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31. 发明专利

JP2000151094A METHOD AND SYSTEM OF DISASSEMBLING PRINTED CIRCUIT BOARD 失效
公开(公告)号：JP2000151094A
公开(公告)日：2000-05-30
申请号：JP32460498
申请日：1998-11-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FURUSAWA AKIO , FUKUSHIMA TETSUO , NAKAI SHOJI , SUETSUGU KENICHIRO , WADA YOSHINORI
IPC分类号： B23K1/018 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To realize a method of disassembling a printed circuit board by which electronic parts are recovered under a good condition that they are able to be recycled, when disassembling efficiently a double-sided mounted printed circuit board. SOLUTION: A printed circuit board 7 mounted with electronic parts is placed vertically, its end is chucked, and it is put into a heating area 51. Then, the solder of soldered sections on a board is melted down. An end 31 of a blade 27 positioned and fixed is abutted on the surface of the board 7 in vertical condition. In this state, the electronic part (62) is removed with the blade 27 pulling the board 7 out of the heating area 51.

32. 发明专利

JP2000079464A PORTABLE ELECTRIC SOLDER REMOVING TOOL 失效
公开(公告)号：JP2000079464A
公开(公告)日：2000-03-21
申请号：JP17514699
申请日：1999-06-22
申请人： COOPER IND INC
发明人： KILMER PAUL R
IPC分类号： B23K1/018 , B23K3/02 , B23K3/047 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To prevent electromagnetic interference and radio frequency interference and to reduce the consumption of the power by arraying a first rectifier in series to a heating chip, connecting a vacuum pump motor to a part of the heating chip in series, arranging a second rectifier in series to the motor and supplying current to the heating chip through the first rectifier when the power is not supplied to the motor. SOLUTION: When solder is dissolved, current is supplied to a heater (heating element) 34 of a heating chip through only a diode (half wave rectifier) 36. When a trigger switch 38 is activated, a low voltage vacuum pump motor (DC pump motor) 50 is driven to generate a vacuum, and the reflow of solder is generated. The current is simultaneously made to flow to a part of a coil of the heater (heating element) 34 through a full wave bridge rectifier 71. Since the resistance of the coil is reduced, a large current is made to flow and the heat generation of the coil is increased. When the vacuum pump is operated, the heat generation of the coil is increased and whereby a temperature reduction of the heating chip is prevented.

33. 发明专利

JP3019848B1 Removal method of a semiconductor package 有权
公开(公告)号：JP3019848B1
公开(公告)日：2000-03-13
申请号：JP32377198
申请日：1998-11-13
申请人：日本電気株式会社
发明人：元治鈴木
IPC分类号： B23K1/018 , B23K3/04 , H01L21/67 , H01L21/68 , H05K3/34
摘要：【要約】【課題】本発明は、プリント配線基板のＢＧＡ／ＣＳ
Ｐタイプ半導体パッケージを容易に取り外すことのできる装置および取り外し方法を提供する。【解決手段】半導体パッケージ２の下面とプリント配線基板３との間の隙間Ｓに、はんだ接合部群４の一部分と接触して加熱溶融させかつ隙間に沿って移動可能なはんだ加熱部１を挿入し、さらにはんだ接合部群の溶融した部分に溶融部分を吸着除去するはんだ除去部５を進入させ、はんだの溶融および吸着除去が行われる。その間、吸着ツール６が半導体パッケージ２を保持し、はんだが除去されたのち半導体パッケージ２をプリント配線基板３から移動する。

34. 发明专利

JPH11147172A RESIDUAL SOLDER REMOVER IN PADDING PART ON PRINTED BOARD 失效
公开(公告)号：JPH11147172A
公开(公告)日：1999-06-02
申请号：JP31168097
申请日：1997-11-13
申请人： MEISHO KK
发明人： FURUYA HARUMI , KITAGAKI KATSUMASA
IPC分类号： B23K1/018 , B23K3/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a device which can remove remained solder at a padding part on a printed board and smoothen the printed board. SOLUTION: A gas jetting cylinder 9 including an exothermic part 8 is fixed to a bracket 7 attached to the upper front end part of a grip 6 shaped like a pistol and also, a gas suction cylinder 14 whose rostral part 14a is bent and shaped like a cap along the tip of the tapered cylinder 9 and to which a squeezing piece 15 is fixed, is freely slidably incorporated into the bracket 7. While penetrating the front end wall 16a of a transparent cylinder 16 filled with a filter 17 composed of metallic woolly material 17b under backup of a felt layer 17a held on the grip 6, the base part of the gas suction cylinder 14 on the is attached to the wall 16a. The transparent cylinder 16 and the gas jetting cylinder 9 are communicated through a gas feeding pump 13 and further, a switching valve 19 is interposed between the transparent cylinder 16 and the gas feeding pump 13 to execute the gas suction of a suction forceps 20 for taking out electronic parts too.

35. 发明专利

JPH10503429A 失效
公开(公告)号：JPH10503429A
公开(公告)日：1998-03-31
申请号：JP52893795
申请日：1995-03-20
IPC分类号： B23K1/00 , B23K1/018 , B23K31/02 , B23P6/00 , B23P11/02

36. 发明专利

JPH09181440A SOLDERED COMPONENT REMOVING METHOD AND APPARATUS 失效
公开(公告)号：JPH09181440A
公开(公告)日：1997-07-11
申请号：JP33860695
申请日：1995-12-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HAMANISHI SEIJI
IPC分类号： B23K1/018 , B23K3/02 , B23K3/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To remove soldered components quickly and minimize the thermal influence on the components themselves and chips around them by efficiently heat a nozzle and soldered components to melt the solder and adhesive agent at a high thermal efficiency. SOLUTION: Hot air at a temp. enough to melt an adhesive agent 14 and solder 13 of a soldered component 2 is fed from a nozzle 1 having a top cover 3 formed so as to cover the component 2 and its outside. The component 2 is covered with the top cover 3 to stay the hot air from the nozzle 1 between the nozzle 1 and top face of the component 2 enough to melt the solder 13 on the terminals 10 of the component 2 the heat of which melts the adhesive agent 14 whereby the component 2 is removed from a printed circuit board 11.

37. 发明专利

JP2618201B2 失效
公开(公告)号：JP2618201B2
公开(公告)日：1997-06-11
申请号：JP12936594
申请日：1994-06-10
IPC分类号： B23K1/018 , B23K3/02 , H05K3/34

38. 发明专利

JPH08309328A METHOD FOR RECOVERING RECYCLABLE MATERIAL FROM PRINTED BOARD 失效
公开(公告)号：JPH08309328A
公开(公告)日：1996-11-26
申请号：JP12149595
申请日：1995-05-19
申请人： NEC CORP
发明人： YOKOYAMA SADAHIKO , ICHI MASATOSHI
IPC分类号： B09B5/00 , B02C15/00 , B09B3/00 , B23K1/018 , C22B7/00 , H05K3/22
摘要： PURPOSE: To improve recovery efficiency by a method in which electronic parts are disassembled from a printed board to be recovered as recyclable materials, the surface of the residual printed board is ground to recover solder, and the printed board is crushed to be separated into copper, resin, etc., for recovery. CONSTITUTION: In order to recover recyclable materials from a printed board mounted with electronic parts, the electronic parts are disassembled from the board in a part disassembling process, the surface of the board is ground in the next surface grinding process, the board the surface of which is ground is crushed in a crushing process, and finally the crushed material is separated into a part containing copper largely and a part comprising a resin, a filler, etc. The material 4 to be crushed, after being crushed by a groove part 10 on a crushing table 12 and a crushing roller, is discharged to the periphery of the table 12. The crushed material entrained by an air current ascending from the periphery of the table 12 is classified by a classifier in the upper part to be taken out with the current. Besides, the crushed material is returned to the table 12 to be crushed repeatedly with the material 4 to be crushed.

39. 发明专利

JPH08505983A 失效
公开(公告)号：JPH08505983A
公开(公告)日：1996-06-25
申请号：JP51263594
申请日：1993-11-20
IPC分类号： H05K13/00 , B23K1/018 , H05K13/04

40. 实用新型

JPH0744682U 失效
公开(公告)号：JPH0744682U
公开(公告)日：1995-11-28
申请号：JP211595
申请日：1995-02-23
IPC分类号： B23K1/018 , B23K3/02 , H05K3/34

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