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31. 发明专利

JP2005191492A Solid imaging element and its manufacturing method 有权
标题翻译：固体成像元件及其制造方法
公开(公告)号：JP2005191492A
公开(公告)日：2005-07-14
申请号：JP2003434446
申请日：2003-12-26
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI , IWABUCHI MAKOTO
IPC分类号： H01L27/14 , H01L27/146 , H04N5/335 , H04N5/369
摘要： PROBLEM TO BE SOLVED: To provide a structure of a solid imaging element by which a color filter or an on-chip lens etc. can be formed in a good condition.
SOLUTION: The solid imaging element 1 is composed in such a way that a wiring portion 7, where a wiring layer 6 is formed in an insulating layer 5, is located under a semiconductor layer 2 where a light receiving portion PD is formed, the color filter 3 or the on-chip lens 4 is at least formed on the semiconductor layer 2, a pad electrode 11 is buried in the semiconductor layer 2 through an insulating film 12, the pad electrode 11 is electrically connected with the wiring layer 13 through the contact layers 14, and an opening is formed on the pad electrode 11. The solid imaging element 1 is manufactured by a process that after the pad electrode 11 is formed in a recess formed in the semiconductor layer 2 through the insulating film 12, an impurity area being the light receiving portion PD is formed in the semiconductor layer 2, a wiring portion 7 is formed on the surface side of the semiconductor 2, an opening is formed on the back of the pad electrode 11, and the color filter 3 or the on-chip lens 4 is formed by using a resist applied to the back of the semiconductor layer 2.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供可以在良好状态下形成滤色器或片上透镜等的固体成像元件的结构。解决方案：固体成像元件1以这样一种方式组成，其中布线层6形成在绝缘层5中的布线部分7位于形成有光接收部分PD的半导体层2的下方滤色器3或片上透镜4至少形成在半导体层2上，焊盘电极11通过绝缘膜12埋设在半导体层2中，焊盘电极11与布线层电连接 13，通过接触层14，并且在焊盘电极11上形成开口。固体成像元件1通过以下处理制造，即，在通过绝缘膜12形成在半导体层2中的凹部中形成焊盘电极11之后在半导体层2中形成作为受光部PD的杂质区域，在半导体2的表面侧形成配线部7，在焊盘电极11的背面形成有开口，滤色器 3或片上透镜4通过使用施加到半导体层2的背面的抗蚀剂形成。版权所有（C）2005，JPO＆NCIPI

32. 发明专利

JP2003059555A Bonding method of circuit element and manufacturing method of electric circuit device 有权
标题翻译：电路元件的接合方法及电路设备的制造方法
公开(公告)号：JP2003059555A
公开(公告)日：2003-02-28
申请号：JP2001248718
申请日：2001-08-20
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI
IPC分类号： G09F9/33 , H01L21/60 , H05K3/32 , H01R12/04
摘要： PROBLEM TO BE SOLVED: To provide a bonding method of a circuit element and a manufacturing method of an electric circuit device.
SOLUTION: The bonding method of a light-emitting diode 52 in which, a resin layer 53 holding the light-emitting diode 52 is turned to a chip by removing a part of it, and then, the resin chip 54 thus made is separated as organic deposits 81 generated at time of a chip making is left adhered on the resin layer 53, after which, the separated resin chip 54 is made bonded to a wiring circuit board 55 under heating by laser irradiation while a selective heating is substantially made of an adhesive layer 76 by heat-absorbing effect of the organic deposits 81, as well as the manufacturing method of an image display device accompanied by this bonding process are introduced.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供电路元件的接合方法和电路装置的制造方法。解决方案：将发光二极管52保持的树脂层53通过除去其一部分而转移到芯片上的发光二极管52的接合方法，然后将如此制成的树脂芯片54分离为在芯片制造时产生的有机沉积物81粘附在树脂层53上，然后通过激光照射在分离的树脂芯片54上加热加热分离的树脂芯片54，同时选择加热基本上由引入有机沉积物81的吸热效果的粘合剂层76以及伴随着该接合处理的图像显示装置的制造方法。

33. 发明专利

JP2012174800A Semiconductor device, manufacturing apparatus and manufacturing method 审中-公开
标题翻译：半导体器件，制造设备和制造方法
公开(公告)号：JP2012174800A
公开(公告)日：2012-09-10
申请号：JP2011033688
申请日：2011-02-18
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI , SHIMIZU MASAHIKO
IPC分类号： H01L27/14 , H04N5/357 , H04N5/369
CPC分类号： H01L27/14618 , H01L24/48 , H01L24/78 , H01L24/85 , H01L24/97 , H01L27/14623 , H01L2224/05599 , H01L2224/451 , H01L2224/48091 , H01L2224/48465 , H01L2224/78301 , H01L2224/85181 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/19105 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： PROBLEM TO BE SOLVED: To inhibit deterioration in picture quality caused by reflected light from wiring provided near an image pickup device.SOLUTION: A camera module 141 comprises: an image pickup chip 101 on which a light-receiving surface 101a of an image pickup device creating a shot image by receiving incident light from a lens 121a is disposed and an electrode pad 101b is disposed; a printed board 61on which an inner lead 61aconnected with the electrode pad 101b is installed; a metal wire pressure bonding part 161 constituted by a conductive material and bonded to the electrode pad 101b; and a metal wire 102connecting the metal wire pressure bonding part 161 with the inner lead 61a. The metal wire 102is wired along a plane surface of the image pickup chip 101 in such a manner that reflected light from the metal wire 102does not enter the light-receiving surface 101a. The present invention can be applied to a semiconductor device and the like having an image pickup device, for example.
摘要翻译：要解决的问题：抑制由设置在图像拾取装置附近的布线的反射光引起的图像质量的劣化。解决方案：相机模块141包括：图像拾取芯片101，其上设置通过接收来自透镜121a的入射光而产生拍摄图像的图像拾取装置的光接收表面101a，并且设置电极焊盘101b ; 安装了与电极焊盘101b连接的内引线61a n 的印刷电路板61 n 由导电材料构成并结合到电极焊盘101b的金属线压接部161; 以及将金属丝压接部161与内引线61a n 连接的金属线102 m 。金属线102 m 沿着图像拾取芯片101的平面布线，使得来自金属线102的反射光 m 不进入光接收表面101a。例如，本发明可以应用于具有图像拾取装置的半导体器件等。版权所有（C）2012，JPO＆INPIT

34. 发明专利

JP2006054275A Method for manufacturing semiconductor device and semiconductor manufacturing equipment 审中-公开
标题翻译：制造半导体器件和半导体制造设备的方法
公开(公告)号：JP2006054275A
公开(公告)日：2006-02-23
申请号：JP2004234060
申请日：2004-08-11
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI
IPC分类号： H01L21/60 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/1403 , H01L2224/16 , H01L2224/75 , H01L2224/759
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and semiconductor manufacturing equipment which, when a semiconductor chip is connected to a mounting board or the semiconductor chips are connected to one another via a bump, can test the contact state or joint state of the bump during a bonding step.
SOLUTION: In the method for manufacturing the semiconductor device and the semiconductor manufacturing equipment, the method comprises a first step in which a semiconductor chip 10 formed with a plurality of bumps 11 and a semiconductor chip 20 formed with a plurality of bumps 21 are disposed so as to face each other in a state that the bumps 11 face the bumps 21 and the semiconductor chip 10 is separated from the semiconductor chip 20, and thereafter, the semiconductor chip 20 is pressed toward the semiconductor chip 10, thereby bringing the facing bumps 11 and the bumps 21 into contact, and a second step of joining the bumps 11, 21. By monitoring a load applied to the semiconductor chip 20 about all the steps, the contact state and the joint state of the bumps 11, 21 are examined.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种制造半导体器件和半导体制造设备的方法，当将半导体芯片连接到安装板或半导体芯片经由凸块彼此连接时，可以测试接触在接合步骤期间的凸起的状态或接合状态。解决方案：在制造半导体器件和半导体制造设备的方法中，该方法包括第一步骤，其中形成有多个凸块11的半导体芯片10和形成有多个凸块21的半导体芯片20 在凸块11朝向凸块21并且半导体芯片10与半导体芯片20分离的状态下彼此面对配置，然后将半导体芯片20按压到半导体芯片10，由此使面对的凸块11和凸块21接触，以及接合凸块11,21的第二步骤。通过监测施加到半导体芯片20的所有步骤的负载，凸块11,21的接触状态和接合状态被检查。版权所有（C）2006，JPO＆NCIPI

35. 发明专利

JP2005284305A Method for manufacturing image display device 有权
标题翻译：制造图像显示装置的方法
公开(公告)号：JP2005284305A
公开(公告)日：2005-10-13
申请号：JP2005136513
申请日：2005-05-09
申请人： Sony Corp , ソニー株式会社
发明人： OHATA TOYOJI , IWABUCHI TOSHIAKI , OBA HIROSHI
IPC分类号： G09F9/00 , H01L33/24 , H01L33/32 , H01L33/56 , H01L33/62 , H01L33/00
CPC分类号： H01L2224/24
摘要： PROBLEM TO BE SOLVED: To easily obtain an image display device whose defective element can easily be repaired without any delicate and difficult operation.
SOLUTION: The method for manufacturing the image display device which has light emitting elements in matrix on a substrate so that pixels are composed of the respective light emitting elements 52 includes a 1st transfer stage of making a temporary holding member 51 hold the light emitting elements 52 by transferring the light emitting elements 52 at larger intervals than the array of the light emitting elements 52 on a 1st substrate 50 and a 2nd transfer stage of transferring the light emitting elements 52 held by the temporary holding members more apart on a 2nd substrate 55. The elements are thus arrayed more apart through those stages and mounted by being electrically connected to wires connected to a driving circuit; and then a defective light emitting element is detected and a light emitting element for repair is mounted at the position corresponding to the defective light emitting element.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了容易地获得其缺陷元件可以容易地被修复而没有任何微妙和困难的操作的图像显示装置。解决方案：用于制造在基板上具有矩阵的发光元件以使像素由各个发光元件52组成的图像显示装置的方法包括：使第一转印阶段使临时保持构件51保持光通过以比第一基板50上的发光元件52的阵列更大的间隔传送发光元件52和将由临时保持构件保持的发光元件52更多地分开的第二传送级在第二传送级因此，这些元件在这些级上排列得比较分开，并且通过电连接到连接到驱动电路的导线来安装。然后检测到有缺陷的发光元件，并且在与缺陷发光元件相对应的位置处安装用于修理的发光元件。版权所有（C）2006，JPO＆NCIPI

36. 发明专利

JP2004221292A Method of manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2004221292A
公开(公告)日：2004-08-05
申请号：JP2003006549
申请日：2003-01-15
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI
IPC分类号： H01L21/60
CPC分类号： H01L2224/1403 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which is capable of keeping the height of solder bumps on a second electrode at a low level so as to carry out a flip chip connection well.
SOLUTION: The semiconductor device is equipped with a laminated structure composed of a circuit board and a semiconductor element connected to it in a flip chip connection manner, and the semiconductor element is equipped with an element board where a circuit is formed in an effective element region on its main surface and a first electrode pad and a second electrode pad formed on the main surface of the element board. The method of manufacturing the semiconductor device comprises processes of making the first electrode pad and the second electrode pad make electroless plating, applying molten solder on the first electrode pad and the second electrode pad subjected to electroless plating, and sucking up the molten solder deposited on the second electrode pad.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造能够将第二电极上的焊料凸块的高度保持在低电平的半导体器件的方法，以便进行倒装芯片连接。解决方案：半导体器件配备有由电路板和以倒装芯片连接方式连接到其的半导体元件组成的层叠结构，并且半导体元件配备有元件板，其中电路形成在在其主表面上的有效元件区域和形成在元件板的主表面上的第一电极焊盘和第二电极焊盘。制造半导体器件的方法包括使第一电极焊盘和第二电极焊盘进行化学镀的工艺，在第一电极焊盘和经受化学镀的第二电极焊盘上施加熔融焊料，并将沉积在其上的熔融焊料第二电极垫。版权所有（C）2004，JPO＆NCIPI

37. 发明专利

JP2004146728A Semiconductor device and its manufacturing method 审中-公开
公开(公告)号：JP2004146728A
公开(公告)日：2004-05-20
申请号：JP2002312497
申请日：2002-10-28
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI
IPC分类号： H01L25/18 , H01L21/60 , H01L25/065 , H01L25/07
CPC分类号： H01L2224/1403 , H01L2224/16145
摘要： PROBLEM TO BE SOLVED: To carry out flip chip connection adequately for constituting a COC type system-in package.
SOLUTION: In a semiconductor device having a laminated structure, in which a chip 1 is provided with flip chip connection on a chip 2, the chip 1 has an element board 3 having a circuit in an effective element region on the main face, a connecting pad 4 for connecting with the chip 2 electrically, and a measuring pad 5 for measuring electric characteristics of the circuit. In this structure, the measuring pad 5 is formed at a layer lower than the connecting pad 4 in the thickness direction of the element board 3, so the height position of a solder bump 24 formed on the measuring pad 5 is restricted low.
COPYRIGHT: (C)2004,JPO

38. 发明专利

JP2003077940A Method of transferring device, method of arranging device using same, and method of manufacturing image display device unit 审中-公开
标题翻译：传送装置的方法，使用该装置的装置的方法以及制造图像显示装置单元的方法
公开(公告)号：JP2003077940A
公开(公告)日：2003-03-14
申请号：JP2001270218
申请日：2001-09-06
申请人： Sony Corp , ソニー株式会社
发明人： OHATA TOYOJI , IWABUCHI TOSHIAKI , OBA HIROSHI
IPC分类号： G09F9/33 , G09F9/35 , H01J9/02 , H01L21/20 , H01L21/44 , H01L21/46 , H01L21/52 , H01L21/60 , H01L21/82 , H01L33/32 , H01L33/40 , H01L33/48 , H01L33/00
CPC分类号： H01L24/82 , G09F9/33 , G09F9/35 , H01J9/02 , H01J2217/49 , H01L24/18 , H01L2221/68359 , H01L2221/68368 , H01L2224/18 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/3025 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method which allows efficiently and accurately transferring a device. SOLUTION: The method comprises a step of enabling the separation of devices to be transferred among a plurality of devices 3 which are arranged and fixed on a first substrate 1 from the first substrate 1, and a step of transferring the devices 3 separable from the first substrate 1 on a second substrate 4 provided with a bonding layer 6. The device transferring method allows the separation of the devices 3 to be transferred from the first substrate 1 in advance, and the only separable devices are transferred to the second substrate. With this configuration, it becomes possible to surely transfer only desired devices from the first substrate 1 to the second substrate 4.
摘要翻译：要解决的问题：提供一种允许有效且准确地传送设备的方法。解决方案：该方法包括以下步骤：从第一基板1分离在第一基板1上布置和固定的多个装置3之间要传送的装置，以及将可从第一基板1分离的装置3转移的步骤衬底1设置在具有接合层6的第二衬底4上。器件转移方法允许预先从第一衬底1分离要传送的器件3，并且仅将可分离器件转移到第二衬底。利用这种构造，可以将仅从第一基板1到第二基板4的所需的装置确实地传送。

39. 发明专利

JP2003051616A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2003051616A
公开(公告)日：2003-02-21
申请号：JP2001235793
申请日：2001-08-03
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI
IPC分类号： H01L25/075 , H01L25/16 , H01L33/32 , H01L33/40 , H01L33/62 , H01L33/00
CPC分类号： H01L25/167 , H01L25/0756 , H01L33/54 , H01L2224/05554 , H01L2224/16225 , H01L2224/48091 , H01L2224/49171 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an image display device for which an element density, such as pixel density is improved, connection reliability is improved by enlarging a via diameter for wiring without reducing a chip size more than needed, yield is improved, and the request specifications of alignment accuracy of a chip (or element) are reduced by increasing a chip (or element) area and facilitating handling of bonding or the like. SOLUTION: For the image display device, the chip 50 composed of an embedded a light-emitting element 11, such as a GaN-based semiconductor light- emitting element in resin is provided with external terminals 58 and 59 connected to the light-emitting element 11, and a drive control element 55, such as a transistor for pixels for drive control of the light emitting element 11, is connected to the external terminals 58 and 59 in a state of at least partially overlapping with the chip 50.
摘要翻译：要解决的问题：为了提供一种像素密度等元素密度提高的图像显示装置，通过在不减少芯片尺寸的情况下扩大布线的通孔直径来提高连接可靠性，提高产量，通过增加芯片（或元件）面积并促进粘合等的处理来减小芯片（或元件）的对准精度的请求规格。解决方案：对于图像显示装置，由嵌入发光元件11（诸如树脂中的GaN基半导体发光元件）组成的芯片50设置有与发光元件连接的外部端子58和59 如图11所示，并且诸如用于发光元件11的驱动控制的像素用晶体管的驱动控制元件55以与芯片50至少部分重叠的状态连接到外部端子58和59。

40. 发明专利

JP2002368289A Resin forming element, image display, and illumination equipment, and method of manufacturing the same 有权
标题翻译：树脂成型元件，图像显示和照明设备及其制造方法
公开(公告)号：JP2002368289A
公开(公告)日：2002-12-20
申请号：JP2001176643
申请日：2001-06-12
申请人： Sony Corp , ソニー株式会社
发明人： OHATA TOYOJI , IWABUCHI TOSHIAKI , HAYASHI KUNIHIKO , OBA HIROSHI
IPC分类号： F21V5/04 , F21Y101/02 , G09F9/33 , H01L33/22 , H01L33/32 , H01L33/56 , H01L33/00
CPC分类号： H01L2224/24
摘要： PROBLEM TO BE SOLVED: To provide a resin formed element which enables to increase the light extraction efficiency from a light-emitting element and to enlarge angle of visibility, without newly generating a manufacturing cost and a parts cost when manufacturing an image display and illumination equipment, which are formed by arranging resin formed elements, each of which is such that a light- emitting element is coated with a resin, and also to provide an image display and an illumination equipment, and a method of manufacturing the same.
SOLUTION: Unevenness is formed on a light-extracting surface of the resin formed element, and the light extraction efficiency and the expansion of an angle of visibility are increased, by suppressing the total reflection and by light scattering on the light-extracting surface. Since the unevenness can be formed, when releasing the resin formed element from a member for temporary retention, there is no generation of new manufacturing cost or cost for new parts.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种能够提高从发光元件的光提取效率和扩大视觉能力的树脂形成元件，而不会在制造图像显示和照明设备时新生成制造成本和部件成本它们通过布置树脂形成的元件形成，每个树脂形成的元件使得发光元件涂覆有树脂，并且还提供图像显示和照明设备及其制造方法。解决方案：通过抑制全反射和光提取表面上的光散射，在树脂形成元件的光提取表面上形成不均匀性，并且通过抑制全反射和光散射，可以提高光提取效率和可见度的扩大。由于可以形成不均匀性，所以当从用于暂时保持的构件释放树脂形成元件时，新零件不会产生新的制造成本或成本。

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