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    • 46. 发明专利
    • FILLING METHOD OF METAL INTO CERAMIC BOARD AND METAL- FILLED CERAMIC BOARD
    • JP2000294923A
    • 2000-10-20
    • JP8144399
    • 1999-03-25
    • JGC CORP
    • MURATA TAKEOTANABE HAJIME
    • H05K1/11H05K3/40
    • PROBLEM TO BE SOLVED: To fill a metal into a through-hole in a ceramic board through an economical process, without the need for complicated operations and to realize high density and high performance of a board circuit. SOLUTION: A ceramic board 10 in which a through-hole is formed and a metal plate to which an activation treatment is not executed are pasted by a screw or the like to form a laminated object. The laminated object is immersed in an electroplating liquid. Electroplating treatment is executed on the metal plate, which is exposed in the bottom part of the through-hole. The metal is precipitated on the inside of the through-hole so as to be filled into the inside of the through-hole. At this time, by having a filling metal 11 grow by the thickness portion of the ceramic board 10, the ceramic board is polished, and a metal-filled ceramic board which is flat is obtained. In addition, by having the filling metal 11 grow so as to form a gap part 12 inside the through-hole, e.g. a semiconductor element can be embedded in the gap part 12, and planarization of a circuit can be made.