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    • 37. 发明专利
    • PORTABLE RADIO TERMINAL
    • JPH09321521A
    • 1997-12-12
    • JP13802396
    • 1996-05-31
    • HITACHI LTD
    • OKABE HIROSHIKAMIMURA OSAMUTAKEI TAKESHIIMAKADO YOSHITAKA
    • H01Q1/48H01Q1/24H04B1/38H01Q1/46
    • PROBLEM TO BE SOLVED: To provide a technology to mount an antenna inside a case of the portable radio terminal at a low manufacture cost with less electromagnetic interference between a high frequency circuit section and a low frequency circuit section and without reducing a directivity gain of the antenna and causing improper contact of a connector. SOLUTION: The portable radio terminal has a high frequency circuit board 10, a shield case shielding part of the high frequency circuit board 10 electromagnetically and a plate antenna 30 mounted on the high frequency circuit board 10. In this case, a window is formed to the shield case so that part of the face of the high frequency circuit board 10 is exposed, the plate antenna 30 is connected electrically and mechanically onto the high frequency circuit board 10 in the window, part of the shield case is extended and the shield case and a low frequency circuit board 40 are pinched by the case of the terminal to fix them. Thus, the antenna is built in the portable radio terminal without causing increased manufacturing cost or improper contact of the connector, with less electromagnetic interference between a high frequency circuit section and a low frequency circuit section and without directivity gain drop, and the portable radio terminal is realized by improving the performance of miniaturization and container so as to improve the carrying performance.
    • 38. 发明专利
    • HIGH FREQUENCY SIGNAL TRANSMISSION LINE
    • JPH07176917A
    • 1995-07-14
    • JP31788593
    • 1993-12-17
    • HITACHI LTDJAPAN RES DEV CORP
    • HOSOYA MUTSUMIOKA KOREHIROOKABE HIROSHI
    • H01P5/00H01P5/02H01P5/12
    • PURPOSE:To attain easy and excellent transmission without requiring strict impedance matching by providing a capacitive or inductive coupling means for external connection to both ends of a transmission line and specifying the electric length of the transmission line. CONSTITUTION:A low impedance load 2 by capacitive coupling and a bonding wire 3 by inductive coupling are connected to a microstrip line 1 being a transmission line in a chip 4. The electric length L of the transmission line 1 is selected to be a multiple of (2n-1)/4 (n is an integer) such as 1/4 with respect to a wavelength lambdaof a transmission waveform when the capacitive coupling is adopted for one end of the transmission line and the inductive coupling is adopted for the other end of the transmission line in this way and the electric length L of the transmission line 1 is selected to be a multiple of n/2 when the capacitive coupling is adopted for both ends of the transmission line or the inductive coupling is adopted for both ends of the transmission line. A standing wave in which a voltage node is formed at the load 2 and a current node is produced to the bonding wire 3 is produced on the transmission line 1. Thus, no voltage fluctuation takes place in the load 2 and no current fluctuation is caused in the bonding wire 3 whose impedance is high and the transmission characteristic is not affected by the standing wave.
    • 39. 发明专利
    • SIGNAL PROCESSING EQUIPMENT
    • JPH0715048A
    • 1995-01-17
    • JP14883493
    • 1993-06-21
    • HITACHI LTDJAPAN RES DEV CORP
    • OKA IREIHOSOYA MUTSUMIOKABE HIROSHI
    • F25D3/10G06F1/20H01L39/04
    • PURPOSE:To speed up signal processing by installing a cryogenic temperature vessel and a medium low temperature operating electronic circuit inside a medium low temperature vessel, installing a cryogenic temperature operating electronic circuit in the cryogenic temperature vessel, installing a normal temperature operating electronic circuit outside the medium low temperature vessel, and connecting the circuits by using electronic leads. CONSTITUTION:Cryogenic temperature refrigerant 14 is inserted in a a cryogenic temperature vessel 13, and a cryogenic temperature operating electronic circuit 11 is dipped in the refrigerant 14. Thermal shield 25 is installed on the medium low temperature vessel 23, in which medium low temperature refrigerant 24 is inserted. A medium low temperature operating electronic circuit 21 is dipped in the medium low temperature refrigerant 24. A normal temperature operating electronic circuit 12 is installed outside the vessel 23, and the cryogenic temperature operating electronic circuit 11 is connected with the medium low temperature operating electronic circuit 21 by using a first electronic lead 16. The medium low temperature operating electronic circuit 21 is connected with the normal temperature operating electronic circuit 12 by using a second electronic lead 26. The temperature difference between the cryogenic temperature vessel 14 and the medium low temperature refrigerant 24 is reduced, and the thickness of the cryogenic temperature vessel 13 can be reduced, so that the distance between the cryogenic temperature operating electronic circuit 11 and the medium low temperature electronic circuit 21 can be reduced.