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    • 32. 发明专利
    • Bending device and bending method
    • 弯曲装置和弯曲方法
    • JP2011083806A
    • 2011-04-28
    • JP2009239311
    • 2009-10-16
    • Mitsubishi Heavy Ind Ltd三菱重工業株式会社
    • YASUI TOYOAKIISHII KENKONNO YUYAKATO YOSHIKUNIYAMASU KAZUSHIGE
    • B21D7/06
    • PROBLEM TO BE SOLVED: To provide a bending device and a bending method, not requiring exchange of a die for every shapes of products and further not generating flaws in a product due to a shape, material quality, or bending R of the product.
      SOLUTION: A bending device 10-1 has a flexible die 11 in which a plurality of metal pieces 11a are disposed in parallel and tip end parts 11b of the metal pieces 11a move forward and backward in the same direction. The bending device 10-1 includes: a pulling pressing means for pressing a workpiece 12 against the flexible die 11 while holding the workpiece 12 in a pulling state; and a band member 13 to be interposed between the flexible die 11 and the workpiece 12.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了提供弯曲装置和弯曲方法,不需要为每种形状的产品更换模具,并且由于形状,材料质量或弯曲R的不同而不会产生产品中的缺陷 产品。 解决方案:弯曲装置10-1具有柔性模11,多个金属片11a平行设置,金属片11a的前端部11b沿相同方向前后移动。 弯曲装置10-1包括:拉伸按压装置,用于在将工件12保持在拉伸状态的同时将工件12压靠在柔性模具11上; 以及插入在柔性模具11和工件12之间的带构件13.版权所有(C)2011,JPO&INPIT
    • 34. 发明专利
    • Lap friction stir joining method and structure manufactured by the method
    • LAP摩擦接合方法和结构由该方法制造
    • JP2010137274A
    • 2010-06-24
    • JP2008318230
    • 2008-12-15
    • Mitsubishi Heavy Ind Ltd三菱重工業株式会社
    • WATABE YUJIROYASUI TOYOAKI
    • B23K20/12
    • PROBLEM TO BE SOLVED: To provide a lap friction stir joining method that can reduce the susceptibility to cracking from a retreating side and to provide a structure manufactured by the method.
      SOLUTION: The lap friction stir joining method comprises lapping a pair of plate materials 1, 2 on top of each other, pressing a tool 3 having a screw 5 part against a lapped part 6 from the surface of one plate material 1 side, and moving the tool 3 along the lapped part 6 to join the pair of plate materials 1, 2 to each other. The tool 3 is rotated in a direction R opposite to a winding direction of the screw 5 to form an advancing side AS on the side opposite to the end 1a of the lapped part 6 of one plate material 1.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种能够降低从后退侧开裂的敏感性并提供通过该方法制造的结构的搭接摩擦搅拌接合方法。

      解决方案:搭接摩擦搅拌接合方法包括在彼此顶部研磨一对板材1,2,从一个板材1侧的表面将具有螺钉5的工具3压靠在搭接部6上 ,并沿着研磨部分6移动工具3,以将一对板材1,2对接。 工具3沿着与螺钉5的卷绕方向相反的方向R旋转,以在与板材1的搭接部6的端部1a相反的一侧形成前进侧AS。版权所有:(C )2010,JPO&INPIT

    • 36. 发明专利
    • Part of rotary machine and rotary machine
    • 旋转机和旋转机的一部分
    • JP2007071032A
    • 2007-03-22
    • JP2005255481
    • 2005-09-02
    • Mitsubishi Heavy Ind LtdNippon Kanizen Kk三菱重工業株式会社日本カニゼン株式会社
    • YASUI TOYOAKIYAMADA YOSHIKAZUHANANAKA KATSUYASUHATA SATOSHITSURUSAKI YUZOISUMI OSAMUSAITO KAZUHIDENEMOTO KENICHISUZUKI YUKIHARU
    • F01D5/28F04D29/30F04D29/38
    • PROBLEM TO BE SOLVED: To effectively restrain sticking of a particulate included in gas in a rotary machine for treating the gas including silica, iron oxide and other particulates. SOLUTION: This moving blade 23 includes a first fluororesin including plating coating film 12 and a second fluororesin including plating coating film 14 formed as a film on this surface. The first fluororesin including plating coating film 12 includes a first fluororesin particle 13P by a first plating matrix 13M, and a part of the first fluororesin particle 13P is also exposed from a surface of the first plating matrix 13M. In the second fluororesin including plating coating film 14, a second fluororesin particle 14P having a diameter smaller than the first fluororesin particle 13P is included in a second plating matrix 13M, and a part of the second fluororesin particle 14P and the first fluororesin particle 13P is also exposed from a surface of the second plating matrix 14M. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了有效地抑制气体中包含的颗粒在用于处理包括二氧化硅,氧化铁和其它颗粒的气体的旋转机械中的粘附。 解决方案:该移动刀片23包括第一氟树脂,其包括镀覆膜12和在该表面上形成为膜的镀覆膜14的第二氟树脂。 包括电镀覆膜12的第一氟树脂包括通过第一电镀基质13M的第一氟树脂颗粒13P,并且第一氟树脂颗粒13P的一部分也从第一电镀基质13M的表面露出。 在包括电镀覆膜14的第二氟树脂中,第二镀层基质13M中包含直径小于第一氟树脂颗粒13P的第二氟树脂颗粒14P,第二氟树脂颗粒14P和第一氟树脂颗粒13P的一部分 也从第二电镀基体14M的表面露出。 版权所有(C)2007,JPO&INPIT