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31. 发明专利

JP5985641B2 多材料から構成される自由造形可能な微細部品の積層造形法有权
标题翻译：多材料构成的细组分的自由形式的可能的分层制造方法
公开(公告)号：JP5985641B2
公开(公告)日：2016-09-06
申请号：JP2014526487
申请日：2012-08-22
申请人：ディジタルメタルアーベー
发明人：オークリント,ソーブヨルン , カールストローム,エリス , ヨハンダー,ペル , スティーンステット,ヨハンナ
IPC分类号： B22F7/06 , B22F3/00 , B22F5/10 , B22F7/00 , B28B1/30 , B22F3/22 , B29C67/00
CPC分类号： B22F3/008 , A61C13/0013 , A61C13/0018 , B22F3/22 , B22F5/00 , B22F5/10 , B28B1/001 , B29C67/0081 , C22C29/12 , H05K1/0272 , H05K1/0274 , H05K3/1208 , H05K3/4667 , B22F2005/001 , B22F2999/00 , B33Y10/00 , B33Y40/00 , C22C5/06 , H05K1/0306 , H05K2201/09981 , H05K2203/0126 , H05K2203/013 , H05K2203/122

32. 发明专利

JP2013074178A Method for manufacturing wiring board with built-in component 审中-公开
标题翻译：使用内置组件制造接线板的方法
公开(公告)号：JP2013074178A
公开(公告)日：2013-04-22
申请号：JP2011212967
申请日：2011-09-28
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： SUZUKI KENJI
IPC分类号： H05K3/46 , H01L23/12 , H05K3/00
CPC分类号： H05K3/306 , H01L2224/16225 , H01L2924/1461 , H01L2924/1531 , H05K1/0218 , H05K1/0222 , H05K1/185 , H05K3/0094 , H05K3/4602 , H05K2201/0187 , H05K2201/09536 , H05K2201/0959 , H05K2201/09981 , H05K2201/10712 , H05K2203/1394 , Y10T29/49133 , Y10T29/49135 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method capable of manufacturing a wiring board with a built-in component having excellent reliability by improving adhesion between a resin-filling material and a core substrate.SOLUTION: A core substrate preparation step prepares a core substrate 11. A housing hole formation step forms a housing hole 90 on the core substrate 11. A through hole formation step forms a through hole 14. A plating layer formation step forms a plating layer 92 with respect to an inner wall surface 91 of the housing hole 90 and forms a plating layer 71 which serves as a through-hole conductor having a cavity with respect to an inner wall surface of the through hole 14. A housing step houses a component 101 in the housing hole 90. A resin filling step fills a gap between the inner wall surface 91 of the housing hole 90 and a component side 106, and the cavity with a resin filling material 93.
摘要翻译：要解决的问题：提供一种能够通过提高树脂填充材料和芯基板之间的粘附性而通过具有优异可靠性的内置部件制造布线板的方法。解决方案：核心基板准备步骤准备芯基板11.壳体孔形成步骤在芯基板11上形成容纳孔90.通孔形成步骤形成通孔14.镀层形成步骤形成电镀层92相对于容纳孔90的内壁面91形成电镀层71，电镀层71用作具有相对于通孔14的内壁面的空腔的通孔导体。在壳体孔90中的部件101.树脂填充步骤填充容纳孔90的内壁表面91和部件侧106之间的间隙以及具有树脂填充材料93的空腔。版权所有：（C ）2013，JPO＆INPIT

34. 发明专利

JP2013501214A Sensor element having an interlayer connection hole 有权
公开(公告)号：JP2013501214A
公开(公告)日：2013-01-10
申请号：JP2012522086
申请日：2010-07-14
申请人：ローベルトボツシユゲゼルシヤフトミツトベシユレンクテルハフツングRobert Bosch Gmbh
发明人：ドターヴァイヒオリヴァー , トイバーアンティエ , シュナイダーイェンス , ロイシュナートーマス , マリアコウトペトリドゥルス , レンガークリストフ , ザウアーハマーミヒャエル , ロットマンアンドレアス
IPC分类号： G01N27/409
CPC分类号： H05K3/445 , G01N27/4075 , H05K3/4061 , H05K2201/09581 , H05K2201/09981 , Y10T29/49002
摘要：本発明は、特にガスの物理的な特性を検出するためのセンサ素子、特に内燃機関の排ガスのガス成分の濃度または排ガスの温度を検出するためのセンサ素子であって、該センサ素子（２０）が、第１の固体電解質層（２１）を有しており、該第１の固体電解質層（２１）が、層間接続孔（２５）を有しており、センサ素子（２０）が、さらに、伝導エレメント（４１）を有しており、該伝導エレメント（４１）が、層間接続孔（２５）を貫いて第１の固体電解質層（２１）の上面（２１１）から第１の固体電解質層（２１）の下面（２１２）への導電的な接続部を形成しており、第１の固体電解質層（２１）が、層間接続孔（２５）内で伝導エレメント（４１）から絶縁エレメント（４２）によって電気的に絶縁されているセンサ素子に関し、層間接続孔（２５）の壁（２５１）が、面取り部（５１）を有していることを特徴としている。さらに、本発明は、センサ素子を製造するための方法に関する。

35. 发明专利

JP2012134540A Through wiring substrate manufacturing method 审中-公开
标题翻译：通过接线基板制造方法
公开(公告)号：JP2012134540A
公开(公告)日：2012-07-12
申请号：JP2012048597
申请日：2012-03-05
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： YAMAMOTO SATOSHI , HASHIMOTO HIROKAZU
IPC分类号： H05K3/00 , H05K3/40
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0272 , H05K1/115 , H05K3/101 , H05K3/42 , H05K2201/09245 , H05K2201/09845 , H05K2201/09981 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a through wiring substrate manufacturing method capable of electrically connecting electrodes between mounted devices at a high degree of freedom, even in a small device, in which electrode arrangement of devices mounted on both faces of a through wiring substrate is various and highly dense.SOLUTION: A through wiring substrate comprises a substrate 11 having a first face and a second face; and a plurality of through wires 12a, 12b formed by filling or depositing a conductive substance 27 in a through hole penetrating between a first face 1 and a second face 2. The through wires are separated from each other, and have at least one overlaid portion when seen from a plane of the substrate. The through wiring substrate manufacturing method includes: a step A for reforming a region, in which through holes are formed, by radiating lasers from the first face side or the second face side of the substrate; and a step B for forming the through holes by removing the reformed region. In the step A, after the overlaid portion farther from an incident face of the laser is irradiated with lasers among the plural through hole formation regions, the overlaid portion nearer the incident face of the laser is irradiated with lasers.
摘要翻译：解决的问题：为了提供能够以高自由度将安装的器件之间的电极电连接的贯通配线基板的制造方法，即使在小型器件中，其中安装在通孔的两面上的器件的电极布置接线基板是各种高密度的。解决方案：通过布线基板包括具有第一面和第二面的基板11; 以及通过在第一面1和第二面2之间的通孔内填充或沉积导电物质27而形成的多根贯通金属丝12a，12b。贯通金属丝相互分离，并具有至少一个重叠部分当从基板的平面看时。贯通配线基板的制造方法包括：通过从基板的第一面侧或第二面侧照射激光而对形成有通孔的区域进行重整的工序A; 以及通过去除重整区域形成通孔的工序B。在步骤A中，在多个通孔形成区域中用激光照射激光器入射面之后的重叠部分之后，用激光照射更靠近激光器入射面的重叠部分。版权所有（C）2012，JPO＆INPIT

36. 发明专利

JP2012099819A Method of manufacturing through-wiring board 审中-公开
标题翻译：制造通过接线板的方法
公开(公告)号：JP2012099819A
公开(公告)日：2012-05-24
申请号：JP2011239706
申请日：2011-10-31
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： YAMAMOTO SATOSHI , HASHIMOTO HIROKAZU
IPC分类号： H05K1/11 , H01L21/3205 , H01L21/768 , H01L23/12 , H01L23/522 , H01L25/065 , H01L25/07 , H01L25/18 , H05K3/00 , H05K3/40
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0272 , H05K1/115 , H05K3/101 , H05K3/42 , H05K2201/09245 , H05K2201/09845 , H05K2201/09981 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide: a through-wiring board capable of electrically connecting electrodes between mounted devices with a high degree of freedom, even in miniature devices in which the electrode arrangement of the devices mounted on both faces of the through wiring board is diverse and high density; and a method of manufacturing the through-wiring board.SOLUTION: A through-wiring board includes a substrate having a first face 1 and a second face 2, and a plurality of through-wires 12a, 12b formed by filling or depositing a conductive substance in through-holes that penetrate between the first face and the second face. The through-wires are separated from each other, and include at least one overlap section in a plan view of the substrate. A method of manufacturing the through-wiring board comprises: a step A of performing laser irradiation from the first face side or the second face side of the substrate to modify regions where the through-holes are formed; and a step B of removing the modified regions to form the through-holes. In the step A, of the plurality of through-hole formation regions, the overlap section which is near to the laser incident face is irradiated with laser beams after the overlap section which is far from the laser incident face is irradiated with the laser beams.
摘要翻译：要解决的问题：提供：即使在安装在通孔的两个面上的装置的电极装置的微型装置中，能够以高自由度将安装的装置之间的电极电连接的贯通布线板接线板多样，密度高; 以及制造贯通布线基板的方法。解决方案：通孔布线板包括具有第一面1和第二面2的基板，以及通过在通孔内填充或沉积导电物质而形成的多条通丝12a，12b，第一面和第二面。通线彼此分离，并且在基板的平面图中包括至少一个重叠部分。一种制造贯通布线板的方法包括：从基板的第一表面侧或第二表面侧进行激光照射的步骤A，以修饰形成通孔的区域; 以及去除修饰区域以形成通孔的步骤B. 在多个通孔形成区域的步骤A中，在激光入射面远离激光入射面的重叠部分之后，用激光照射靠近激光入射面的重叠部分。版权所有（C）2012，JPO＆INPIT

37. 发明专利

JP4501464B2 Thick film circuit board, its production method and an integrated circuit device 有权
公开(公告)号：JP4501464B2
公开(公告)日：2010-07-14
申请号：JP2004057401
申请日：2004-03-02
申请人：株式会社デンソー
发明人：力也上村 , 浩春日井 , 芳彦白石 , 徹野村 , 祥宏霜出
IPC分类号： H05K1/09 , H05K1/11 , H01L23/12 , H01L23/13 , H05K1/16 , H05K3/12 , H05K3/24 , H05K3/40
CPC分类号： H05K3/4061 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H05K1/092 , H05K3/248 , H05K2201/035 , H05K2201/09981 , H05K2203/1572 , H01L2924/00

39. 发明专利

JPWO2007069789A1 多層プリント配線板およびその製造方法有权
公开(公告)号：JPWO2007069789A1
公开(公告)日：2009-05-28
申请号：JP2007550270
申请日：2006-12-15
申请人：イビデン株式会社
发明人：宗太郎伊藤 , 宗太郎伊藤 , 通昌高橋 , 通昌高橋 , 幸信三門 , 幸信三門
IPC分类号： H05K3/46 , H05K1/02 , H05K9/00
CPC分类号： H05K1/0218 , H01L23/49822 , H01L23/5389 , H01L23/552 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2224/2402 , H01L2224/73267 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15157 , H01L2924/1517 , H01L2924/15331 , H01L2924/15788 , H01L2924/3025 , H01L2924/3511 , H05K1/183 , H05K1/185 , H05K3/4652 , H05K2201/09981 , H05K2203/0733 , Y10T29/49155 , H01L2924/00
摘要：半導体素子が収容されている樹脂絶縁層上に、他の樹脂絶縁層と導体回路とが形成され、導体回路間がビアホールを介して電気的に接続されてなる多層プリント配線板において、半導体素子を収容するための凹部を囲んだ樹脂絶縁層に、あるいは凹部の内壁面に電磁シールド層を形成し、その凹部内に半導体素子を内蔵するように構成する。

40. 发明专利

JP2007227909A Substrate package, and method of manufacturing same 有权
标题翻译：基板封装及其制造方法
公开(公告)号：JP2007227909A
公开(公告)日：2007-09-06
申请号：JP2007017549
申请日：2007-01-29
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： LEE SEON GOO , HAHM HUN JOO , KIM DAE YEON
IPC分类号： H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L33/62 , F21K9/00 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H05K1/021 , H05K3/244 , H05K2201/09827 , H05K2201/09981 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a substrate package capable of reducing production costs considerably by using a general PCB material as a substrate, and of obtaining a light source of high quality inexpensively by increasing the heat production effect of the light source, and to provide a method of manufacturing the same. SOLUTION: The present invention provides a substrate package on which a light source is mounted, including a substrate composed of a general PCB, a hole formed in the substrate, a light source including a sub-mount located in the hole, and a dome part made of resin which covers the light source and fixes the light source to the substrate, and a method of manufacturing the substrate package. According to the present invention, an excellent heat production efficiency is obtained while using a general PCB material as a substrate instead of a metal substrate, and therefore, it is possible to manufacture a substrate package of high quality at a low cost. In addition, by increasing the heat production effect from the light source, there is obtained an effect that the light emission efficiency of the light source is increased considerably and a light source of high quality is obtained. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够通过使用通用PCB材料作为基板而显着降低生产成本的基板封装，并且通过增加光源的发热效果，廉价地获得高质量的光源，并提供其制造方法。解决方案：本发明提供了一种其上安装有光源的基板封装，包括由通用PCB构成的基板，形成在基板中的孔，包括位于孔中的副安装座的光源，以及由树脂构成的覆盖光源并将光源固定到基板的圆顶部分，以及制造基板封装的方法。根据本发明，在使用一般的PCB材料作为基板代替金属基板的情况下，获得了优异的发热效率，因此，可以以低成本制造高质量的基板封装。此外，通过增加来自光源的发热效果，可以获得光源的发光效率显着提高并获得高质量的光源的效果。版权所有（C）2007，JPO＆INPIT

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