会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 33. 发明专利
    • HEAT EXCHANGER WITH ULTRA-COLD TEMPERATURE DEVICE
    • JPS5986892A
    • 1984-05-19
    • JP19599582
    • 1982-11-10
    • HITACHI LTD
    • SHIRAKU YOSHINORIOGATA HISANAO
    • F28D7/08
    • PURPOSE:To obtain a heat exchanger in small size with high efficiency and with low pressure loss, by remarkably increasing the efficiency of fins of a porous plate 8, by constituting a heat exchanger in such a manner that a plurality of porous plates, on which tubes through which hot fluid in high pressure flows, being bend and thermally adhered to the plates, are laminated, and the laminated plates are inserted into a tube through which cold fluid in low pressure flows. CONSTITUTION:A slender tube 9 to flow hot fluid in high pressure is put on a porous plate 8 in the shape of a letter S and is thermally adhered to the plate 8. A heat exchanger is constituted in such a manner that a plurality of porous plates constituted as mentioned above are laminated, connecting slender tubes 9 of each plate to each other, and the laminated plates are inserted into a flow tube 10 in low pressure. The high temperature fluid in high pressure is fed into the tube from an inlet 11, exchanging heat with the cold fluid in low pressure by the intermediary of porous plates 8, and is discharged from an outlet 2.
    • 34. 发明专利
    • SUPERCONDUCTIVE ELECTRONIC DEVICE
    • JPS58166780A
    • 1983-10-01
    • JP4909582
    • 1982-03-29
    • HITACHI LTD
    • SHIRAKU YOSHINORIOGATA HISANAO
    • H01L39/04F17C13/00H01L39/24
    • PURPOSE:To eliminate the generation of foams on the cooling surface as well as to prevent the erroneous operation of the element of the titled electronic device by a method wherein superfluidized helium is used as the cooling medium which will be used to cool a superconductive electronic element. CONSTITUTION:Saturated superfluidized helium 14 is obtained by forcibly evacuating ordinary liquid helium (4.2K-1atm) to the extent that saturated steam pressure is brought down to approximately 38mm.Hg through the intermediary of an exhaust pipe 15 and a pressure adjusting valve 16. The evaporated saturation superfluidized helium 14 is supplied in the state wherein ordinary liquid helium 18 is brought into the temperature of approximately 2.2K using a heat exchanger 19 and adiabatically expanded to the saturated steam pressure of the saturation superfluidized helium 14 using a Joule-Thomson expanding valve 20. A signal transmitting line 9 is connected to the vessel of the saturation superfluidized helium 14 and the vessel of ordinary liquid helium 18 through the intermediary of a hermetic seal 21.
    • 36. 发明专利
    • SUPER LOW TEMPERATURE DEVICE
    • JPS56134786A
    • 1981-10-21
    • JP3745680
    • 1980-03-26
    • HITACHI LTD
    • HAKURAKU YOSHINORIOGATA HISANAO
    • H01L39/04F17C13/00
    • PURPOSE:To greatly decrease the intruding heat by supporting an inner and outer containers heat insulative by a non-metal whose heat conductivity is relatively small and attaching a thin metal film whose heat reflecting factor is relatively good to the surface of the supporting body. CONSTITUTION:The space between the outer container 2 and the inner container 3 are evacuated for heat insulation, and an intermediate partition wall 4 for shileding heat radiation is provided. Liquid He is put in the container 3, and a super conductive device 9 is immersed. The inner container 3, intermediate partition wall 4, and the outer container 2 are supported by heat insulative supporting body 10. The supporing body 10 is composed of three parts, i.e., a high temperature side 11, a low temperature side 12, and intermedite temperature side 13. The part 13 is welded to the wall 4, and the temperature of the part 13 is kept at the same as the temperature of the wall 4. Synthetic resin is used for the supporting body and the low heat conductivity is maintained. Al and the like of about 50-5,000Angstrom are attached to the side of the supporting material 12 on the low temperature side and the heat is reflected. Then, the intruding heat can be greatly reduced, and the heat loss can be decreased.