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31. 发明专利

JPS63250831A SEMICONDUCTOR BONDING DEVICE 失效
公开(公告)号：JPS63250831A
公开(公告)日：1988-10-18
申请号：JP8481687
申请日：1987-04-08
申请人： TOSHIBA CORP
发明人： SAITO KAZUYOSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To set arbitrarily a loading rate to facilitate the inhibition of impact force by a method wherein the title device is provided with a spring mechanism (can be an air pressure system) over a bonding tool and a bonding load is applied through this mechanism. CONSTITUTION:A spring mechanism 12 is provided over a bonding tool 13 and moreover, a load to be applied to the upper part of the mechanism 12 is detected. That is, the tool 13 heated by a heater 14 and a guide 18 are descended by a driving force 19 and when the tool 13 comes into contact with a tape carrier 15, the tool's own weight is applied and thereafter, a load is gradually increased with the compression of the spring 12 and if a load measuring instrument 11 reaches a constant value, the tool and the guide are stopped or are made to ascend and the setting of a load is performed. Thereby, an abrupt thermal impulse (temperature rise) is not associated with because contact force is gradually increased even in a thermal manner, not to mention impact due to a load, and damage to semiconductor elements and their destruction can be reduced.

32. 发明专利

JPS6358947A FORMATION OF SOLDER BUMP 失效
公开(公告)号：JPS6358947A
公开(公告)日：1988-03-14
申请号：JP20336386
申请日：1986-08-29
申请人： TOSHIBA CORP , KURODA DENKI KK
发明人： INABA NAOHIKO , IWASE NOBUO , SAITO KAZUYOSHI , HIRATA SEIICHI , GONDA MAKOTO , HATANO HAJIME
IPC分类号： H01L21/60
摘要： PURPOSE:To attach a solder layer selectively to an electrode by means of alloying each other and to form a solder bump directly by a method wherein a substrate is mounted on a rigid support via a soft material and molten solder is brought into contact with an exposed electrode part so that ultrasonic waves can be applied to the solder. CONSTITUTION:A silicon wafer 11 is mounted on a support 13 composed of a glass sheet via a soft material 12 composed of a silicone rubber sheet whose both surfaces are attached by adhesive tapesfor high-temperature use. This assembly is then dipped into spouting molten solder 23 by keeping it in a vertical position. An ultrasonic vibrator 25 is then inserted into the molten solder 23 at a location near the silicon wafer 11 so that ultrasonic waves can be applied to the molten solder 23. Through this constitution, before dipping the assembly into the solder an electrode 33 is formed on a silicon substrate 31 via an insulating film 32, and the electrode 33 is not covered with a passivating film 34 coating the whole surface. After dipping the assembly into the solder, a mountain-like solder bump 35 is bonded directly on this electrode 33.

33. 发明专利

JPS6329827A MEDICAL DIAGNOSING DEVICE 失效
公开(公告)号：JPS6329827A
公开(公告)日：1988-02-08
申请号：JP17274886
申请日：1986-07-24
申请人： TOSHIBA CORP
发明人： SAITO KAZUYOSHI
IPC分类号： A61B8/00 , G06F3/02 , G06F3/023 , G06F17/30 , G06Q50/22 , H03M11/14
摘要： PURPOSE:To improve maneuverability by automatically setting up the variation of the display order of a menu message group to a display means on the basis of the display frequency of respective menu messages. CONSTITUTION:A menu display device 15 on an operation board 11 is constituted so as to display means successively from the menu with the highest priority, and if an ultrasonic display state selected by an operator is M mode image display e.g., the mode is not immediately displayed. In this case, a NEXT.SW5 is depressed to display a required menu message on the menu display device 15. When the value of the display frequency of a certain menu is increased and exceeds a fixed value, the priority order of the display of the menu is shifted. Thereby, the menu message is displayed with the highest priority from a certain point of time, so that the operation can be more simplified.

34. 发明专利

JPS62199023A MOUNTING METHOD FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62199023A
公开(公告)日：1987-09-02
申请号：JP4029386
申请日：1986-02-27
申请人： TOSHIBA CORP
发明人： SAITO KAZUYOSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To contrive the improvement in reliability of electrode pads and bonding parts by forming a through-hole at the end of a wiring and connecting an electrode pad to the wiring while pressing a metallic ball over a through-hole after positioning said through-hole to be in accordance with the electrode pad. CONSTITUTION:A Cu wiring 1 is formed on a polyimide film 2 and a through- hole is arranged in the part where the wiring is on an electrode pad 4 of an element 5. Above this through-hole, a capillary 6 and an Au ball 7 are set and these are pressed against to the pad 4 so that the device of such structure that the pad 4 is connected with the wiring 1 by an Au ball bump 8 can be obtained. In this method, because an element is not given a shock two times as in a ball-bump method, the reliability of electrodes pads and bonding parts can be improved.

35. 发明专利

JPS6262546A ELECTRONIC PART DEVICE 失效
公开(公告)号：JPS6262546A
公开(公告)日：1987-03-19
申请号：JP20211185
申请日：1985-09-12
申请人： TOSHIBA CORP
发明人： SAITO KAZUYOSHI , IWASE NOBUO , TANUMA CHIAKI , ONO TOMIO
IPC分类号： H01L23/36
摘要： PURPOSE:To effectively cool an electronic part package having heat quantity by mounting a cooling fin on the package in which electronic circuit elements are mounted, and vibrating the fin itself. CONSTITUTION:A semiconductor element 2 is mounted on a ceramics base 11, and sealed with low melting point glass to form an electronic part. A ceramics support 5 is formed of a bonding material such as epoxy resin outside the base 11, a cooling fin 6 made, for example, of brass is mounted on the susceptor 5, and piezoelectric elements 71, 72 are bonded to both side surfaces of the film 6 to construct a bimorph vibrator. An AC voltage is applied to the vibrator to vibrate the tip of the fin 6. Thus, the heat dissipation effect of the fin 6 is largely improved.

36. 发明专利

JPS61168938A CERAMIC PACKAGE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPS61168938A
公开(公告)日：1986-07-30
申请号：JP977285
申请日：1985-01-22
申请人： TOSHIBA CORP
发明人： SAITO KAZUYOSHI , IWASE NOBUO
IPC分类号： H01L23/12 , H01L21/50 , H01L23/08
摘要： PURPOSE:To enhance bonding strength between a substrate and a glass layer, by forming an oxide layer on the surface of a ceramic substrate comprizing aluminum nitride. CONSTITUTION:A conducting paste 12 is printed on a cavity of a ceramic substrate 11 comprising AlN and the paste is burned. At this time, the surface of the ceramic substrate 11 is oxidized at the same time of the burning of the conducting paste 12 by a heat treatment process, and an oxide film 13 is formed. A glass layer 14 is deposited as a bonding layer on the oxide layer 13. A plurality of leadframes 15 are formed on the glass layer 14. Thereafter, a semiconductor chip 16 is mounted on the conductor layer 12'. Then the chip 16 and the leadframes 15 are connected by bonding wires 17. A ceramic cap 19 comprising Al2O3, on the lower surface of which a glass layer 18 is deposited, is compressed. The glass layers 14 and 18 are burned, and the substrate 11 and the cap 19 are bonded.

37. 发明专利

JPH03283440A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH03283440A
公开(公告)日：1991-12-13
申请号：JP8101590
申请日：1990-03-30
申请人： TOSHIBA CORP
发明人： SAITO KAZUYOSHI , TAZAWA HIROSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To obtain a semiconductor device, which has improved high-frequency characteristics and improved heat dissipation characteristics and moreover, has improved shielding characteristics, by a method wherein a metal foil, which is connected to leads, is spread and arranged over a chip in such a way that it is positioned over the upper surface of the chip. CONSTITUTION:A circuit pattern is constituted of the base parts of leads 3 on a film carrier 2 and the tips of the leads 3 are made to project in a hole part as connecting parts with electrode pads on a chip 1. A metal film 5 consisting of copper or the like, for example, is arranged beyond the tips of these leads, that is, over the chip 1 mounted on the hole part. This metal foil 5 is spread over the whole chip and is continuously linked with all leads 31 for grounding use of the leads 3. The leads 3 are patterned using a copper foil adhered on the film carrier 2 as a mask pattern and lead patterns are formed, but the foil 5 is formed together as part of the patterns at the time of this patterning.

38. 发明专利

JPH0380841A ULTRASONIC DIAGNOSTIC DEVICE 失效
公开(公告)号：JPH0380841A
公开(公告)日：1991-04-05
申请号：JP21797189
申请日：1989-08-24
申请人： TOSHIBA CORP
发明人： SAITO KAZUYOSHI
IPC分类号： G01N29/44 , A61B8/00 , G01N29/22
摘要： PURPOSE:To always form an optimum sound field by providing a calibration function for executing automatically the sensitivity adjustment of plural vibrators for constituting an ultrasonic probe on the device itself. CONSTITUTION:Sensitivity of each vibrator 2 for constituting an ultrasonic probe 1 is measured. an echo signal reflected by a sensitivity tester 20 is inputted to a DSC 6 through a receiving system 4, by which echo data is stored in its frame memory 6a. This echo data is read out by a CPU 5 and stored in a memory 7. Subsequently, based on a result of measurement of sensitivity, sensitivity of each vibrator 2 is adjusted. Based on the vibrator of the worst sensitivity as a reference, based on the sensitivity of each vibrator 2, the CPU 5 executes such a correction as adjusts other vibrator 2 thereto and executes a control so as to vary an ATT value of each attenuator 10, 15 in order to form an optimum sound field.

39. 发明专利

JPH02168668A SOLID-STATE IMAGE PICKUP DEVICE 失效
公开(公告)号：JPH02168668A
公开(公告)日：1990-06-28
申请号：JP8355489
申请日：1989-03-31
申请人： TOSHIBA CORP
发明人： FURUKAWA AKIHIKO , SAITO KAZUYOSHI , KOORIDO KUMIO
IPC分类号： H01L21/60 , H01L27/146 , H04N5/335 , H04N5/369 , H04N5/3728 , H04N5/374
摘要： PURPOSE:To improve reliability of electrical connection by bonding a bonding wire to a metallic film provided on a photoconductive film directly or through a transparent electrode. CONSTITUTION:A bonding pad base (metallic film) 3 is formed on a field oxide film 2 on the periphery of a chip on a semiconductor substrate 1, simultaneously with other bonding pads. On the field oxide film 2 and the metallic film 3, there are provided a photoconductive film 4 of amorphous Si or the like and a transparent electrode 5 of ITO or the like such that they are continued from a photosensitive region. A metallic film 6 for pads having desirable bondability, of Al or W for example, is formed on the transparent electrode 5 in the pad region on the periphery of the chip, and bonding wire 7 of Al or the like is bonded to the metallic film 6. Thus, a voltage applied externally reaches the transparent electrode 5 through the bonding wire 7 and the metallic film 6. Accordingly, the bonding pads can be electrically connected reliably with the transparent electrode.

40. 发明专利

JPH02139952A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02139952A
公开(公告)日：1990-05-29
申请号：JP29232888
申请日：1988-11-21
申请人： TOSHIBA CORP
发明人： TAKUBO TOMOAKI , SAITO KAZUYOSHI , TAZAWA HIROSHI
IPC分类号： H01L23/38
摘要： PURPOSE:To perform cooling efficiently by providing the following elements and heat insulating layers: a semiconductor element which is installed to the face inside of a package of a heat conductive member for plugging the openings of the package; a cooling element which is installed on the opposite side of the package; heat insulating layers which are provided at least on one side of surfaces of the package as well as the heat conductive member. CONSTITUTION:A heat conductive member 102 is prepared so that openings of the rear of a package 101 on which a glass cover 101b is provided on the upper face of a mainframe 101a are filled up and a semiconductor 103 is installed at the inside of the package 101. Cooling elements 104 are installed at the face of the opposite side of the package. Heat insulating layers 113 are provided not only by covering a part where the glass cover 101b is removed, that is, the surface of the heat conductive member 102 but also by covering the surface of the cooling elements 104 as well. Once an electric current flows from the side of a metallic plate 106 of the cooling element 104 to a P-type semiconductor 105 and a metallic plate 107, the metallic plate 106 acts as a heat absorption part and the metallic plate 107 acts as a heat radiation part due to the Peltier effect.

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