211; and a piezoelectric layer sandwiched between the upper electrode layer 214 and the bottom electrode layer 211. The piezoelectric layer includes a first piezoelectric layer 212 and a second piezoelectric layer 213, has a phase structure where the compositions of the first piezoelectric layer 212 and the second piezoelectric layer 213 are different, and acquires a high piezoelectric constant, improved strength of a coercive force, and good thermal stability. Thus, a stronger electric field may be applied without causing depolarization and a larger stroke is achieved.
摘要翻译：要解决的问题：提供薄膜压电元件，薄膜压电元件的制造方法，微致动器，头万向架组件和包括头部万向节组件的盘驱动装置。解决方案：薄膜压电元件200 包括：基板201; 以及形成在基板201上的压电薄膜叠层部分210.压电薄膜叠层部分210包括：上电极层214; 底部电极层211; 以及夹在上电极层214和底电极层211之间的压电层。压电层包括第一压电层212和第二压电层213，具有第一压电层212和第二压电层213的组成的相位结构压电层213不同，获得高的压电常数，提高矫顽力的强度和良好的热稳定性。因此，可以施加更强的电场而不引起去极化，并且实现更大的行程。

50. 发明专利

JP2013257931A Magnetic head for perpendicular magnetic recording having return magnetic path part 有权
标题翻译：具有返回磁路部分的磁性记录磁头
公开(公告)号：JP2013257931A
公开(公告)日：2013-12-26
申请号：JP2013010384
申请日：2013-01-23
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド , Sae Magnetics(H K )Ltd , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , SATO KAZUKI , TOMITA SEIICHIRO , ARAKI HIRONORI , SHIMIZU TATSUYA
IPC分类号： G11B5/31
CPC分类号： G11B5/17 , G11B5/1278 , G11B5/3116 , G11B5/3123
摘要： PROBLEM TO BE SOLVED: To generate a sufficiently large recording magnetic field from a main pole while shortening the length of a return magnetic path part arranged on a front side in an advancing direction of a recording medium with respect to the main pole.SOLUTION: A magnetic head includes first and second coils 11, 12, a main pole 15, a recording shield 16, a return magnetic path part 40, and a core part 71. The return magnetic path part 40 has a yoke part 41 connected to the recording shield 16, and a connection part 42 arranged at a position away from a medium opposite face 80 to connect the yoke part 41 and the main pole 15. The first coil 11 is arranged at a front side in an advancing direction of a recording medium with respect to the main pole 15 to be wound around the connection part 42. The core part 71 is arranged at a position farther from the medium opposite face 80 with respect to the connection part 42 to be connected to the main pole 15. The second coil 12 is arranged at a front side in an advancing direction of the recording medium with respect to the main pole 15 to be wound around the core part 71.
摘要翻译：要解决的问题：为了从主极产生足够大的记录磁场，同时缩短布置在记录介质相对于主极的前进方向上的前侧上的返回磁路部分的长度。解决方案：A 磁头包括第一和第二线圈11,12，主极15，记录屏蔽16，返回磁路部分40和芯部71.返回磁路部分40具有连接到记录屏蔽的磁轭部分41 16和布置在远离介质相对面80的位置处的连接部42，以连接轭部41和主极15.第一线圈11相对于记录介质的前进方向布置在前侧连接到主极15上。芯部71相对于连接部42配置在与介质相对面80更远的位置，与主极15连接。第二线圈12 被安排在记录介质的相对于主极15的前进方向上的前侧被缠绕在芯部71上。

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