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31. 发明专利

JPH11233375A CHIP CAPACITOR AND METHOD OF MANUFACTURING THE SAME 失效
公开(公告)号：JPH11233375A
公开(公告)日：1999-08-27
申请号：JP4889698
申请日：1998-02-12
申请人： HOKURIKU ELECT IND
发明人： AZUMA KOJI , ISHIYAMA ICHIRO , NAGARE ICHIRO , YAMAZAKI MORIKATSU
IPC分类号： H01G4/33
摘要： PROBLEM TO BE SOLVED: To provide with a simple structure a chip capacitor and a method of manufacturing the same, capable of laminating satisfactory ferroelectric film at a relatively low temperature. SOLUTION: A given lower electrode 12 is formed on the surface of an insulative substrate 10 and a titanium film 14 is prepared on the surface of the low electrode 12. A galvanically formed crystalline ferroelectric film 16 is formed on the surface of the titanium film 14 and an upper electrode 18 is set facing opposite to the lower electrode 18 by interposing the ferroelectric film 16. The lower electrode 12 and the upper electrode 18 are connected respectively to an end electrode 24, comprising a conductive resin and set on each end section of each substrate 10.

32. 发明专利

JPH11185579A PROTECTING ELEMENT 失效
公开(公告)号：JPH11185579A
公开(公告)日：1999-07-09
申请号：JP36449697
申请日：1997-12-17
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , MOTOKI MIKIZO , NAKAYAMA TAKAYUKI , SHIMADA MASATO
IPC分类号： H01H37/76 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a protecting element in a simple structure having both overcurrent and heat protecting function. SOLUTION: A conductor 18 and a fuse reagent 20 to coat the conductor 18 are provided on the surface of a first insulating substrate 12 and a second substrate 14 with a heating element 27 is provided facing the first substrate 12. In such a structure, the heat of the heating element 26 provided on the second substrate 14 allows the increasing temperature of the fuse reagent 20 on the surface of the first substrate 12 faced thereto so that metal in the conductor 18 provided on the first conductor 12 can be diffused into the fuse reagent 20 to break the continuity of the conductor 18.

33. 发明专利

JPH117857A MEMBRANE SWITCH 失效
公开(公告)号：JPH117857A
公开(公告)日：1999-01-12
申请号：JP17770297
申请日：1997-06-17
申请人： DENSO CORP , HOKURIKU ELECT IND
发明人： ARIGA KATSUHIKO , TERAOKA MASAYASU , MOTOKI MIKIZO , YOKOE TETSUJI , ISHIYAMA ICHIRO
IPC分类号： H01H13/52 , B60Q5/00 , B60R21/215 , B60R21/2165 , H01H1/023 , H01H1/04 , H01H11/04 , H01H13/70 , H01H13/712 , H01H13/785 , H05K1/09 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To reduce the initial contact resistance value of a membrane switch and the increasing rate thereof with the elapse of time. SOLUTION: In this switch 100, flexible printed boards 1, 2 are formed by forming conductor layers 12, 22 consisting of Ag and containing a resin polymer as a binder on base films 11, 21, and printing and forming contact parts 13, 23 formed of an alloy particle by coprecipitation of Ag and Pd and containing a resin polymer as a binder thereon so as to cover the conductor layers 12, 22. The contact parts 13, 23 are arranged opposite to each other, and a spacer 3 is arranged between them. Thus, the contact parts 13, 23 are held with a prescribed space. The composition ratio of Ag in the alloy particle, the particle size of the alloy particle and the composition ratio of the alloy particle in the contact parts 13, 23 are set to 50-97 wt.%, 0.5-5.0 μm, and 91-95 wt.%, respectively, whereby the contact resistance of the contact parts 13, 23 can be minimized to realize a current carrying of about several hundreds mA. The corrosion resistance of the contact parts 13, 23 can be enhanced by including Pd, and the increasing ratio of contact resistance by the deterioration with the lapse of time can be reduced.

34. 发明专利

JPH10233565A CIRCUIT BOARD WITH ELECTRIC PART AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JPH10233565A
公开(公告)日：1998-09-02
申请号：JP34774497
申请日：1997-12-17
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , NAGARE ICHIRO , YAMAZAKI MORIKATSU
IPC分类号： H05K1/16 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit board with an electric part with an electric element which is smaller than a conventional one. SOLUTION: A circuit pattern 5 wherein a pair of connecting electrodes 3, 3 are included is formed in a surface of a board 1 formed of an insulation material. A photoresist film 7 is formed in a surface of the board 1. One or more electric element formation hole parts 9 are formed in the photoresist film 7 by adopting lithography technique to expose at least a part of a pair of connecting electrodes 3, 3. The electric element formation hole part 9 is charged with electric element formation paste material, and an electric element 13 is formed. A protection film 15 is formed by using synthetic resin material to stop up the electric element formation hole part 9.

35. 发明专利

JPH10233485A COMPOSITE CHIP COMPONENT 失效
公开(公告)号：JPH10233485A
公开(公告)日：1998-09-02
申请号：JP3782897
申请日：1997-02-21
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , NOMURA KAZUO
IPC分类号： H01C13/00 , H01C17/22 , H01F41/00 , H01G4/255 , H01L27/01 , H01L49/00 , H03H7/06 , H05K1/14 , H05K1/16 , H05K1/18 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a composite chip component wherein a printed resistor, a printed capacitor and an inductor are formed on a chip-shaped substrate, by a method wherein a conductive pattern for inductor formation is arranged on one composite chip component in addition to the printed resistor and the printed capacitor. SOLUTION: This composite component has a conductive pattern 2 for inductor formation a printed capacitor 3, each electrical element of a printed resistor 4, electrodes E1 to E4 for soldering, a connection part C, and a conductive part on a chip-shaped substrate 1. The pattern 2, the capacitor 3 and each electrical element of the resistor 4 are arranged on the same surface of the substrate 1 in such a way as to constitute a circuit wherein the pattern 2 and the resistor 4 are connected in series between the electrodes E1 and E3 , one end of the capacitor 3 is connected with the connection part C and the other end of the capacitor 3 is connected with the electrode E2 constituting an earth electrode.

36. 发明专利

JPH10214722A CHIP COMPONENT 失效
公开(公告)号：JPH10214722A
公开(公告)日：1998-08-11
申请号：JP1819297
申请日：1997-01-31
申请人： HOKURIKU ELECT IND
发明人： NOMURA KAZUO , ISHIYAMA ICHIRO
IPC分类号： H01F17/00 , H01G4/40 , H03H5/02
摘要： PROBLEM TO BE SOLVED: To obtain a chip component superior to productivity and mass production capability and provided with an inductor capable of easily controlling trimming part. SOLUTION: An electric conductive pattern 3 for forming the first inductor is formed on one face of a chip substrate 1, and an electric conductive pattern 5 for forming the second inductor is formed on the other face of the chip substrate 1. The electric conductive patterns 3 and 5 for forming the first and the second inductor respectively have trimming parts 3b and 5b at the center of the convolution 3a and 5a respectively. The trimming parts 3b and 5b are formed in the area capable of extending the length of the convolution. The conductive pattern 3 for forming the first inductor is electrically connected to the conductive pattern 5 for forming the second inductor by a through hole connection conductor 4 penetrating the chip substrate 1.

37. 发明专利

JPH09186001A MULTIPLE CHIP ELECTRONIC COMPONENT AND ITS MANUFACTURE 失效
公开(公告)号：JPH09186001A
公开(公告)日：1997-07-15
申请号：JP35368395
申请日：1995-12-29
申请人： HOKURIKU ELECT IND
发明人： AZUMA KOUJI , NAGARE ICHIRO , ISHIYAMA ICHIRO , KUROKAWA HIROYUKI
IPC分类号： H01C13/02 , H01C7/00
摘要： PROBLEM TO BE SOLVED: To facilitate multilayer promotion and dividing of a board so as to prevent the occurrence of break, etc., of an electrode, by forming a plurality of electrodes inside the recess of a board consisting of a synthetic resin film, and connecting a plurality of electronic elements on the surfaces of these electrodes. SOLUTION: On both sides of the board 12 consisting of a synthetic resin film such as heat-resistant resin such as PPS, PBT, etc., a plurality of recesses 14 made by dividing through holes are counterposed to each other, and in these recesses 14, the electrodes 16 consisting of a plurality of metallic films are made in a U shape in a cross section by vacuum deposition or sputtering. Then, conductive paste is printed to form an electrode 18, and resistors 20 as a plurality of electronic elements are printed astride the electrodes 18. Overcoats 22 are made on the surface and rear of those resistors 20. Hereby, multilayer promotion can be made easily, and the dividing of the board is also easy, and the occurrence of break, etc., of the electrode 16 can also be prevented.

38. 发明专利

JPH09181455A SUBSTRATE FOR OSCILLATION CIRCUIT 失效
公开(公告)号：JPH09181455A
公开(公告)日：1997-07-11
申请号：JP35023095
申请日：1995-12-21
申请人： HOKURIKU ELECT IND
发明人： NAGARE ICHIRO , AZUMA KOUJI , ISHIYAMA ICHIRO , KUROKAWA HIROYUKI
IPC分类号： H05K3/46 , H03B1/00 , H03B5/02
摘要： PROBLEM TO BE SOLVED: To suppress a leakage current due to stray capacitance by a method wherein there is provided a capacitor having a pair of electrodes across an insulating substrate high in dielectric constant, a low dielectric constant substrate having smaller dielectric constant than that of the insulating substrate is stacked on a high dielectric constant substrate, and circuit patterns are formed on the front and back faces across both the substrates. SOLUTION: After an insulating substrate 12 is formed with resin of high dielectric constant and a circuit pattern 13 of copper foil is formed, an electric 16 forming a capacitor 14 facing an electrode 15 is formed on the reverse face side. An insulating substrate 20 of low dielectric constant is stacked on a reverse face of the substrate 12, and a circuit pattern 23 is formed on a face on the opposite side of the connection face. When an area of a portion being a generation cause stray capacitance by the circuit patterns 13, 23 is 4mm , the capacitance is represented by CS2 =εS.εO.S/d=1.35pF, it is 2.84pF in the prior art. When a voltage applied to the stray capacitance portion is V, a leakage current is represented by Ics=V/(1ωcs)=0.544 (conventional ratio) and the leakage current is improved by 46.5% to suppress the leakage current.

39. 发明专利

JPH08316096A LASER TRIMMABLE CAPACITOR AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JPH08316096A
公开(公告)日：1996-11-29
申请号：JP13987995
申请日：1995-05-15
申请人： HOKURIKU ELECT IND
发明人： ENDO TOSHIO , NAGARE ICHIRO , ISHIYAMA ICHIRO , KUROKAWA HIROYUKI
IPC分类号： B23K26/00 , B23K26/351 , B23K26/361 , H01G4/255
摘要： PURPOSE: To attain an easy and accurate adjustment of the capacitance by a simple step of process. CONSTITUTION: Electrodes 14 and 15 such as Cu foils are mutually oppositely disposed on the front and back faces of an insulative substrate 12 to form a capacity. Either electrode 14 or 15 to be trimmed is formed like a comb web and the width of the comb web part 14b of the electrode 14 decreases in the trimming direction.

40. 发明专利

JPH08236113A ELECTRODE FOR LITHIUM ION SECONDARY BATTERY AND COMPOSITION FOR MANUFACTURING SOLID ELECTROLYTE 失效
公开(公告)号：JPH08236113A
公开(公告)日：1996-09-13
申请号：JP6343495
申请日：1995-02-27
申请人： TOYAMA PREFECTURE , COSEL USA INC , HOKURIKU ELECT IND , NISSAN CHEMICAL IND LTD
发明人： YANO KATSUMI , FUTAKUCHI TOMOAKI , MIMURA KATSUAKI , ISHIYAMA ICHIRO , YAGI SHINSUKE
IPC分类号： H01M4/131 , H01M4/1391 , H01M10/0565 , H01M4/58 , H01M4/02
摘要： PURPOSE: To provide a lithium ion secondary battery with light weight and high capacity by adding a specific compound, a curing agent for epoxy resin, tin oxide, and a lithium compound. CONSTITUTION: 1,3-diglycidyloxy-2-(2'-cyanoethyl)oxpropane, a curing agent for epoxy resin, a lithium compound, and tin oxide are mixed in a weight ratio of (5-20):(0.25-3):(95-80):(8.6-7.2) to prepare an electrode composition for a lithium ion secondary battery. The composition to which a reaction product of polyethlene glycol and lithium perchlorate and carbon black having a particle size of about 0.1μm is added if necessary and after being mixed they are molded, heated at 50-120 deg.C for 1-0.5hr for curing to obtain an electrode for a lithium ion secondary battery having a volume resistivity of 3-10Ω/cm.

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