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21. 发明专利

JP3649675B2 Production method of the epoxidized diene polymer 有权
公开(公告)号：JP3649675B2
公开(公告)日：2005-05-18
申请号：JP2001143840
申请日：2001-05-14
申请人：ダイセル化学工業株式会社
发明人：喜弘大塚 , 章博藪井
IPC分类号： C08C19/06 , C08F8/08

22. 发明专利

JP2004269609A Polymer composition 有权
公开(公告)号：JP2004269609A
公开(公告)日：2004-09-30
申请号：JP2003059782
申请日：2003-03-06
申请人： Mitsui Chemicals Inc , 三井化学株式会社
发明人： OTA SEIJI , MURAKAMI SHUICHI
IPC分类号： C08F255/00 , C08F8/08
摘要： PROBLEM TO BE SOLVED: To obtain a polymer composition having an epoxy compound introduced therein at a high reaction efficiency and excellent in e.g. compatibility with a polar resin and adhesiveness thereto.
SOLUTION: A polyolefin (a-1) is obtained by polymerizing one or more kinds of olefins selected from ethylene and 3-20C α-olefins. An acid-modified polyolefin (A) is obtained by subjecting the polyolefin (a-1) to graft polymerization with at least one kind of ethylenically unsaturated carboxylic acid or its derivative (a-2). A first polymer composition is obtained by melting and mixing the acid-modified polyolefin (A) with a polyfunctional aliphatic epoxy compound (B). A second polymer composition is obtained by melting and mixing the polyolefin (a-1), at least one kind of ethylenically unsaturated carboxylic acid or its derivative (a-2), and a polyfunctional aliphatic epoxy compound (B).
COPYRIGHT: (C)2004,JPO&NCIPI

23. 发明专利

JP2003519706A 失效
公开(公告)号：JP2003519706A
公开(公告)日：2003-06-24
申请号：JP2001551125
申请日：2001-01-11
IPC分类号： A43B1/00 , C08F2/00 , C08F8/08 , C08G81/02 , C08L53/02 , C08L63/00 , C08L95/00

24. 发明专利

JP2003049074A Thermosetting resin composition 审中-公开
标题翻译：热固性树脂组合物
公开(公告)号：JP2003049074A
公开(公告)日：2003-02-21
申请号：JP2001205678
申请日：2001-07-06
申请人： Nippon Petrochemicals Co Ltd , 新日本石油化学株式会社
发明人： TAKASHIMA TSUTOMU , FUJIMURA KOJI
IPC分类号： C09K3/10 , C08F8/08 , C08G59/34 , C08L23/26 , C08L23/30 , C08L61/06 , C08L63/00 , C08L63/08 , C08L101/00 , H01L23/29 , H01L23/31
CPC分类号： C08G59/027 , C08L23/30 , C08L63/00 , H01L23/293 , H01L2924/0002 , C08L2666/04 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition whose shock resisting properties, thermal crack resistance, oxidative deterioration resistance and thermal deterioration resistance are improved without losing the heat resisting properties represented by HDT, and which is suitable for sealing a semiconductor, or the like. SOLUTION: This thermosetting resin composition comprises a thermosetting resin and an epoxy group-containing liquid polybutene, and optionally a curing agent. The epoxy group-containing liquid polybutene has an epoxy structure at the molecular terminal of the main component and has a specific chemical structure in >=80% of the recurring units in the main chain structure. Further, the phase structure of the resin of the thermosetting resin composition after hardening reaction is characterized in that dispersed phases of sizes of μm unit mainly composed of the epoxy group-containing liquid polybutene exist in a continuous phase mainly composed of the thermosetting resin.
摘要翻译：要解决的问题为了获得耐冲击性，耐热裂纹性，耐恶化性和耐热劣化性得到改善而不失去由HDT表示的耐热性能并且适合于密封半导体的热固性树脂组合物，或者喜欢。解决方案：该热固性树脂组合物包含热固性树脂和含环氧基的液体聚丁烯，以及任选的固化剂。含环氧基的液体聚丁烯在主要成分的分子末端具有环氧结构，并且在主链结构中的重复单元的比例> 80％具有特定的化学结构。此外，硬化反应后的热固性树脂组合物的树脂的相结构的特征在于，主要由含环氧基的液体聚丁烯组成的μm单位的分散相存在于主要由热固性树脂构成的连续相中。

26. 发明专利

JP2002338605A METHOD FOR MANUFACTURING EPOXIDIZED DIENE POLYMER 失效
公开(公告)号：JP2002338605A
公开(公告)日：2002-11-27
申请号：JP2001143844
申请日：2001-05-14
申请人： DAICEL CHEM
发明人： YABUI AKIHIRO , OTSUKA YOSHIHIRO
IPC分类号： C08C19/06 , C08F8/08
摘要： PROBLEM TO BE SOLVED: To provide a method for economically manufacturing an epoxidized diene polymer having excellent heat stability. SOLUTION: An epoxidized diene polymer is manufactured by epoxidizing a diene polymer having a sphere-converted particle size of 0.05-20 mm dispersed and/or suspended in a water medium in the presence of a phenolic stabilizer and/or a phosphorus-type stabilizer, and, optionally, an antiblocking agent in the form of powdery particles.

27. 发明专利

JP2002284933A MODIFIED CONJUGATED DIENIC POLYMER COMPOSITION AND RUBBER COMPOSITION 失效
公开(公告)号：JP2002284933A
公开(公告)日：2002-10-03
申请号：JP2001087223
申请日：2001-03-26
申请人： ASAHI KASEI CORP
发明人： YAMADA HARUO , SAITO AKIRA , KUBO NOBUAKI , MATSUDA TAKAAKI
IPC分类号： C08L15/00 , C08F8/08 , C08F8/30 , C08F8/42 , C08K3/36 , C08K5/00 , C08L91/00
摘要： PROBLEM TO BE SOLVED: To provide a dienic rubber composition which has excellent processability for the composition containing silica, and further has an improved balance between low rolling resistance and wet skid resistance, improved strength characteristics, and the like. SOLUTION: This modified conjugated dienic polymer composition comprises a modified polymer (component A) obtained by polymerizing a conjugated dienic monomer or copolymerizing a conjugated dienic monomer with an aromatic vinyl compound using an organic lithium compound as an initiator in a hydrocarbon solvent and then reacting the active terminals of the obtained polymer with a multifunctional compound having two or more epoxy groups in the molecule, and a modified polymer (component B) obtained by reacting the active terminals of the polymer with a modifying agent having a reactive functional group, and has a weight-average mol.wt. of 100,000 to 2,000,000.

28. 发明专利

JP3294903B2 失效
公开(公告)号：JP3294903B2
公开(公告)日：2002-06-24
申请号：JP12163693
申请日：1993-05-24
IPC分类号： C08C19/00 , C08C19/06 , C08F8/00 , C08F8/08

29. 发明专利

JP3255938B2 失效
公开(公告)号：JP3255938B2
公开(公告)日：2002-02-12
申请号：JP10154691
申请日：1991-05-07
IPC分类号： C08F8/08 , C08F210/00 , C08G59/02 , C08G59/34

30. 发明专利

JP2001172585A WATER-BASED RELEASING AGENT 失效
公开(公告)号：JP2001172585A
公开(公告)日：2001-06-26
申请号：JP36060499
申请日：1999-12-20
申请人： CHUKYO YUSHI KK
发明人： ARIGA HIDEYA
IPC分类号： C08K5/06 , C08F8/08 , C08F8/14 , C08F8/30 , C08K5/20 , C08L29/04 , C08L101/00 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a water-based releasing agent excellent in fastness. SOLUTION: The water-based releasing agent is obtained by admixing octadecyl vinyl ether and/or ethylenebisoleamide selected as a fastness-improving agent with a releasing component and an emulsifier. The compounded amount of the fastness-improving agent is 1-50 pts.wt. based on 100 pts.wt. of the releasing component.

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