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31. 发明专利

JPH01134885A SURFACE PACKAGING METHOD FOR CONNECTOR 失效
公开(公告)号：JPH01134885A
公开(公告)日：1989-05-26
申请号：JP29172287
申请日：1987-11-20
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KATO TOMOYA , SUGITA TADASHI , ISAWA MASAYUKI , AMANO TOSHIAKI
IPC分类号： H01R43/02 , H05K1/00 , H05K1/18 , H05K3/34
摘要： PURPOSE:To package a connector to the surface of a printed circuit board by forming a projection on the board, arranging circuit pattern pads on the projection and soldering the tip of a lead drawn from the back of the connector to the pads. CONSTITUTION:A printed circuit board 21 has a projection part 22 near a connector packaging position and the pad parts 24 of circuit patterns 23 on the top and midslope of the projection part 22. A connector 31 has a lead 32 drawn from the back of a housing 33 in the same direction as the surface of the printed circuit board 21, and each of upper and lower leads 32 is so cut as to have a length suitable for reaching an upper pad part 24 and a lower pad part 24. The packaging of the connector 31 is made in such a way that after cream solder is applied to the pad part 24 of the printed circuit board 21, the connector 31 is located at the predetermined position and in this state, the pad part 24 and the lead part 32 are soldered to each other through a reflow furnace.

32. 发明专利

JPS62281399A MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPS62281399A
公开(公告)日：1987-12-07
申请号：JP12328786
申请日：1986-05-30
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI KENZO , FUKUNAGA TAKAO , AMANO TOSHIAKI
IPC分类号： H05K3/46 , H05K1/09

33. 发明专利

JPS62281396A METHOD OF METALLIZING CONDUCTIVE PASTE CIRCUIT 失效
公开(公告)号：JPS62281396A
公开(公告)日：1987-12-07
申请号：JP12328586
申请日：1986-05-30
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI KENZO , FUKUNAGA TAKAO , AMANO TOSHIAKI
IPC分类号： H05K3/24 , H05K3/34

34. 发明专利

JPS62193194A ELECTRONIC CIRCUIT STRUCTURE 失效
公开(公告)号：JPS62193194A
公开(公告)日：1987-08-25
申请号：JP3283286
申请日：1986-02-19
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI KENZO , AMANO TOSHIAKI , KATO TOMOYA
IPC分类号： H05K3/46 , H05K1/18

35. 发明专利

JP2000049197A BUMP TAPE CARRIER AND PRODUCING METHOD THEREFOR 失效
公开(公告)号：JP2000049197A
公开(公告)日：2000-02-18
申请号：JP11225499
申请日：1999-04-20
申请人： FURUKAWA ELECTRIC CO LTD
发明人： AMANO TOSHIAKI , ASADA TOSHIAKI , HAMADA MASAKAZU
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a bump tape carrier where there is no formation of a bridge between metal bumps, even if a pitch between the metal bumps is the narrowest. SOLUTION: This bump carrier for mounting semiconductor chips on a circuit board is constituted of insulating films 11, conductive patterns 12 which are formed on the insulating films 11, and metal bumps 13 which are formed on the conductive patterns 12 and are used to connect to semiconductor chips. Each metal bump 13 has a columnar shape which actually has a vertical side against each surface of the conductive patterns 12.

36. 发明专利

JPH11340276A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11340276A
公开(公告)日：1999-12-10
申请号：JP14775498
申请日：1998-05-28
申请人： FURUKAWA ELECTRIC CO LTD
发明人： ASADA TOSHIAKI , AMANO TOSHIAKI , HAMADA MASAKAZU
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device with high connection reliability for preventing a bump from flowing onto a conductor pattern at the time of melting, a semiconductor chip is mounted on a tape carrier with the bump. SOLUTION: This manufacturing method of the semiconductor device is composed of joining the semiconductor chip 21 onto the tape carrier with the bump, for which a metal bump 13 is composed of a columnar body provided with a side face practically vertical to the surface of a conductor pattern 12. It is provided with a process for coating flux to the electrode surface of the semiconductor chip 21 or the peak part of the metal bump 13, a process for positioning the semiconductor chip 21 and the tape carrier so as to make the electrode of the semiconductor chip 21 correspond to the metal bump 13 of the tape carrier, a process for fixing the electrode of the semiconductor chip 21 and the metal bump 14 of the tape carrier by a fixing material 23, and a process for heating and melting the metal bump 13 of the tape carrier and connecting the electrode of the semiconductor chip 21 and the metal bump 13 of the tape carrier.

37. 发明专利

JPH07249725A SURFACE MOUNTING ELECTRONIC DEVICE 失效
公开(公告)号：JPH07249725A
公开(公告)日：1995-09-26
申请号：JP6643694
申请日：1994-03-11
申请人： FURUKAWA ELECTRIC CO LTD
发明人： AMANO TOSHIAKI
IPC分类号： H01L21/60 , H01L23/04 , H01L23/50
摘要： PURPOSE:To obtain an electronic device having lead pitch similar to that of a TCP type device and can be surface mounted on a printed board similarly to other electronic devices by turning down a film-like lead member, on the outer end side, around the frame body and securing the lead member in place. CONSTITUTION:Since lead member 3 is turned clown around the frame body 5 and secured in place, it is not deformed and the pitch of a film-like lead member 1, e.g. 0.3mm, can be ensured. Since the leads 3 are arranged at a predetermined pitch on the rear surface of the frame body 5, the leads 3 can be surface mounted, as they are, on a printed circuit board. Consequently, an electronic device which can be surface mounted, at a lead pitch as short as 0.3mm or less, on a printed circuit board similarly to other electronic devices can be obtained. Since an individual mounter or a metal mold required for manufacturing a conventional TCP type device can be eliminated, the mounting cost can be reduced significantly.

38. 发明专利

JPH05129765A WIRING BOARD 失效
公开(公告)号：JPH05129765A
公开(公告)日：1993-05-25
申请号：JP31751491
申请日：1991-11-05
申请人： FURUKAWA ELECTRIC CO LTD
发明人： NAKAMURA NOBUYUKI , SHOJI NORIYUKI , ASADA TOSHIAKI , AMANO TOSHIAKI
IPC分类号： H05K3/28
摘要： PURPOSE:To obtain a wiring board which is kept high in electrical reliability without deteriorating in adhesion between an insulating layer and an insulating film and inducing migration even if it is used in a hot and high humidity environment. CONSTITUTION:A first insulating layer 12, a silver conductive circuit 13, and a second insulating layer 14 are successively provided onto an insulating film 11 for the formation of a wiring board, where the first and the second insulating layer, 12 and 14, are formed of resin intimate mixture composed of 90-10% by weight of novolac epoxy resin and/or bisphenol epoxy resin and 10-90% by weight of multifunctional maleimid, hardening agent, and resin composition which contains inorganic filler as an integral component.

39. 发明专利

JPH0478196A THREE-DIMENSIONAL CIRCUIT BOARD WITH SHIELDING LAYER 失效
公开(公告)号：JPH0478196A
公开(公告)日：1992-03-12
申请号：JP19056690
申请日：1990-07-20
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： AMANO TOSHIAKI , INAGAKI MITSUO , MISHIRO EIJI , AZUMAGUCHI YUTAKA
IPC分类号： H05K9/00
摘要： PURPOSE:To eliminate a gap of a circuit film and to obtain an effectively shielding effect by lapping the superposing margins of the film at a seam of the film when the film is bent and a case is composed by a case wall plate. CONSTITUTION:When a case is composed of a case wall plate 26 by bending a circuit film 22 at the bridge A of the plate 26, superposing margins 27c, 27d of the film are provided at parts C, D of the film 22 to be as seams. The margin 27c of the part C to become the seam of the sidewalls of the case is formed continuously without seam on the way, and when the case is composed of the plate 26, the margin 27c is folded in a bag state to be lapped, thereby providing an effectively shielding effect.

40. 发明专利

JPH0296389A DOUBLE-SIDE PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH0296389A
公开(公告)日：1990-04-09
申请号：JP24742588
申请日：1988-10-03
申请人： FURUKAWA ELECTRIC CO LTD
发明人： AMANO TOSHIAKI , SHIROISHI HIROKAZU , OWAKI JUNPEI
IPC分类号： H05K1/11 , H05K1/09 , H05K3/40
摘要： PURPOSE:To manufacture the title circuit board at low cost by forming a circuit pattern composed of a metallic foil onto one surface of an insulating sheet and shaping a circuit pattern consisting of conductive paste onto the other surface. CONSTITUTION:A circuit pattern 3 made up of a copper foil is formed onto one surface of an insulating film 1 through adhesives 2, and a circuit pattern 4 composed of conductive paste is shaped onto the other surface. The circuit patterns 3, 4 on both surfaces are conducted by a through-stud 5 formed by filling a hole penetrated through the insulating film 1 and the copper-foil circuit pattern 3 with conductive paste. The plating 6 of copper, nickel or the like is executed onto the surface of the conductive-paste circuit pattern 4. Accordingly, a single-side metallic foil-clad board at low cost can be used, and can be shaped simply at low cost through normal screen printing and heating.

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