专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明专利

JP2011068867A Polyimide film 审中-公开
标题翻译：聚酰亚胺膜
公开(公告)号：JP2011068867A
公开(公告)日：2011-04-07
申请号：JP2010185522
申请日：2010-08-20
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO
IPC分类号： C08J5/18 , B29C55/12 , B29K79/00 , B29L7/00 , C08G73/10
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film which is homogeneous in a coefficient of linear thermal expansion and is excellent in low thermal expansibility along the TD. SOLUTION: The polyimide film comprises having a coefficient of linear thermal expansion αTD of 3-7 ppm/°C along the transverse direction (TD) at every point of at least 8 points, wherein the at least 8 points are selected in the prepared film having a width of 1.5 m or more as follows: first and second points are selected to locate 150 mm apart inside from their respective transverse ends of the prepared film on the straight line vertical to the machine direction (MD) for transferring the film; a third point is selected to locate within the center ±200 mm in and on the straight line for connecting the first and second points; and further the other five points are selected to locate at their respective optional positions. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种线性热膨胀系数均匀的聚酰亚胺膜，沿着TD具有优异的低热膨胀性。解决方案：聚酰亚胺膜包括在至少8点的每个点处沿着横向（TD）具有3-7ppm /℃的线性热膨胀系数αTD，其中至少8个点选自所制备的膜具有1.5μm以上的宽度如下：第一和第二点被选择为在垂直于机器方向（MD）的直线上与其制备的膜的相应横向端部间隔150mm，用于传送电影; 选择第三点位于中心±200mm内和直线上，用于连接第一和第二点; 并且进一步选择其他五个点以定位在它们各自的可选位置。版权所有（C）2011，JPO＆INPIT

32. 发明专利

JP2009019095A Cover-lay 审中-公开
标题翻译：封面
公开(公告)号：JP2009019095A
公开(公告)日：2009-01-29
申请号：JP2007182278
申请日：2007-07-11
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , MAEDA SHU , SAWAZAKI KOICHI
IPC分类号： C08G73/10 , C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide a cover-lay that exhibits excellent dimensional stability and excellent heat resistance, is endowed with properties adaptable to AOI and is excellent in running properties (easily sliding properties) and adhesive properties.
SOLUTION: The cover-lay comprises a polyimide film mainly composed of 4,4'-diaminodiphenyl ether as a diamine component and pyromellitic dianhydride as an acid dianhydride component and an adhesive layer formed on one surface thereof, where in the polyimide film a powder is dispersed mainly composed of inorganic particles having a particle size within the range of 0.01-1.5 μm and an average particle size of 0.05-0.7 μm in a ratio of 0.1-0.9 wt.% based on the weight of the film resin.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的尺寸稳定性和优异的耐热性的覆盖层，具有适用于AOI的性能，并且具有优异的运行性能（易滑动性）和粘合性能。解决方案：覆盖层包括主要由作为二胺组分的4,4'-二氨基二苯醚和作为酸二酐组分的均苯四酸二酐和在其一个表面上形成的粘合剂层的聚酰亚胺膜，其中在聚酰亚胺膜基于膜树脂的重量，以0.1-0.9重量％的比例主要由粒径在0.01-1.5μm范围内且平均粒径为0.05-0.7μm的无机颗粒组成的粉末分散。版权所有（C）2009，JPO＆INPIT

33. 发明专利

JP2009018523A Copper clad plate 审中-公开
标题翻译：铜箔板
公开(公告)号：JP2009018523A
公开(公告)日：2009-01-29
申请号：JP2007183776
申请日：2007-07-13
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , KOKUNI MASAHIRO , SAWAZAKI KOICHI
IPC分类号： B32B15/088 , C08J5/12 , C08K3/00 , C08L79/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a copper clad plate, reduced in the rate of dimensional change after etching while satisfying both dimensional change and heat resistance, having characteristics adaptable for AOI, also excellent in running property (slidability) and adhesiveness, and suitable for a high-performance flexible printed wiring board.
SOLUTION: The copper clad plate comprises: a polyimide film mainly including paraphenylenediamine and 4,4'-diaminodiphenyl ether as diamine component and pyromellitic acid dianhydride as acid dianhydride component, the film having slidability obtained by adding inorganic fine particles to generate surface projections thereon; a copper plate adhered to one surface of the polyimide film through an adhesive; and a copper plate adhered to the other surface of the film without adhesive.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种铜包覆板，在满足尺寸变化和耐热性的同时，蚀刻后的尺寸变化率降低，具有适用于AOI的特性，运行特性（滑动性）和粘合性也优异，适用于高性能柔性印刷线路板。解决方案：铜包覆层包括：主要包括对苯二胺和4,4'-二氨基二苯基醚作为二胺组分的聚酰亚胺膜和作为酸二酐组分的均苯四酸二酐，该膜具有通过添加无机细颗粒产生表面而获得的滑动性投影; 通过粘合剂粘附在聚酰亚胺膜的一个表面上的铜板; 并且在没有粘合剂的情况下粘附到膜的另一个表面的铜板。版权所有（C）2009，JPO＆INPIT

34. 发明专利

JP2009018521A Copper clad plate 有权
标题翻译：铜箔板
公开(公告)号：JP2009018521A
公开(公告)日：2009-01-29
申请号：JP2007183774
申请日：2007-07-13
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , KOKUNI MASAHIRO , SAWAZAKI KOICHI
IPC分类号： B32B15/088 , C08G73/10 , C08J5/18 , C08K3/00 , C08L79/08 , H05K1/03
CPC分类号： H05K1/0346 , B32B15/088 , B32B15/20 , B32B2264/10 , B32B2307/734 , B32B2457/08 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , H05K2201/0266 , Y10T428/25
摘要： PROBLEM TO BE SOLVED: To provide a copper clad plate, reduced in the rate of dimensional change after etching while satisfying both dimensional change and heat resistance, having characteristics adaptable for AOI, also excellent in running property (slidability) and adhesiveness, and suitable for a high-performance flexible printed wiring board. SOLUTION: The copper clad plate comprises: a polyimide film mainly including paraphenylenediamine and 4,4'-diaminodiphenyl ether as diamine component and pyromellitic acid dianhydride and 3,3',4,4'-biphenyltetracarboxylic dianhydride as acid dianhydride component, the film having slidability obtained by adding inorganic fine particles to generate surface projections thereon; a copper plate adhered to one surface of the polyimide film through an adhesive; and a copper plate adhered to the other surface of the film without adhesive. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种铜包覆板，在满足尺寸变化和耐热性的同时，蚀刻后的尺寸变化率降低，具有适用于AOI的特性，运行特性（滑动性）和粘合性也优异，适用于高性能柔性印刷线路板。解决方案：铜包覆层包括：主要包括对苯二胺和4,4'-二氨基二苯醚作为二胺组分的聚酰亚胺膜和均苯四酸二酐和3,3'，4,4'-联苯四羧酸二酐作为酸二酐组分，所述膜具有通过添加无机细颗粒以在其上产生表面突起而获得的滑动性; 通过粘合剂粘附在聚酰亚胺膜的一个表面上的铜板; 并且在没有粘合剂的情况下粘附到膜的另一个表面的铜板。版权所有（C）2009，JPO＆INPIT

35. 发明专利

JP2008290302A Copper-clad plate 有权
标题翻译：铜箔板
公开(公告)号：JP2008290302A
公开(公告)日：2008-12-04
申请号：JP2007136705
申请日：2007-05-23
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , MAEDA SHU
IPC分类号： B32B15/088 , C08J5/18 , C08K3/00 , C08L79/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a copper-clad plate which has high dimensional stability, a proper modulus of elasticity, and has slidability by generating surface projections by adding fine inorganic particles, uses a polyimide film applicable to an automatic optical inspection system (AOI), and is suitable for a high performance flexible printed circuit board.
SOLUTION: In the copper-clad plate, the polyimide film which is produced by mainly using p-phenylenediamine and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic acid dianhydride and 3,3',4,4'-biphenyl tetracarboxylic acid dianhydride as acid dianhydride components and has slidability by generating the surface projections by adding the fine inorganic particles is used, and a copper layer is formed directly on at least one side of the polyimide film without using an adhesive.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有高尺寸稳定性，适当的弹性模量并且通过添加无机微粒产生表面突起而具有滑动性的铜包覆板，使用可用于自动光学检查的聚酰亚胺膜系统（AOI），适用于高性能柔性印刷电路板。解决方案：在铜包覆板中，主要使用对苯二胺和4,4'-二氨基二苯醚作为二胺组分和均苯四酸二酐制备的聚酰亚胺膜和3,3'，4,4'- 联苯四羧酸二酐作为酸二酐成分，并且通过添加无机微粒而产生表面突起而具有滑动性，并且在不使用粘合剂的情况下，在聚酰亚胺膜的至少一侧直接形成铜层。版权所有（C）2009，JPO＆INPIT

36. 发明专利

JP2008290301A Copper-clad plate 审中-公开
标题翻译：铜箔板
公开(公告)号：JP2008290301A
公开(公告)日：2008-12-04
申请号：JP2007136704
申请日：2007-05-23
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , MAEDA SHU
IPC分类号： B32B15/088 , C08K3/00 , C08L79/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a copper-clad plate which has slidability by generating surface projections by adding fine inorganic particles, uses a polyimide film applicable to a flexible printed circuit board (FPC) and a chip-on film (COF) type automatic optical inspection system (AOI), and thus is suitable for a high performance flexible printed circuit board. SOLUTION: In the copper-clad plate, the polyimide film in which the inorganic particles having a particles size of 0.01-1.5 μm, an average particles size of 0.05-0.7 μm, and a particle size distribution wherein particles 0.15-0.60 μm in particle size occupy at least 80 vol% of the total volume of the particles are dispersed and contained in a ratio of 0.1-0.9 wt.% of the weight of a film resin is used, and on at least one side of the polyimide film, a copper layer is formed directly without using an adhesive. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决问题：为了提供通过添加无机微粒产生表面突起而具有滑动性的铜包覆板，使用可应用于柔性印刷电路板（FPC）和贴片膜（COF）的聚酰亚胺膜）型自动光学检测系统（AOI），因此适用于高性能柔性印刷电路板。解决方案：在铜包覆板中，其中颗粒尺寸为0.01-1.5μm，平均粒径为0.05-0.7μm的无机颗粒和其中颗粒0.15-0.60的颗粒尺寸分布的聚酰亚胺膜使用粒径为100μm以上的粒子的总体积的至少80体积％分散并以使用薄膜树脂重量的0.1-0.9重量％的比例包含在聚酰亚胺的至少一面上直接形成铜层而不使用粘合剂。版权所有（C）2009，JPO＆INPIT

37. 发明专利

JP2008166556A Flexible printed wiring board 审中-公开
标题翻译：柔性印刷接线板
公开(公告)号：JP2008166556A
公开(公告)日：2008-07-17
申请号：JP2006355335
申请日：2006-12-28
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , SAWAZAKI KOICHI , MAEDA SHU
IPC分类号： H05K1/03 , C08J5/18 , C08K3/00 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed wiring board in which minute wiring can be formed and which has proper running performance (easy slidability) and will not deform, even if lead-free solder is used.
SOLUTION: The flexible printed wiring board contains a polyimide film, principally comprising paraphenylenediamine and 4,4'-diaminodiphenylether as a diamine component and a pyromellitic acid dihydride as an acid dihydride component, and further containing minute inorganic particles, wherein wiring is formed on one surface or on both surfaces of the polyimide film, with or without an adhesive.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使使用无铅焊料，也可以提供能够形成微细布线且具有适当的运行性能（易滑动性）并且不会变形的柔性印刷布线板。解决方案：柔性印刷线路板包含聚酰亚胺膜，主要包括对苯二胺和4,4'-二氨基二苯基醚作为二胺组分和均苯四酸二酐作为酸二酐组分，并且还含有微小的无机颗粒，其中布线为形成在聚酰亚胺膜的一个表面上或两个表面上，具有或不具有粘合剂。版权所有（C）2008，JPO＆INPIT

38. 发明专利

JP2008034527A Cover lay 审中-公开
标题翻译：盖子
公开(公告)号：JP2008034527A
公开(公告)日：2008-02-14
申请号：JP2006204789
申请日：2006-07-27
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , MAEDA SHU , SAWAZAKI KOICHI
IPC分类号： H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a cover lay suitable to be stuck on a flexible printed board employing a lead-free solder by solving the problem of both a change in dimension of the cover lay and heat resistance thereof.
SOLUTION: A polyimide film is used as mainly containing 3,4'-diaminodiphenyleter and 4,4'-diaminophenylether as a diamine component, and pyromellitic acid dianhydride as an acid diandhydride component. An adhesive is applied on one surface of the polyimide film to form the cover lay.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过解决覆盖层的尺寸变化和耐热性两者的问题，提供适于粘贴在使用无铅焊料的柔性印刷板上的覆盖层。解决方案：主要使用聚酰亚胺薄膜作为二胺组分的3,4-二氨基二苯醚和4,4'-二氨基苯基醚，作为酸二酐组分使用均苯四甲酸二酐。将粘合剂施加在聚酰亚胺膜的一个表面上，以形成覆盖层。版权所有（C）2008，JPO＆INPIT

39. 发明专利

JP2007201441A Chip-on film 有权
标题翻译：芯片电影
公开(公告)号：JP2007201441A
公开(公告)日：2007-08-09
申请号：JP2006345616
申请日：2006-12-22
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , MAEDA SHU
IPC分类号： H01L21/60 , C08G73/10 , C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide a chip-on film, having improved bending properties manufactured by using a polyimide film, having high dimensional stability and appropriate modulus of elasticity.
SOLUTION: In the chip-on film where wiring is formed on at least one surface of the polyimide film so that an IC chip can be mounted, the polyimide film mainly uses paraphenylenediamine and 4,4'-diaminophenylether as diamine components, and pyromellitic acid dianhydride and 3,3',4,4'-biphenyltetracarboxilic acid dianhydride as acid dianhydride components. Wiring is formed, on at least one surface of the polyimide film via or without going through the intermediary of an adhesive.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有高尺寸稳定性和适当的弹性模量的具有通过使用聚酰亚胺膜制造的改进的弯曲性能的贴片膜。解决方案：在聚酰亚胺膜的至少一个表面上形成布线的贴片膜中，可以安装IC芯片，聚酰亚胺膜主要使用对苯二胺和4,4'-二氨基苯基醚作为二胺成分，和均苯四甲酸二酐和3,3'，4,4'-联苯四羧酸二酐作为酸二酐组分。在聚酰亚胺膜的至少一个表面上经由或不经过粘合剂的介质形成布线。版权所有（C）2007，JPO＆INPIT

40. 发明专利

JP2007196671A Copper clad plate 审中-公开
标题翻译：铜箔板
公开(公告)号：JP2007196671A
公开(公告)日：2007-08-09
申请号：JP2006341380
申请日：2006-12-19
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , SAWAZAKI KOICHI , KOKUNI MASAHIRO
IPC分类号： B32B15/088 , B32B15/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a copper clad plate suitable as a material of a flexible printed wiring board enabling the formation of fine wiring, not deformed even if lead-free solder is used and excellent in dimensional stability and heat resistance.
SOLUTION: A polyimide film, which is formed of paraphenylenediamine and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic dianhydride as an acid anhydrite component is used and a copper plate is provided to one side or both sides of the polyimide film using an adhesive or without using the adhesive to obtain the copper clad plate.
COPYRIGHT: (C)2007,JPO&INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式