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31. 发明专利

JPS5669723A METHOD OF MANUFACTURING INSULATED ELECTRIC WIRE 失效
公开(公告)号：JPS5669723A
公开(公告)日：1981-06-11
申请号：JP14617979
申请日：1979-11-12
申请人： FUJIKURA LTD
发明人： SUZUKI TAKAO , MAEJIMA SEIJIYU , SARUWATARI KOUICHI , TANAKA KATSUMARO
IPC分类号： H01B13/16 , C23C22/63 , H01B13/06

32. 发明专利

JPS54100998A MANUFACTURE OF LIQUID ALUMINIUM SULFATE 失效
公开(公告)号：JPS54100998A
公开(公告)日：1979-08-09
申请号：JP777778
申请日：1978-01-26
申请人： FUJIKURA LTD
发明人： SARUWATARI KOUICHI , ISHIMATA KAZUO , MAEJIMA SEIJIYU , SUZUKI TAKAO , SAITOU TAKESHI
IPC分类号： C01F7/74
摘要： PURPOSE:To easily manufacture pure aluminium sulfate safely by the procedure in which finely divided aluminium hydroxide powder is added to a sulfuric acid aqueous solution, and also the heating temperature of sulfuric acid bath is selected properly. CONSTITUTION:Finely divided aluminium hydroxide powder of an average grain size of 600 mesh or less is dissolved in a sulfuric acid solution, and then the solution is kept at 50 to 70 deg.C at the early stage. Then, after reaching pH 2.0 to 2.5 and approx. 90% of reaction rate in particular, the temperature is raised to 80 to 95 deg.C and kept in the temperature range to complete the reaction, whereby liquid aluminum sulfate is obtained. As a result, the reaction of sulfuric acid and aluminum sulfate can be advanced at a temperature lower than the conventional methods and thus danger due to bumping and scattering can be prevented and also turbidless, transparent liquid aluminium sulfate can be obtained.

33. 发明专利

JPS5324437A METHOD OF MAKING GUIDE PINS 失效
公开(公告)号：JPS5324437A
公开(公告)日：1978-03-07
申请号：JP9794176
申请日：1976-08-17
申请人： FUJIKURA LTD
发明人： MAEJIMA SEIJIYU , ISHIKI KAZUO , ENDOU YUKIO , SARUWATARI KOUICHI , SUZUKI TAKAO
IPC分类号： B65H51/00 , B21G3/00 , B65H57/08 , B65H57/24 , C25D11/04 , D01H13/04

34. 发明专利

JPS5134860A DO KOKUENKEIFUKUGOFUNTAI NO SEIZOHOHO 失效
公开(公告)号：JPS5134860A
公开(公告)日：1976-03-24
申请号：JP10679374
申请日：1974-09-18
申请人： FUJIKURA LTD
发明人： ASAKA MASATOSHI , SUZUKI TAKAO , ISHIKI KAZUO
IPC分类号： C22B15/00 , B22F9/00 , B22F9/20

35. 发明专利

JPH04129287A ENAMELED SUBSTRATE WITH SCREWED PART 失效
公开(公告)号：JPH04129287A
公开(公告)日：1992-04-30
申请号：JP24862790
申请日：1990-09-20
申请人： FUJIKURA LTD
发明人： OKUYAMA HITOSHI , YAJIMA KIYOSHI , SUZUKI TAKAO , ITOU MASANORI , URUGA KENICHI
IPC分类号： H05K1/05
摘要： PURPOSE:To avoid an accident such as cut of a circuit by providing a screwed part having a groove having no enameled layer for isolating from each other between a conductor circuit region of an enameled substrate and the screwed part of the substrate. CONSTITUTION:Threaded holes 4 are formed at both ends of an enameled substrate 1. A groove 6 is so formed by cutting an enameled layer of the part by sand-blasting as to isolate the conductor circuit region 2 of the substrate 1 and a screwed part 7. Thus, a crack 8 in the enamel due to screw clamping does not affect the circuit part and safety and the circuit part is assured.

36. 发明专利

JPH0446671A SOLDER REFLOW METHOD AND APPARATUS THEREOF 失效
公开(公告)号：JPH0446671A
公开(公告)日：1992-02-17
申请号：JP14994790
申请日：1990-06-11
申请人： FUJIKURA LTD
发明人： ITOU MASANORI , YAJIMA KIYOSHI , OKUYAMA HITOSHI , SUZUKI TAKAO , URUGA KENICHI
IPC分类号： B23K1/008 , B23K3/04 , H05K3/34
摘要： PURPOSE:To execute solder reflow having good repeatability by printing cream solder on a substrate, pushing flat-plate type jig for reflow, bringing into close contact, laying to hot plate type heating device and executing the reflow. CONSTITUTION:As the substrate 1 is pushed on the jig 2 having good heat conductivity and both flat surfaces to bring into close contact with these and further, this is heated on the flat hot plate 3, reflow temp. to the substrate 1 can be made to the constant. By this method, the solder reflow having uniform melting condition of the solder in the substrate and good repeatability, can be executed.

37. 发明专利

JPH0393121A TEMPERATURE FUSE 失效
公开(公告)号：JPH0393121A
公开(公告)日：1991-04-18
申请号：JP22752989
申请日：1989-09-04
申请人： FUJIKURA LTD , CALSONIC CORP
发明人： ITOU MASANORI , YAJIMA KIYOSHI , SUZUKI TAKAO , OKUYAMA HITOSHI , URUGA KENICHI , YAMAMOTO NOBUTAKA , HIRABAYASHI HISANAGA
IPC分类号： H05K1/02 , H01H37/76 , H05K3/34
摘要： PURPOSE:To surely cut a circuit by forming a fuse base by connecting both end parts of a conductive circuit with a metal, which is easy to be eroded with a molten low melting point metal, without directly bridging both end parts of the circuit with a fuse and putting a low melting point metal on the separated fuse base. CONSTITUTION:Both end parts of a conductive circuit are connected with a metal, for example silver, which is easy to be eroded with a molten low melting point metal, and the metal is used as a fuse base 2. A solder is deposited on the fuse base 2 with the same width as that of the fuse base 2. This fuse 3 is prepared by printing, for example, a Sn-Pb eutectic solder paste (eutectic point is 183 deg.C) in the inside of both end parts of a conductive circuit 1 in the fuse base and carrying out reflowing process. In this way, cutting a circuit due to solder erosion is carried out at the parts of solely the fuse base and at the interfaces of the fuse 3 and thus fuse operation is carried out more certainly.

38. 发明专利

JPH02276289A MANUFACTURE OF THICK FILM CIRCUIT 失效
公开(公告)号：JPH02276289A
公开(公告)日：1990-11-13
申请号：JP9638789
申请日：1989-04-18
申请人： FUJIKURA LTD
发明人： ITOU MASANORI , YAJIMA KIYOSHI , OKUYAMA HITOSHI , SUZUKI TAKAO , URUGA KENICHI
IPC分类号： H05K3/28 , H05K3/12
摘要： PURPOSE:To judge the end of printing by inspecting check marks formed at the time when printing is finished prescribed times by a method wherein a figure indicating the printing of each layer is printed when a conductor or a resist layer is printed. CONSTITUTION:When a metal pattern, a solder resist, or an overglaze is applied in layers, a second check mark is formed at a point different from that of a positioning check mark. When a metal paste, for instance, is applied in two layers, the second check mark is formed in such a manner that a longitudinal bar mark 2 is printed at the printing of a first pattern and a lateral bar mark 4 crossing the mark 2 is printed at the following printing to form a second check mark 6 of a cross. Or, when solder resist is, for instance, applied in three layers, three non-printed holes 8 are determined, and one of the holes 8 is selected for each layer to be printed, for instance, holes 8a, 8b, and 8c are previously set for a first, a second, and a third layer respectively, so that it can be confirmed when all the holes 8 are printed that the printing of three layers is surely carried out.

39. 发明专利

JPH02244787A ENAMELLED SUBSTRATE OF RESISTANCE CIRCUIT WITH INSERTION TERMINAL 失效
公开(公告)号：JPH02244787A
公开(公告)日：1990-09-28
申请号：JP6351289
申请日：1989-03-17
申请人： FUJIKURA LTD
发明人： YAJIMA KIYOSHI , OKUYAMA HITOSHI , SUZUKI TAKAO , ITOU MASANORI , URUGA KENICHI
IPC分类号： H05K1/05
摘要： PURPOSE:To eliminate the necessity of forming mating terminals in accordance with a distance from a heating part even if a plurality of resistance circuits are to be used in series connection by a method wherein conductor circuits having required lengths are connected to the resistance circuits. CONSTITUTION:An enamelled substrate 4 is a resistance circuit substrate and the whole substrate is composed of a resistance circuit 3. Conductor circuits 2 which are so formed as to be connected to the resistance circuit 3 are conductor circuits for overheat protection. The resistance circuit 2 is preferably made of conductor material whose surface resistivity is as low as possible. If the material having the surface resistivity not higher than 10mOMEGA/square is employed, the necessary length of the conductor circuit has to be varied in accordance with the surface resistivity of the resistor circuit and so forth and the length not less than 5mm is necessary.

40. 发明专利

JPH02232984A ENAMELED CIRCUIT BOARD PROVIDED WITH INSERTION TERMINAL 失效
公开(公告)号：JPH02232984A
公开(公告)日：1990-09-14
申请号：JP5351689
申请日：1989-03-06
申请人： FUJIKURA LTD
发明人： SUZUKI TAKAO , YAJIMA KIYOSHI , ITOU MASANORI , URUGA KENICHI , OKUYAMA HITOSHI
IPC分类号： H05K1/05 , H05K1/11 , H05K3/40
摘要： PURPOSE:To improve an enameled circuit board of this design in connectability with an external connector by a method wherein a prescribed taper is provided to the tip of a terminal metal core, a circuit is formed up to the tip of the terminal, and a conductive lubricating layer containing graphite is formed on the terminal. CONSTITUTION:The insertion terminal 0.6mm in thickness of a metal core 1 provided with terminals is tapered in a thicknesswise direction up to the range of 1.0-3.0mm from its tip so as to make its tip as thick as 0.1-0.3mm, and then a crystallized enamel layer 2 is formed on the surface of this metal board as thick as 130mum to obtain an enameled board provided with terminals. Then, a prescribed pattern is printed as a thick film circuit 3 on the surface of the board up to nearly the tip of the terminal and burned. Then, a graphite lubricating film 4 is formed on the terminal circuit of the board and the rear side of the terminal. By this setup, an enameled wiring board of this design can be improved in connectability.

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