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    • 34. 发明专利
    • PACKAGE FOR INTEGRATED CIRCUIT
    • JPS63305535A
    • 1988-12-13
    • JP14117987
    • 1987-06-05
    • SUMITOMO ELECTRIC INDUSTRIES
    • GOTO TOMOJIOTSUKA AKIRAYATSU SHUJIJODAI TETSUJI
    • H01L23/12H01L23/06
    • PURPOSE:To obtain an integrated circuit package, loss of which is reduced sufficiently, by forming a signal-line wiring pattern onto glass having a softening point higher than the firing temperature of a superconductor. CONSTITUTION:A signal-line wiring pattern consisting of a superconductor is shaped onto smooth glass. It is preferable that the thickness of glass extends over 1-10mum at that time. Al2O3 3 in 0.1mm thickness is baked, and glass paste having a softening point of 960 deg.C is screen-printed onto the Al2O3 according to the same pattern as a signal conductor, and baked as a process. A superconductor Y-Ba-Cu-O is screen-printed onto the glass paste and baked, and a ruthenium oxide resistor is printed between the signal-lines near a cavity and baked. One end of an electrode for the resistor is connected to the signal conductors, and the other end is connected to a grounding conductor on the surface by a through-hole. Only a pair of the signal conductors are connected to superconductors 1 on glass in 0.1mm line width in the vicinity of the cavity. Accordingly, loss can be reduced by shaping a wiring pattern onto glass.
    • 38. 发明专利
    • SUPERCONDUCTIVE WIRE MATERIAL AND ITS MANUFACTURE
    • JPS63274026A
    • 1988-11-11
    • JP10811587
    • 1987-05-01
    • SUMITOMO ELECTRIC INDUSTRIES
    • HARADA KEIZOIMAI TAKAHIROYATSU SHUJIJODAI TETSUJI
    • B28B1/00C23C14/08C23C14/24H01B12/06H01B13/00
    • PURPOSE:To make it possible to manufacture a superconductive wire material of a high critical temperature Tc and an even composition by vacuum evaporating an oxide including Ba, Y, and Cu at a metallic inner wall, and forming a membrane of a perovskite structure oxide over the inner wall. CONSTITUTION:By carrying out a vacuum evaporation by using a mixture or an alloy including Ba, Y, and Cu as the vacuum evaporation source, a superconductive membrane of a perovskite structure oxide or a quasiperovskite structure oxide is formed on the inner wall of a metal pipe. The mixture or the alloy for the vacuum evaporation source is a sintered material made by sintering Ba, Y, and Cu powders, or an alloy made by melting such powders, and the sintered material has a better evaporation efficiency and gives a higher membrane producing speed. As the vacuum evaporation source 1, a wire material made by mixing and melting powders of Ba, Y, and Cu making the atomic ratio, Ba/(Ba+Y)=0.3, for example, is used. As the metal pipe 2, an Au pipe with the inside diameter 5.0 mm, and with the length a little shorter than the wire material of the vacuum evaporation source is used. Consequently, a superconductive wire material with the Tc much higher than that of the conventional superconductor can be manufactured easily and securely.