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31. 发明专利

JPH07211737A SEMICONDUCTOR MANUFACTURING DEVICE 失效
公开(公告)号：JPH07211737A
公开(公告)日：1995-08-11
申请号：JP378094
申请日：1994-01-18
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： NAKAI TAKAFUMI
IPC分类号： H01L21/56
摘要： PURPOSE:To provide a semiconductor manufacturing device, which prevents a lead frame from being contaminated and is capable of heating the whole lead frame uniformly, rapidly and efficiently. CONSTITUTION:A semiconductor manufacturing device is mounted with a gas spraying means 5, a feed pipe 7, which is introduced into an exhaust tube 8 to feed the air (gas) 4, and a first heater 9 for heating the air 4 and is mounted with a first heat unit 6 formed with a gas injection part 10 consisting of a plurality of tabular materials 11 provided openly with a multitude of stirring holes 11a and a second heater 12 for heating a lead frame 3. Moreover, the device is provided with a second heat unit 14, which is positioned on a die pad and is formed with a suction hole 13, air spraying nozzles 17 for spraying the air 4 from the width direction of the frame 3 and a third heater 18 for heating the frame 3 and has a frame transfer means 15, which moves this heater 18 while making the heater 18 position on the unit 14, and the tube 8 to exhaust the sucked air 4.

32. 发明专利

JPH07161912A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE AND LEAD FRAME USED FOR THE MANUFACTURE 失效
公开(公告)号：JPH07161912A
公开(公告)日：1995-06-23
申请号：JP34153593
申请日：1993-12-10
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD , AKITA DENSHI KK
发明人： DANNO TADATOSHI , KAGII HIDEMASA , FUNATSU KATSUHIKO , NAMITA TOSHIYUKI , HATORI KAZUO , OGASAWARA JUNYA , SATO HITOHISA
IPC分类号： H01L21/60 , H01L21/52 , H01L23/50
摘要： PURPOSE:To prevent the cracking of a resin-sealed body by bringing the bonding wire of a semiconductor pellet and a main surface on the opposite side in contact with entirely the resin of a sealing body and pressing a holding member in two places which are opposite to each other in the side surface of the semiconductor pellet. CONSTITUTION:A resin-sealed package 26 is formed of a resin-sealed body 24 and a plurality of outer leads 20. A pellet 21, four holding members 18 and an inner lead 19 are resin-sealed with the resin-sealed body. A bonding wire 22 in the pellet 21 and a main surface on the opposite side 11 are in contact with entirely the resin of the resin-sealed body 24 and each holding member 18 is pressed against the four sides of the pellet 21 by elastic force. Thereby, the generation of a crack in the resin-sealed body can be avoided before it happens.

33. 发明专利

JPH07147342A METHOD AND APPARATUS FOR SEAM WELDING AS WELL AS ELECTRONIC COMPONENT 失效
公开(公告)号：JPH07147342A
公开(公告)日：1995-06-06
申请号：JP29301693
申请日：1993-11-24
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： ONO TAKASHI , ONODERA TADASHI , SHOJI SHIGERU , NAKAJIMA YOSHIHIKO , NAKAGAWA SHIGEMI
IPC分类号： B23K11/00 , B23K11/06 , H01L23/02
摘要： PURPOSE:To place a plurality of objects, to be welded, on a table and to perform a seam welding operation continuously by a method wherein a shielding body which is formed of a high-permeability material is arranged and installed between an electrode holder and the table. CONSTITUTION:The surface of electrode holders 40 is covered with shielding bodies 55 which are composed of high-permeability mild steel, ferrite-based stainless steel or the like. Since a plurality of objects 21 to be welded are arranged on a table 45 in a seam welding operation, the objects 21 to be welded which are not welded are situated at the lower part of the electrode holers 40. However, since the surface of the electrode holders 40 is covered with the high-permeability shielding bodies 55, a magnetic field does not reach a base 2 and a cap 3 at the lower part. Even when a large current flows to the electrode holders 40, the objects 21 to be welded which are composed of the base 2 and the cap 3 are not moved. As a result, even when the plurality of objects 21 to be welded are arranged on the table 45, the position of the cap 3 with reference to the base 2 in the objects 21 to be welded can always maintain a set state, and an airtight sealing operation without causing a sealing deviation can be achieved.

34. 发明专利

JPH0745489A SEMICONDUCTOR FABRICATION SYSTEM AND NETWORK ADAPTOR 失效
公开(公告)号：JPH0745489A
公开(公告)日：1995-02-14
申请号：JP20989893
申请日：1993-08-02
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： FUJIWARA TOSHITOMO
IPC分类号： H01L21/02
摘要： PURPOSE:To obtain an adaptor for connecting various semiconductor fabrication systems with a network by connecting two semiconductor fabrication systems, having a communication function based upon an SECS protocol and a communication function based on the inherent communication protocol, and a semiconductor fabrication system having no communication function simultaneously with the network. CONSTITUTION:The semiconductor fabrication system comprises a dicing unit DICE, a bonding unit BNDE, a molding unit MLDE, an aging unit AGE, and an automatic handler AHND, connected with a host computor HOST through network adaptors NWA1-NWA5. The dicing unit DICE and the bonding unit have communication function based upon SECS protocol. The molding unit MLDE has a communication function based upon an inherent communication protocol whereas the aging unit AGE and the automatic handler AHND have no communication function.

35. 发明专利

JPH0712888A BURN-IN BOARD 失效
公开(公告)号：JPH0712888A
公开(公告)日：1995-01-17
申请号：JP15754693
申请日：1993-06-28
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： NAGANUMA KIYOMI
IPC分类号： G01R31/26 , H01L21/66
摘要： PURPOSE:To provide a burn-in board in which the burn-in test results are managed easily and accurately in relation to the LSI chips on a burn-in board. CONSTITUTION:A memory 20 is provided on a burn-in board 10. The memory 20 is connected with an address line L1 and a data line L2 which are connected with the chip mounting part 11 on the board 10. Burn-in test results and measured characteristics of an LSI chip are delivered on these signal lines to the memory 20 and stored therein. A desired management data can be obtained in relation to the LSI chip by simply reading the data from the memory 20 on the board 10 even if the data from an external data file can not be related with the burn-in board 10 when the burn-in board 10 is moved between testers.

36. 发明专利

JPH0710211A TRANSFERRING DEVICE 失效
公开(公告)号：JPH0710211A
公开(公告)日：1995-01-13
申请号：JP16285393
申请日：1993-06-30
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： NAKAI TAKAFUMI
IPC分类号： B25J15/08 , B65G1/00 , B65G60/00
摘要： PURPOSE:To hold an article at the stablest attitude without damaging a held article by constructing each of three claws so as to be oscillatable right and left as much as a fixed angle in its opening and closing directions. CONSTITUTION:Each claw 2 is attached at its upper part into a U-shaped guard block 51 with a fixing machine screw 50. The inserted part of the claw 2 turns into a semicircular shape in its section, and its circular face 53 is opposite to the central inner wall face of the guard block 51. In the case where a lead frame 1 is clamped by these three claws 2, an oblique contact face 59 on the lower inner side of the claw 2 comes into contact with the linearly extending edge of the lead frame 1. In a state where only a part of the contact face 59 comes into contact with the edge of the lead frame 1, since the upper part of the claw 2 is rolled on a circular face 53, and its lower part is oscillated at the V-shaped part lower contact point 57 of a claw contact point generating plate 52 by pressing force toward the lead frame 1 of the claw 2, the claw 2 moves to form a stable state where the contact face 59 and the edge of the lead frame 1 mutually come into enough contact.

37. 发明专利

JPH06347417A SCREENING DEVICE AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06347417A
公开(公告)日：1994-12-22
申请号：JP14105293
申请日：1993-06-14
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： YANO HIROSHI , KATO HITOSHI , ARITA JUNICHI
IPC分类号： G01J1/04 , G01N21/88 , G01N21/956 , H01L21/66
摘要： PURPOSE:To carry out screening of a semiconductor device after a resin seal reliably in a short time by carrying out inspection electrically on a crack or a broken piece or the like of a semiconductor chip. CONSTITUTION:An infrared laser, beam outputted by an output means 8 is radiated on the whole side surface of a semiconductor chip, and passes through the semiconductor chip, and is received by a beam receiving means 9. An electric signal converted by the beam receiving means 9 is inputted to a transmissivity measuring device or the like, and transmissivity is measured, and is compared with transmissivity of a semiconductor chip of good quality. When failure such as a crack or a broken piece exists in the semiconductor chip, since the infrared laser beam is attenuated and the transmissivity is reduced, it is detected as a failure semiconductor chip when the transmissivity is lower than that of the semiconductor chip.

38. 发明专利

JPH06347229A METHOD AND APPARATUS FOR MEASURING SHAPE 失效
公开(公告)号：JPH06347229A
公开(公告)日：1994-12-20
申请号：JP14103493
申请日：1993-06-14
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： TAKAHASHI SATORU
IPC分类号： G01B11/24
摘要： PURPOSE:To make it possible to measure a shape highly accurately in a short time by focusing a laser beam on a position detecting element through a rotary mirror and a condenser lens, and deriving the three-dimensional shape of a material to be measured by computation. CONSTITUTION:A laser beam 1a emitted from a semiconductor laser 1 is stopped with a beam stop lens 2 and becomes collimated light 2a. Furthermore, the light path of the collimated light 2a is converted with a rectangular prism 3. The light 2a turns into a light projecting beam 4a with a rotary mirror 4. The surface of a material to be measured 5 is scanned with the beam 4a in one dimension. After the scanning, reflected light 5a from the surface of the material to be measured 5 is condensed with a condenser lens 6. The image is focused on a position detecting element 7. The one-dimensional amount of the displacement of the surface of the material to be measured 5 can be measured by an expression of computation. The material to be measured 5 or the apparatus is further rotated or moved, and the secondary scanning is performed. When the numerical values expressing the displaced positions are synthesized, the surface shape of the material to be measured can be measured in three dimensions.

39. 发明专利

JPH06297167A LASER MARKING DEVICE 失效
公开(公告)号：JPH06297167A
公开(公告)日：1994-10-25
申请号：JP11389293
申请日：1993-04-16
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： SATO FUMITAKA
IPC分类号： B23K26/00 , B23K26/066 , H01L23/00 , H01S3/00 , B23K26/06
摘要： PURPOSE:To improve workability and working rate and to prevent the occurrence of the deviation of a mark and mismarking. CONSTITUTION:In a laser marking device in which plural masks 30 are housed in a holder stand through a holder 40, and arranged side by side, a laser beam is allowed to transmit a mask group, a package is irradiated by the laser beam and the marks of a mask group are marked, plural housing holes into which a mask 30 is freely and slidably inserted, are aligned side by side in the transmission direction of the laser beam on a holder. Each housing hole is formed respectively so that it extends in the direction perpendicular to the transmission direction of the laser beam, and each window 43 is formed respectively on a pair of the side walls in the laser transmission direction of each housing hole. In a state in which plural masks 30 are housed in a single holder 40, they are set in a holder stand 25. Therefore, workability is heightened. The housing work of the mask group into the holder can be simultaneously carried out during a laser marking work. Intervals between masks existing side by side can be set to be small.

40. 发明专利

JPH06244353A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH06244353A
公开(公告)日：1994-09-02
申请号：JP3104993
申请日：1993-02-22
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： MATSUI HITOSHI
IPC分类号： H01L21/56 , H01L23/28 , H01L23/50
摘要： PURPOSE:To provide a low-cost semiconductor integrated circuit device that doesn't require a conventional molding die, by using a lead frame fixed between non-conductive members. CONSTITUTION:A semiconductor integrated circuit device having a structure, in which a semiconductor element is connected to a lead frame 3 with a wire 2. The semiconductor integrated circuit comprises a semiconductor-element chip l having a logical or storing function, a wire 2 for connecting the chip 1 and the lead frame 3, a tab 4 for fixing the chip 1 with an adhesive 7, and non-conductive tapes 5a and 5b for fixing the lead frame 3 and the tab 4, and serving as a barrier for holding a chip-protective resin 6 on the chip 1.

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