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31. 发明专利

JPH09172298A ELECTRONIC PARTS MOUNTING DEVICE 失效
公开(公告)号：JPH09172298A
公开(公告)日：1997-06-30
申请号：JP32932295
申请日：1995-12-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INUZUKA RYOJI , OE KUNIO , NAKANO TOMOYUKI , NAGAI YOSHIYUKI , SAKON HIDEO
IPC分类号： B23P21/00 , H05K13/00 , H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To shorten time required to switch the type of a production substrate, to improve the working rate of the equipment and to improve productivity by automatically switching a system to a corresponding supporting part among the plural supporting parts in accordance with the switching of the type of the substrate. SOLUTION: The substrate mounting electronic part is transported above the supporting block (supporting part) 8 where plural supporting pins 7 are arranged by a transportation belt 6. At that time, a substrate detection sensor and the like detect that the substrate reaches a prescribed position on the supporting part 8. The plural supporting parts 8 supporting the substrate are provided and a system is automatically switched to the corresponding supporting part 8 among the plural supporting parts in accordance with the switching of the type of the production substrate. Thus, the necessary time of the switching of the type of the production substrate is shortened, the working rate of equipment can be improved and productivity on the mounting of the electronic parts can be improved.

32. 发明专利

JPH0557240A METHOD FOR APPLYING ADHESIVE 失效
公开(公告)号：JPH0557240A
公开(公告)日：1993-03-09
申请号：JP21748191
申请日：1991-08-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INUZUKA RYOJI , KAWAI MAKOTO , SATO KENICHI , NAKANO TOMOYUKI
IPC分类号： B05D1/26 , B05D7/24 , H05K3/34
摘要： PURPOSE:To uniformly discharge an adhesive from plural coating nozzles and to accurately apply the adhesive even on a subminiature chip at the time of applying the adhesive for sticking an electronic part to the printed board, etc. CONSTITUTION:An adhesive is temporarily applied from coating nozzles 1, 2 and 3 before the adhesive is actually applied, a recognition camera 4 is moved onto the temporarily applied adhesive, the picture of adhesive is taken by the camera 5 after the waiting time preset for the respective nozzles 1, 2 and 3, and the area of the adhesive is obtained from the recognized picture to set the actual coating time. Consequently, the time from the application of the adhesive until the picture is taken is made constant, and the adhesive is uniformly discharged.

33. 发明专利

JPH04188887A APPLICATION METHOD OF ELECTRONIC COMPONENT FIXING ADHESIVE AGENT 失效
公开(公告)号：JPH04188887A
公开(公告)日：1992-07-07
申请号：JP31849090
申请日：1990-11-22
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKANO TOMOYUKI , INUZUKA RYOJI , SATO KENICHI , KAWAI MAKOTO
IPC分类号： H05K3/34 , B05C5/00 , B05D1/26
摘要： PURPOSE:To enable a constant amount of adhesive agent to be applied by a method wherein air is controlled in flow rate by pressure inside a syringe and an air piping. CONSTITUTION:An application time of Xms and a pressure of Y/kgf/cm are given to a adhesive agent storage syringe 9 to enable it to discharge adhesive agent. When an application time of 40 ms and a pressure of Y/kgf/cm are given to the adhesive agent storage cylinder 9, the pressure applied to the syringe 9 is detected by a pressure gauge 13, a time required for the pressure to reach to a prescribed pressure of Y2/kgf/cm is obtained, and the time is converted into signals which are sent to a servo valve actuator 12. If a time required for reaching to a pressure of Y2/kgf/cm is longer than a set time, a certain signal is sent to the servo valve actuator 12 to enhance a speed control unit 11 in air volume, an air piping 10 of the unit 11 is changed in cross-sectional area basing on the inputted analog value to adjust air flow rate. By this setup, adhesive agent can be applied constant in volume.

34. 发明专利

JP2006019482A Substrate support mechanism, substrate support method, component mounting device using the mechanism and method, and component mounting method 有权
标题翻译：基板支持机构，基板支持方法，使用机构和方法的组件安装设备和组件安装方法
公开(公告)号：JP2006019482A
公开(公告)日：2006-01-19
申请号：JP2004195461
申请日：2004-07-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ISHITANI YASUYUKI , NAKANO TOMOYUKI , KAWAGUCHI TERUO , SASAKI MASARU
IPC分类号： H05K13/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a durable and reliable substrate support mechanism which eliminates the need for replacing holder pins and is capable of adjusting the height of the holder pin during component mounting, and to provide a method therefor. SOLUTION: The substrate support mechanism comprises holder pins 24 for abutting a circuit board 8 by the energizing power of springs 27 to support the circuit board 8 at that height, a lock plate 22 for laterally pressing the motion of the holder pins 24 to locking up them, and a pair of plates 21, 23 which are disposed on both sides of the lock plate 22 in the longitudinal direction of the holder pins 24. The holder pins 24 through the three plates abut the circuit board 8 to adjust the height. Thereafter, only the lock plate 22 located in the center of the three plates moves toward the direction perpendicular to the longitudinal axis of the holder pin 24, thereby locking up the holder pins 24. The locking up is preferably performed via through holes 31 of the lock plate 22 and elastic materials 32 disposed between the holder pins 24. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供耐用且可靠的基板支撑机构，其不需要更换保持销，并且能够在部件安装期间调整保持销的高度，并提供其方法。解决方案：基板支撑机构包括用于通过弹簧27的激励力抵抗电路板8的支架销24，以支撑在该高度处的电路板8，用于横向按压支架销24的运动的锁定板22 以锁定它们，以及一对板21,23，它们在保持销24的纵向方向上设置在锁定板22的两侧。通过三个板的保持器销24邻接电路板8以调整高度。此后，仅位于三个板的中心的锁定板22朝着与保持销24的纵向轴线垂直的方向移动，从而锁定保持销24。锁定优选通过锁定板22和设置在保持器销24之间的弹性材料32.版权所有（C）2006，JPO＆NCIPI

35. 发明专利

JP2006013120A Defect cause investigating system 审中-公开
标题翻译：缺陷原因调查系统
公开(公告)号：JP2006013120A
公开(公告)日：2006-01-12
申请号：JP2004187669
申请日：2004-06-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAKANO TOMOYUKI , KAWAGUCHI TERUO , ISHITANI YASUYUKI , SASAKI MASARU , OKA SUSUMU
IPC分类号： H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a system and a method which efficiently investigates the cause of a defect occurred in continuously processing a plurality of products, using a cheap apparatus. SOLUTION: The system temporarily saves continuous images obtained by high speed photographing of a processing operation, photographs a processed product, compares the photographed product image with a previously recognized non-defective product image to decide the existence of any defect, successively saves the temporary saved continuous images for investigating the cause of a defect if found, or may erase the continuous images if any defect is not found, thus enabling the successive acquisition of continuous images with a limited memory capacity. A condition photographing camera 21 takes images during processing; an inspective camera 23 takes images after processing; and a controller 25 decides the existence of any defect, decides whether the images are saved or erased, and controls the entire system. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种系统和方法，其使用便宜的装置有效地研究在连续处理多个产品中发生的缺陷的原因。
解决方案：系统暂时保存通过处理操作的高速拍摄获得的连续图像，对已处理产品进行拍照，将拍摄的产品图像与先前识别的无缺陷产品图像进行比较，以确定是否存在任何缺陷，并连续保存用于调查发现原因的临时保存的连续图像，或者如果没有发现任何缺陷，则可以擦除连续图像，从而能够以有限的存储容量连续获取连续图像。条件拍摄相机21在处理期间拍摄图像; 检查照相机23处理后拍摄图像; 并且控制器25决定是否存在任何缺陷，决定图像是否被保存或被擦除，并且控制整个系统。版权所有（C）2006，JPO＆NCIPI

36. 发明专利

JP2003124693A METHOD FOR MOUNTING COMPONENT AND COMPONENT MOUNTER, AND MOUNTING DATA GENERATING PROGRAM AND RECORDING MEDIUM 审中-公开
公开(公告)号：JP2003124693A
公开(公告)日：2003-04-25
申请号：JP2001311617
申请日：2001-10-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KODERA KOJI , NAKANO TOMOYUKI , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method for mounting a component and a component mounter, and a mounting data generating program and a recording medium in which the production efficiency of electronic circuit board can be enhanced by using a suction head efficiently. SOLUTION: At the time of mounting components sequentially according to mounting data recording a preset mounting order of components, suction heads being used for mounting specified components on small boards are specified collectively by setting one flag in the mounting data and the specified component is sucked by means of the specified suction head and mounted on each small board. Alternatively, the mounting data is set selectively with a case where the suction heads being used for mounting the specified components on small boards are specified collectively and a case where the suction heads are specified individually for respective mounting points.

37. 发明专利

JP2002185117A DEVICE AND METHOD FOR TRANSFERRING VISCOUS FLUID, DEVICE AND METHOD FOR MOUNTING ELECTRONIC PARTS, AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002185117A
公开(公告)日：2002-06-28
申请号：JP2000376265
申请日：2000-12-11
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UCHIDA HIDEKI , KIDO KAZUO , NAKANO TOMOYUKI , KURIBAYASHI TAKESHI , MISAWA YOSHIHIKO
IPC分类号： B23K1/00 , B23K3/06 , B23K101/40 , H05K3/34 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To transfer a viscous fluid to the terminal section of electronic parts before the electronic parts are mounted on a circuit board so as to mount area-array type packages on the circuit board at a high density by improving the space efficiency. SOLUTION: A flat transferred surface of the viscous fluid is formed in a transfer pan 210 by swinging a squeegee unit 12b in which a squeegee for agitation and another squeegee for flattening are fixed following the reciprocating motions of a transfer pan moving mechanism, so that the squeegee for agitation may approach the surface of the transfer pan 210 and agitate the viscous fluid in the pan 210 in the course of the forward journey of the pan 210, and the squeegee for flattening may approach the surface of the pan 210 and level the fluid agitated by means of the squeegee for agitation in the course of the backward journey of the pan 210. Then the viscous fluid is transferred to the terminal section of the electronic parts by dipping the terminal section into the flattened transferred viscous fluid and the parts are mounted on a prescribed position of the circuit board.

38. 发明专利

JP2001196794A METHOD AND DEVICE FOR MOUNTING COMPONENT 失效
公开(公告)号：JP2001196794A
公开(公告)日：2001-07-19
申请号：JP2000002745
申请日：2000-01-11
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KODERA KOJI , KURIBAYASHI TAKESHI , NAKANO TOMOYUKI , KIDO KAZUO
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method and device for mounting components by which various kinds of parts can be mounted, without making wrong decision that components are already mounted before the engagement of the parts is completed, reliability of component mounting work can be improved, and mounting forces corresponding to the components can be improved. SOLUTION: In the component-mounting method in which components having a fixing means that is engaged with a fixing section, when a fixed pressing force is applied are mounted on a circuit board 15 on which the fixing section is formed, torque value for detecting collision which is detected as the torque value of the pressing force applied to the parts and used for the discriminating arrival of the parts at the circuit board 15 is set stronger than the fixed pressing force. When the torque value for detecting collision is detected, and in addition, it is detected that the height of the parts from the circuit board 1 reached a prescribed mounted height, it is discriminated that the mounting of the parts on the circuit board 1 is completed.

39. 发明专利

JPH08204387A ELECTRONIC PARTS MOUNTING APPARATUS 失效
公开(公告)号：JPH08204387A
公开(公告)日：1996-08-09
申请号：JP854495
申请日：1995-01-23
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INUZUKA RYOJI , NAKANO TOMOYUKI
IPC分类号： B23P21/00 , H05K13/02
摘要： PURPOSE: To optimize the distance between the substrate waiting position and the mounting position according to the size of the substrate, minimize the substrate entrance-discharge time to improve the facilities productivity by providing a function to change the substrate waiting position according to the size of the substrate being carried, thereby putting this position near the mounting position. CONSTITUTION: A substrate carried from upstream is carried toward a substrate waiting position 22 by actuating a loader belt motor 13 to rotate a loader belt supported with loader pulleys 7-11 through a loader motor timing belt 12. According to the size of the substrate the positions of table pulleys 16 and 17, loader pulleys 7, 9 and 10, and loader side substrate detecting sensor 24 are changeable while the pulleys 15, 18, and 19, table motor 21, pulleys 8, 11 and motor 13 are normally fixed to the same positions.

40. 发明专利

JPH0621693A MOUNTING APPARATUS FOR ELECTRONIC COMPONENT 失效
公开(公告)号：JPH0621693A
公开(公告)日：1994-01-28
申请号：JP17297992
申请日：1992-06-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKANO TOMOYUKI , SATO KENICHI , MURAMAKI KATSUYA , MURATA KAZUHIRO
IPC分类号： B23P21/00 , H05K13/04 , H05K13/08
摘要： PURPOSE:To improve productivity by conducting positional correction of an electronic component and detection of floated lead, eliminating loss time of a mounting tact due to them and shortening the tact. CONSTITUTION:A mounting head 5 has first, second suction nozzles 6, 7 to be independently vertically moved, lead floating detecting means 12, 13 for detecting floating of lead of an electronic component 4 sucked by the nozzles 6, 7, a recognition camera 9, and a mirror box 14 movable so as to selectively transmit an optical image from below the component 4 sucked by the nozzle 6 or 7 to the camera 9. Thus, a mounting tact can be shortened by conducting detection of floating of the lead of the component 4 and correction of its position while the component 4 is being sucked and mounted.

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