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    • 37. 发明专利
    • Plating material and method of producing the same
    • 材料的制造及其制造方法
    • JP2011127153A
    • 2011-06-30
    • JP2009284659
    • 2009-12-16
    • Autonetworks Technologies LtdSumitomo Electric Ind LtdSumitomo Wiring Syst Ltd住友電気工業株式会社住友電装株式会社株式会社オートネットワーク技術研究所
    • KINOSHITA YUKOFURUKAWA KINGO
    • C25D5/50C25D5/10C25D5/12
    • PROBLEM TO BE SOLVED: To provide a method of producing an Sn plating material capable of maintaining the thickness of an Sn plating layer over a long period and suppressing the deterioration of solder wetness of the plating material by retarding alloying of Sn with base plating metal and the growth speed of the alloy layer more slowly than heretofore without increase in production cost.
      SOLUTION: The plating material is constituted so that a base plating layer made of Cu or Cu alloy is formed on a substrate made of Cu or Cu alloy and a surface plating layer made of Sn or Sn alloy is further formed on the base plating layer, and a Cu and Sn alloy layer is formed between the base plating layer and the surface plating layer by further performing thermal treatment, wherein a thickness of the base plating layer is 0.5 to 2.0 μm, a thickness of the surface plating layer is 0.5 to 3.0 μm, a thickness of the Cu and Sn alloy layer is 0.8 to 2.0 μm and further an average particle size of Cu and Sn alloy is 4 to 10 μm.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种能够长时间保持Sn镀层的厚度的Sn镀覆材料的制造方法,通过延缓Sn与基体的合金化来抑制电镀材料的焊料湿润性的劣化 电镀金属和合金层的生长速度比以前更慢,而生产成本却不增加。 解决方案:电镀材料构成为在由Cu或Cu合金制成的基板上形成由Cu或Cu合金制成的基底镀层,并且在基底上进一步形成由Sn或Sn合金制成的表面电镀层 通过进一步进行热处理,在基底镀层和表面镀层之间形成Cu和Sn合金层,其中,基底镀层的厚度为0.5〜2.0μm,表面镀层的厚度为 0.5〜3.0μm,Cu和Sn合金层的厚度为0.8〜2.0μm,Cu和Sn合金的平均粒径为4〜10μm。 版权所有(C)2011,JPO&INPIT