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31. 发明专利

JP2004099938A Barrel plating device and method 审中-公开
标题翻译： BARREL镀层器件和方法
公开(公告)号：JP2004099938A
公开(公告)日：2004-04-02
申请号：JP2002260387
申请日：2002-09-05
申请人： Koa Corp , コーア株式会社
发明人： MATSUSHITA KATSUMI
IPC分类号： C25D17/20 , C25D17/12
摘要： PROBLEM TO BE SOLVED: To provide a barrel plating device and a barrel plating method in which plating of high quality and high efficiency can be performed by improving a current density and a current distribution inside a plating bath.
SOLUTION: In the barrel plating device where the inside of a plating bath with an anode 14 dipped is provided with a cylindrical barrel 11 housing a stock to be plated together with cathodes 13, and the barrel 11 is rotated to apply plating to the stock, the cathodes 13 are plurally branched inside the barrel 11. Namely, vertical connection electrodes 17 are erected at the tip parts 13c of the cathodes 13, and further, a plurality of branched electrodes 18 parallel to the rotary axis of the barrel 11 are connected to the connection electrodes 17, so that the cathodes 13 are formed so as to be of plurally branched comb teeth shape.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种通过提高电镀液中的电流密度和电流分布可以进行高质量和高效率的电镀的滚镀装置和滚镀方法。解决方案：在浸渍有阳极14的电镀槽内部设置有圆筒形筒11的桶式电镀装置中，该圆筒形筒11容纳要与阴极13电镀在一起的原料，并且使筒11旋转以施加电镀阴极13在筒体11内多个分支。即，垂直连接电极17竖立在阴极13的尖端部分13c处，此外，多个分支电极18平行于筒体11的旋转轴线连接到连接电极17，使得阴极13形成为多分支梳齿形状。版权所有（C）2004，JPO

32. 发明专利

JP3393165B2 失效
公开(公告)号：JP3393165B2
公开(公告)日：2003-04-07
申请号：JP32536894
申请日：1994-12-27
IPC分类号： C25D17/20

33. 发明专利

JP2003073897A Barrel equipment 有权
标题翻译： BARREL设备
公开(公告)号：JP2003073897A
公开(公告)日：2003-03-12
申请号：JP2001262981
申请日：2001-08-31
申请人： Yamaguchi Seisakusho:Kk , 株式会社山口製作所
发明人： YAMAGUCHI JUJI
IPC分类号： C25D17/20
摘要： PROBLEM TO BE SOLVED: To provide a barrel equipment, which can discharge gas gathered in an accommodation space of a barrel body to outside of the barrel body.
SOLUTION: This barrel equipment 30 is characterized by including a retention tank 90 for retaining a treatment liquid 93 for plating an article to be treated 92; the barrel body 32, which has a closed accommodation space 38 therein, that is communicated with the outside through several holes 36 through which the article to be treated 92 cannot pass, for accommodating the article to be treated 92, and which is partially immersed in the treatment liquid 93 retained in a retention bath 90; and a liquid spouting means 50 for intermittently spouting the treatment liquid 93 in the outside of the barrel body 32, to a first area 95 which is located in the upper part than a liquid level 94 of the treatment liquid 93 in the accommodation space 38 of the barrel body 32. Thereby, the barrel equipment 30 can powerfully discharge the gas, which is gathered in the accommodation space 38 of the barrel body 32 and includes hydrogen gas generating in plating treatment, through the holes 36 to the outside.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种桶装置，其可以将在桶体的容纳空间中聚集的气体排出到筒体的外部。解决方案：该桶设备30的特征在于包括：保持罐90，用于保持用于电镀待处理物品92的处理液体93; 其中具有封闭的容纳空间38的筒体32通过若干孔36与外部连通，待处理物体92不能通过该孔36，用于容纳待处理物件92的部分，并且部分地浸入保留在保留浴90中的处理液93; 以及液体喷射装置50，用于将处理液体93间歇地喷射到筒体32的外部，到位于上部的第一区域95，比处理液体93在容纳空间38中的处理液体93的液面94 因此，桶装置30可以强力地排出收集在筒体32的容纳空间38中的气体，并且包括通过孔36向外部产生电镀处理的氢气。

34. 发明专利

JP2002363795A BARREL PLATING APPARATUS 失效
公开(公告)号：JP2002363795A
公开(公告)日：2002-12-18
申请号：JP2001167983
申请日：2001-06-04
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAMOTO HAJIME
IPC分类号： C25D17/20 , C25D21/08 , C25D21/10 , C25D21/20
摘要： PROBLEM TO BE SOLVED: To provide a barrel plating apparatus having a compact structure, in which agitation and distribution of a plating solution are secured even when small size articles are plated, and with which a high quality plated film having a uniform thickness can be obtained. SOLUTION: The barrel plating apparatus has a plating tank 1 in which the plating solution 5 is easily fed and discharged, and a barrel 3 which is equipped with a shaft A2 and a shaft B9 arranged freely turnably to the plating tank 1 in a contact state and which accommodates articles 4 to be plated and immerses the articles 4 to be plated in the plating solution 5 in the plating tank 1. In the barrel plating apparatus, air is supplied into the barrel 3 through a central part of the shaft A2 from an air supplying source provided at the outside.

35. 发明专利

JP2002235200A BARREL UNIT FOR PLATING CHIP PARTS 失效
公开(公告)号：JP2002235200A
公开(公告)日：2002-08-23
申请号：JP2001029304
申请日：2001-02-06
申请人： TDK CORP
发明人： MORI KANEO , KONNO MASAHIKO , ONODERA AKIRA , KUDO JUN , SAKURAI TAKASHI
IPC分类号： C25D17/20 , H01G4/12 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To secure reliability in electrical contact between a power feeding rail and a collector, to suppress the generation of large friction resistance of the collector to the power feeding rail and to easily upraise a barrel unit from a plating bath even when the barrel unit is temporarily needed to be upraised and taken out of the plating bath. SOLUTION: The barrel unit is provided with a barrel 42 for accommodating chip parts and a medium, an electrode structure 61 having an internal electrode electrically contacting with the chip parts and the medium accommodated in the barrel 42 and the collector 72 formed by driving the electrode structure 61 to the outside of the barrel 42. The power feeding rail 91 has a contact part at its upper side and provided at the plating bath side, and the collector 72 has a contact part at its downside, and the collector 72 is mounted on the power feeding rail 91.

36. 发明专利

JP3316750B2 失效
公开(公告)号：JP3316750B2
公开(公告)日：2002-08-19
申请号：JP33976698
申请日：1998-11-30
IPC分类号： H01G4/12 , C25D17/16 , C25D17/20

37. 发明专利

JP3265948B2 失效
公开(公告)号：JP3265948B2
公开(公告)日：2002-03-18
申请号：JP27932395
申请日：1995-10-26
IPC分类号： C25D17/20 , H01G4/12 , H01G4/252 , H01G13/00

38. 发明专利

JP3241990B2 失效
公开(公告)号：JP3241990B2
公开(公告)日：2001-12-25
申请号：JP1186996
申请日：1996-01-26
IPC分类号： C25D17/20

39. 发明专利

JP2001342598A BARREL MATERIAL FOR PLATING, BARREL AND BARREL MANUFACTURING PROCESS 失效
公开(公告)号：JP2001342598A
公开(公告)日：2001-12-14
申请号：JP2000163291
申请日：2000-05-31
申请人： UEDA MASAYUKI
发明人： UEDA MASAYUKI
IPC分类号： C25D17/20
摘要： PROBLEM TO BE SOLVED: To provide a process for forming a barrel material and barrel without making holes, by mounting a cross material having small holes on a frame material. SOLUTION: The process comprises forming the barrel material 2, by mounting a cross material having many holes 6 through which the plating liquid can flow, on the frame material 5 made from a resin having windows through which the plating liquid can flow, so as to cover the windows; and forming a main barrel body 3 having a slot for works to be plated, by bending the barrel material 2.

40. 发明专利

JP3236250B2 失效
公开(公告)号：JP3236250B2
公开(公告)日：2001-12-10
申请号：JP25649697
申请日：1997-09-22
IPC分类号： C25D17/20

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