专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明专利

JP2006041401A Semiconductor device and manufacturing method thereof 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2006041401A
公开(公告)日：2006-02-09
申请号：JP2004222520
申请日：2004-07-29
申请人： Sharp Corp , シャープ株式会社
发明人： NAKANISHI HIROYUKI , SUMINOE SHINJI
IPC分类号： H01L23/12
CPC分类号： H01L24/10 , H01L23/3114 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05023 , H01L2224/05548 , H01L2224/0557 , H01L2224/05571 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H05K1/0231 , H05K3/3436 , H05K3/3463 , H05K2201/0379 , H05K2201/09745 , H05K2201/10977 , H05K2201/10992 , H05K2203/041 , Y02P70/613 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of mounting other electronic parts on a rewiring, suppressing deformation after an external connection terminal is mounted on an IC chip, preventing the height direction of the external connection terminal from being lowered, suppressing a horizontal widening, forming adjacent external connection terminal distances in narrow pitches, and enabling the realization of a wafer level CSP of high function and multi-pins and a manufacturing method of the same. SOLUTION: The semiconductor device comprises a first insulating layer 7 formed on the IC chip 4, a metal wiring 6 which is connected to a chip electrode pad 5 and at the other end of which an external connection terminal mounted electrode 6a is formed, an electronic part 2 mounted on the external connection terminal mounted electrode 6a, an external connection terminal 1 of solder ball or the like comprising a conductor mounted on the other portions of the external connection terminal mounted electrode 6a, a second insulating layer 8 for covering portions other than the connection with the electronic part 2 out of the external connection terminal mounted electrode 6a and the metal wiring 6, and a sealing resin 3 sealed so as to allow the electronic part 2 and a part of the external connection terminal 1 to be exposed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够在重新布线上安装其他电子部件的半导体器件，在将外部连接端子安装在IC芯片上之后抑制变形，防止外部连接端子的高度方向降低，抑制水平加宽，以窄间距形成相邻的外部连接端子距离，并且能够实现高功能和多引脚的晶片级CSP及其制造方法。解决方案：半导体器件包括形成在IC芯片4上的第一绝缘层7，连接到芯片电极焊盘5的金属布线6，在另一端形成外部连接端子安装电极6a ，安装在外部连接端子安装电极6a上的电子部件2，焊球等的外部连接端子1，其包括安装在外部连接端子安装电极6a的另一部分上的导体，用于覆盖外部连接端子的第二绝缘层8 与外部连接端子安装电极6a和金属布线6之间的与电子部件2的连接以外的部分以及密封树脂3，密封树脂3被密封以允许电子部件2和外部连接端子1的一部分为裸露。版权所有（C）2006，JPO＆NCIPI

32. 发明专利

JP2006024889A Bga package and its manufacturing method 有权
标题翻译： BGA封装及其制造方法
公开(公告)号：JP2006024889A
公开(公告)日：2006-01-26
申请号：JP2005103428
申请日：2005-03-31
申请人： Samsung Electro Mech Co Ltd , 三星電機株式会社
发明人： LEE HYO-SOO , LEE TAE GON , PARK SUNG EUN
IPC分类号： H01L23/12
CPC分类号： H05K1/111 , H01L21/4857 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05155 , H01L2224/05599 , H01L2224/056 , H01L2224/05644 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/73265 , H01L2224/85399 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K3/06 , H05K3/282 , H05K3/3452 , H05K3/3457 , H05K2201/09745 , H05K2201/099 , H05K2203/0353 , H05K2203/1184 , Y02P70/611 , H01L2224/45099 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a BGA package capable of obtaining an outstanding surface characteristic and a favorable dropping property for a bonding pad by increasing an adhesion area between the bonding pad and solder, and to provide a method of manufacturing the BGA package.
SOLUTION: The method of manufacturing the BGA package comprises a first step of manufacturing a BGA package substrate on which the bonding pad is formed; a second step of applying an insulating member on the BGA package substrate, and forming an aperture which is smaller than the bonding pad to expose the bonding pad; and a third step of etching the bonding pad from an exposed region to a partial region coated with the insulating member, and forming an etching portion of a concave profile.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题：为了提供能够通过增加接合焊盘和焊料之间的粘合面积而获得出色的表面特性和良好的焊盘落下性能的BGA封装，并提供制造BGA的方法包。解决方案：制造BGA封装的方法包括制造其上形成有焊盘的BGA封装基板的第一步骤; 第二步骤，在所述BGA封装基板上施加绝缘构件，并形成小于所述焊盘的孔径以露出所述焊盘; 以及第三步骤，将接合焊盘从暴露区域蚀刻到涂覆有绝缘构件的部分区域，并形成凹形轮廓的蚀刻部分。版权所有（C）2006，JPO＆NCIPI

33. 发明专利

JP2006024751A Method of connecting flat surface multiple conductor and electric electronic part including part connected by method of connection 审中-公开
标题翻译：连接平面多导体和电子部件的方法，包括连接方法连接的部分
公开(公告)号：JP2006024751A
公开(公告)日：2006-01-26
申请号：JP2004201633
申请日：2004-07-08
申请人： Three M Innovative Properties Co , スリーエムイノベイティブプロパティズカンパニー
发明人： KAWATE YOSHIHISA , KAWATE KOICHIRO
IPC分类号： H05K3/36 , H01R43/02 , H05K1/14
CPC分类号： C09J163/00 , H05K3/305 , H05K3/361 , H05K2201/09745 , H05K2201/10977 , H05K2203/1189 , Y10T29/49126 , Y10T428/24843
摘要： PROBLEM TO BE SOLVED: To provide a method of connection which can perform repair easily while a flat surface multiple conductor made minute is certainly connectable. SOLUTION: The method of connecting the corresponding conductor of the flat surface multiple conductor performs line-up arrangement, grows a plurality of semiconductors into abbreviate flat member by overlaying, and includes a noble metal layer as an outermost layer of a metal for constituting certainly the semiconductor to the pair of the overlay region of the flat surface multiple conductors. A thermosetting adhesive composition region includes at least one conductor of the pair of the flat surface multiple conductors. After aligning correspondingly the semiconductor, it is a heating overlay region to a temperature with the above noble metal layer lower than the temperature for performing melting and sticking it by a pressure. While the electric connection of the corresponding semiconductor is performed by a solid state welding or contact, the overlay regions other than the semiconductor is bonded with the above thermosetting adhesive composition. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以容易地执行修复的连接方法，而平面多导体分时可以连接。＆lt; P＆gt;解决方案：连接平面多导体的相应导体的方法进行排列布置，通过覆盖将多个半导体生长成缩写平面构件，并且包括作为金属的最外层的贵金属层将半导体构成平面多层导体的覆盖区域对。热固性粘合剂组合物区域包括一对平面多个导体中的至少一个导体。相应地对准半导体后，与上述贵金属层的温度相比，它是一个加热覆盖区域，该温度低于用于进行熔化的温度并通过压力粘住温度。虽然通过固态焊接或接触进行相应半导体的电连接，但是除了半导体之外的覆盖区域与上述热固性粘合剂组合物接合。版权所有（C）2006，JPO＆NCIPI

34. 发明专利

JP2004266412A Light source unit 有权
公开(公告)号：JP2004266412A
公开(公告)日：2004-09-24
申请号：JP2003052629
申请日：2003-02-28
申请人： Noritsu Koki Co Ltd , ノーリツ鋼機株式会社
发明人： MIYAWAKI HIROSHI , TAMAI MASAYUKI , YAMASHITA RYOHEI
IPC分类号： G03B27/54 , B41J2/44 , F21K7/00 , F21S2/00 , F21S4/00 , F21V1/00 , F21V7/00 , F21V9/00 , F21V19/00 , F21V29/00 , F21Y101/02 , G02B27/00 , H01L25/075 , H01L31/12 , H01L33/58 , H01L33/60 , H01L33/62 , H04N1/028 , H04N1/04 , H05K1/02 , H05K1/05 , H05K1/18
CPC分类号： H04N1/02815 , F21K9/00 , F21V23/003 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/4911 , H01L2224/73265 , H01L2924/19107 , H01L2924/3011 , H04N1/02865 , H04N2201/0404 , H05K1/0274 , H05K1/056 , H05K1/183 , H05K2201/09036 , H05K2201/09745 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To rationally configure a light source unit capable of maintaining a temperature of light emitting diodes in spite of less number of components with high accuracy.
SOLUTION: A plurality of light emitting diodes 9 of chip shape are supported by a board P with a high thermal conductivity along a main scanning direction in a line, wiring is formed by bonding wires 61 over the light emitting diodes 9, power terminals 53a, and relay terminals 53b of the board P, a plurality of chip resistors CR are fixed to terminals 54a of a heat wiring part 54 by solder 60, in a direction along the main scanning direction at an approaching position, power is supplied to the chip resistors CR, so that the heat from the chip resistors CR is delivered to the board P, and the temperature of the light emitting diodes 9 is maintained by the heat delivered from the board P.
COPYRIGHT: (C)2004,JPO&NCIPI

35. 发明专利

JP2004265977A Light emitting diode light source unit 审中-公开
公开(公告)号：JP2004265977A
公开(公告)日：2004-09-24
申请号：JP2003052632
申请日：2003-02-28
申请人： Noritsu Koki Co Ltd , ノーリツ鋼機株式会社
发明人： TAMAI MASAYUKI
IPC分类号： G03B27/54 , B41J2/44 , F21K7/00 , F21S2/00 , F21S4/00 , F21V1/00 , F21V7/00 , F21V9/00 , F21V19/00 , F21V29/00 , F21Y101/02 , G02B27/00 , H01L25/075 , H01L31/12 , H01L33/58 , H01L33/60 , H01L33/62 , H04N1/028 , H04N1/04 , H05K1/02 , H05K1/05 , H05K1/18 , H01L33/00
CPC分类号： H04N1/02815 , F21K9/00 , F21V23/003 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/4911 , H01L2224/73265 , H01L2924/19107 , H01L2924/3011 , H04N1/02865 , H04N2201/0404 , H05K1/0274 , H05K1/056 , H05K1/183 , H05K2201/09036 , H05K2201/09745 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light emitting diode light source unit in which a reflective surface shape having no variation in the extending direction of light emitting diode elements is realized without requiring any special extra member forming a reflector.
SOLUTION: In the light emitting diode light source unit comprising a printed wiring board for mounting the light emitting diode elements, a plurality of the light emitting diode elements 9 are mounted in an array on the bottom surface of a linear groove 50 made by grooving the printed wiring board P wherein the side face 52 of the groove serves as a reflective surface for reflecting light emitted from the light emitting diode element toward an object being illuminated.
COPYRIGHT: (C)2004,JPO&NCIPI

36. 发明专利

JP2004111964A Surface-mounted electronic device 审中-公开
公开(公告)号：JP2004111964A
公开(公告)日：2004-04-08
申请号：JP2003316609
申请日：2003-09-09
申请人： Agilent Technol Inc , アジレント・テクノロジーズ・インクAgilent Technologies, Inc.
发明人： NG KEE YEAN , SINGH GUBBIR
IPC分类号： H01C1/14 , H01L23/31 , H01L23/495 , H01L23/498 , H01L33/48 , H01L33/62 , H05K3/34 , H01L33/00
CPC分类号： H01L33/486 , H01C1/14 , H01L23/3107 , H01L23/49551 , H01L23/49805 , H01L24/48 , H01L24/73 , H01L33/62 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01068 , H01L2924/12041 , H01L2924/181 , H05K3/3442 , H05K2201/09154 , H05K2201/09472 , H05K2201/09745 , H05K2201/10106 , Y02P70/613 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure for improving contrast of an LED device.
SOLUTION: The surface-mounted device comprises a body (402) having a first face (410) for device mounting, recesses (420, 421) formed in the first face (410), and a plurality of electric contact members (404, 406) located on the first face (410). The electric contact members (404, 406) include first sections (412, 414) constituting at least a part of at least one internal surface of the recesses (420, 421).
COPYRIGHT: (C)2004,JPO

37. 发明专利

JP2004063803A Method of manufacturing printed wiring board, metallic sheet for printed wiring board, and connected printed wiring board 审中-公开
公开(公告)号：JP2004063803A
公开(公告)日：2004-02-26
申请号：JP2002220398
申请日：2002-07-29
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： SUZUKI TOMOE , YURI SHINJI , SATO KAZUHISA , YAMAZAKI KOZO
IPC分类号： B32B15/08 , B32B27/38 , H05K1/05 , H05K3/00 , H05K3/44
CPC分类号： H05K1/056 , B32B15/08 , B32B27/38 , H05K3/0052 , H05K3/44 , H05K3/445 , H05K2201/0909 , H05K2201/09709 , H05K2201/09745 , H05K2203/0369 , H05K2203/1572 , Y10S428/901 , Y10T29/49126 , Y10T29/49135 , Y10T29/49165 , Y10T83/0333 , Y10T83/0341 , Y10T83/0581 , Y10T428/12 , Y10T428/12361 , Y10T428/15 , Y10T428/24298 , Y10T428/24314 , Y10T428/24917
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing printed wiring board by which a printed wiring board containing insulating resin layers having uniform thicknesses and excellent flatness can be obtained while the wiring board maintains ideal sectility in a step of cutting and dividing a connected printed wiring board into individual printed wiring boards. SOLUTION: In this method, a connected wiring board containing a metallic sheet 12 having first and second main surfaces 14 and 15 and insulating resin layers arranged on the main surfaces 14 and 15 is first manufactured. The metallic sheet 12 also has first and second recessed sections 16 and 17. The first recessed sections 16 are opened on the first main surface 14 and noncontinuously arranged along prescribed planned cutting lines 13. The second recessed sections 17 are opened on the second main surface 15 and noncontinuously arranged along prescribed planned cutting lines 13. Then the connected printed wiring board is divided into a plurality of printed wiring boards by cutting the connected printed wiring board along the planned cutting lines 13. COPYRIGHT: (C)2004,JPO

38. 发明专利

JP2003318312A Hybrid integrated circuit device 有权
标题翻译：混合集成电路设备
公开(公告)号：JP2003318312A
公开(公告)日：2003-11-07
申请号：JP2002121748
申请日：2002-04-24
申请人： Sanyo Electric Co Ltd , 三洋電機株式会社
发明人： MIZUTANI MASAHIKO , TAKAKUSAKI SADAMICHI , NEZU GENICHI , MOGI KAZUTOSHI
IPC分类号： H05K1/05 , H01L23/12 , H01L23/36 , H05K3/00 , H05K3/28 , H01L23/40
CPC分类号： H05K3/0052 , H01L24/97 , H01L2224/48091 , H01L2224/73265 , H01L2924/14 , H01L2924/19105 , H05K1/056 , H05K3/284 , H05K2201/09036 , H05K2201/0909 , H05K2201/09745 , H05K2203/0228 , H05K2203/1572 , H05K2203/302 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce in size a hybrid integrated circuit device 1.
SOLUTION: A conductive pattern 12 is formed on the surface of a circuit substrate 10 having an insulating layer 11 provided on the surface. The pattern 12 is entirely formed on the substrate. More particularly, the pattern 12 is also formed on a part of 2 mm from the peripheral end of the substrate 10. A circuit element 13 having the height of a heat sink 13A or the like can be disposed near the peripheral end of the substrate 10. Thus, the hybrid integrated circuit device 1 is constituted, and hence the integration degree of the hybrid integrated circuit 1 can be improved. Accordingly, when the circuit equivalent to a prior art is constituted, the hybrid integrated circuit device can be reduced in size as a whole.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了减小混合集成电路器件1的尺寸。解决方案：在具有设置在表面上的绝缘层11的电路基板10的表面上形成导电图案12。图案12完全形成在基板上。更具体地，图案12也形成在距离基板10的外周端部2mm的一部分上。具有散热器13A等的高度的电路元件13可以设置在基板10的外周端附近因此，构成混合集成电路装置1，从而可以提高混合集成电路1的集成度。因此，当构成与现有技术相当的电路时，混合集成电路器件的整体尺寸可以减小。版权所有（C）2004，JPO

39. 发明专利

JP2018506855A 電子コンポーネントおよびそのような電子コンポーネントを製造するための方法审中-公开
公开(公告)号：JP2018506855A
公开(公告)日：2018-03-08
申请号：JP2017541957
申请日：2016-02-01
申请人：コンティテミックマイクロエレクトロニックゲゼルシャフトミットベシュレンクテルハフツング , Conti Temic microelectronic GmbH
发明人：カーリンベアート , シュテファンミュラー , トーマスシュミット , ベアンハートシューフ , フリーダーヴィットマン
IPC分类号： H05K1/02 , H01L25/04 , H01L25/18 , H05K1/18 , H05K3/32 , H05K3/34 , H05K7/20
CPC分类号： H05K1/181 , H05K1/0204 , H05K1/11 , H05K3/0061 , H05K3/321 , H05K3/341 , H05K7/205 , H05K2201/066 , H05K2201/09745 , H05K2201/10227 , H05K2201/10545 , H05K2201/1056 , H05K2203/049
摘要：本発明は、2つの対向する平面側(1.2,1.3)と複数の電子部品(2)とを備えたプリント回路基板(1)と、ベースプレート(3)とを含んでいる、電子コンポーネント(E)に関している。本発明によれば、複数の電子部品(2)のうちの所定の数の電子部品(2)は、プリント回路基板(1)の裏平面側(1.2)に、および複数の電子部品(2)のうちのさらなる数の電子部品(2)は、プリント回路基板(1)の表平面側(1.3)にそれぞれ固定され、かつ当該プリント回路基板と導電的に接続されており、ベースプレート(3)は、プリント回路基板(1)の裏平面側(1.2)に配置された複数の電子部品(2)を収容するための少なくとも1つの第1の凹部(3.1)を有していることが想定される。さらに本発明は、そのような電子コンポーネント(E)を製造するための方法に関している。

40. 发明专利

JP2018019104A 積層体审中-公开
公开(公告)号：JP2018019104A
公开(公告)日：2018-02-01
申请号：JP2017202758
申请日：2017-10-19
申请人：積水化学工業株式会社
发明人：前中寛 , 乾靖
IPC分类号： B32B15/08 , H05K1/02
CPC分类号： H05K1/0207 , B32B15/08 , B32B15/092 , B32B15/20 , B32B27/20 , B32B27/26 , B32B27/281 , B32B27/302 , B32B27/34 , B32B27/40 , B32B27/42 , B32B2250/44 , B32B2264/10 , B32B2264/102 , B32B2307/206 , B32B2307/30 , B32B2307/304 , B32B2307/306 , B32B2307/308 , B32B2307/538 , B32B2307/54 , B32B2307/732 , B32B2307/734 , B32B2307/748 , B32B2457/08 , H05K1/02 , H05K1/0204 , H05K1/0209 , H05K1/0284 , H05K1/0373 , H05K2201/068 , H05K2201/09745
摘要：【課題】熱抵抗を低くすることができ、冷熱サイクル後の剥離を抑えることができる積層体を提供する。【解決手段】本発明に係る積層体は、絶縁樹脂層と、金属箔又は金属板である第1の金属材と、金属箔又は金属板である第2の金属材とを備え、前記第1の金属材が、前記絶縁樹脂層の第1の表面に積層されており、かつ、前記第2の金属材が、前記絶縁樹脂層の前記第1の表面とは反対の第2の表面に積層されており、前記絶縁樹脂層の厚みが200μm以下であり、前記第1の金属材と前記第2の金属材との合計の厚みが200μm以上であり、前記第1の金属材の厚みの、前記第2の金属材の厚みに対する比が、0.2以上、5以下であり、前記第1の金属材の前記絶縁樹脂層側とは反対の表面の表面積の、前記第2の金属材の前記絶縁樹脂層側とは反対の表面の表面積に対する比が、0.5以上、2以下である。【選択図】図1

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式