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21. 发明专利

JP2014084434A Adhesive composition and adhesive film 有权
标题翻译：胶粘组合物和粘合膜
公开(公告)号：JP2014084434A
公开(公告)日：2014-05-12
申请号：JP2012236019
申请日：2012-10-25
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： IMAI HIROFUMI , OGATA HISAYUKI , KUBO ATSUSHI , YOSHIOKA TAKAHIRO , NOGUCHI TAKUYA , SUZUKI YASUO
IPC分类号： C09J125/08 , B32B25/14 , C09J7/02 , C09J153/00 , C09J157/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition capable of reducing swelling caused by a resist solvent and peeling from a support body, and to provide an adhesive film.SOLUTION: An adhesive composition contains an elastomer having a content of a styrene unit of 14 wt.% or more and 50 wt.% or less, and a hydrocarbon resin. The content rate of the elastomer with respect to the total amount of the elastomer and the hydrocarbon resin is 50 wt.% or more and 99 wt.% or less, and the content rate of the hydrocarbon resin is 1 wt.% or more and 50 wt.% or less.
摘要翻译：要解决的问题：提供能够减少由抗蚀剂溶剂引起的溶胀并从支撑体剥离并提供粘合剂膜的粘合剂组合物。溶液：粘合剂组合物含有苯乙烯单元含量为14的弹性体重量％以上且50重量％以下，以及烃类树脂。弹性体相对于弹性体和烃树脂的总量的含有率为50重量％以上且99重量％以下，烃系树脂的含有率为1重量％以上， 50重量％以下。

22. 发明专利

JP2014055280A Adhesive composition, adhesive film, and bonding method 有权
标题翻译：胶粘组合物，粘合膜和粘合方法
公开(公告)号：JP2014055280A
公开(公告)日：2014-03-27
申请号：JP2013117292
申请日：2013-06-03
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： NOGUCHI TAKUYA , OGATA HISAYUKI , KUBO ATSUSHI , IMAI HIROFUMI , YOSHIOKA TAKAHIRO
IPC分类号： C09J201/00 , B32B27/00 , B32B27/30 , C09J7/02 , C09J125/08 , C09J153/00
CPC分类号： H01L21/6836 , C09J7/387 , C09J2203/326 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2924/0002 , Y10T428/2878 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition capable of suppressing warpage of a laminate when the laminate is subjected to a heating process.SOLUTION: An adhesive composition includes an elastomer as a main component, and an adhesive layer prepared from the adhesive composition satisfies at least one of following conditions: a storage modulus (G') of 20,000 Pa or more at 220°C; and a loss modulus (G'') of 20,000 Pa or more at 220°C.
摘要翻译：要解决的问题：提供一种粘合剂组合物，其能够抑制层压体经受加热处理时的层压体翘曲。粘合剂组合物包括弹性体作为主要成分，并且由粘合剂组合物制备的粘合剂层满足以下条件中的至少一个：在220℃下的储能模量（G'）为20,000Pa以上; 和在220℃下的损耗模量（G“）为20,000Pa以上。

23. 发明专利

JP2014049698A Peeling method and peeling device 有权
标题翻译：剥离方法和剥离装置
公开(公告)号：JP2014049698A
公开(公告)日：2014-03-17
申请号：JP2012193574
申请日：2012-09-03
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： IMAI HIROFUMI , OGATA HISAYUKI , KUBO ATSUSHI , YOSHIOKA TAKAHIRO , NOGUCHI TAKUYA
IPC分类号： H01L21/683 , H01L21/304
CPC分类号： H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381
摘要： PROBLEM TO BE SOLVED: To easily separate a wafer and a support.SOLUTION: A peeling method for separating a support 2 which is adhered to a wafer 1 via an adhesive layer 3 from the wafer 1 comprises a solvent supplying step of supplying a solvent which decreases the adhesiveness on the surface by swelling the adhesive layer 3 to the adhesive layer 3 and a peeling step of peeling the swollen adhesive layer 3 from the wafer 1.
摘要翻译：要解决的问题：为了容易地分离晶片和支撑体。解决方案：通过粘合剂层3从晶片1分离附着到晶片1的支撑体2的剥离方法包括：溶剂供给步骤，通过将粘合剂层3溶胀到粘合剂层3，剥离粘合剂层3从晶片1剥离的剥离步骤来降低表面的粘附性。

24. 发明专利

JP2013234315A Adhesive agent composition, adhesive film, and pasting method 有权
标题翻译：胶粘剂组合物，粘合膜和抛光方法
公开(公告)号：JP2013234315A
公开(公告)日：2013-11-21
申请号：JP2013047374
申请日：2013-03-08
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： TAMURA KOKI , IMAI HIROFUMI , OGATA HISAYUKI , KUBO ATSUSHI , YOSHIOKA TAKAHIRO
IPC分类号： C09J153/00 , C09J5/00 , C09J7/02
CPC分类号： C09J153/00 , C09J5/00 , C09J7/02 , C09J7/20 , C09J7/387 , C09J153/025 , C09J2203/326 , C09J2453/00 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T428/2883
摘要： PROBLEM TO BE SOLVED: To provide an adhesive agent composition capable of forming an adhesive layer excellent in pasting easiness and heat resistance.SOLUTION: An adhesive agent composition contains a block copolymer, wherein an adhesive layer formed using the adhesive agent composition has a Young's modulus at 23°C of ≥0.1 GPa, a storage modulus(G') at 220°C of ≤1.5×10Pa, and a loss factor (tan σ) at 220°C of ≤1.3.
摘要翻译：要解决的问题：提供能够形成粘合容易性和耐热性优异的粘合剂层的粘合剂组合物。溶解性：粘合剂组合物含有嵌段共聚物，其中使用粘合剂组合物形成的粘合剂层具有杨氏模量在23℃≥0.1GPa时，220℃下的储能模量（G'）≤1.5×10Pa，220℃时的损耗系数（tan＆sgr）≤1.3。

25. 发明专利

JP2013199633A Method of producing adhesive composition, adhesive composition, and adhesive film 有权
标题翻译：粘合剂组合物的生产方法，粘合组合物和粘合膜
公开(公告)号：JP2013199633A
公开(公告)日：2013-10-03
申请号：JP2012283680
申请日：2012-12-26
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： IMAI HIROFUMI , OGATA HISAYUKI , KUBO ATSUSHI , YOSHIOKA TAKAHIRO , NOGUCHI TAKUYA
IPC分类号： C09J201/00 , B32B27/00 , C09J7/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition, wherein a residue is prevented from occurring on a wafer when the adhesive composition is used for making a wafer adhere to a support of the wafer and then cleaning is conducted through dissolution with a solvent.SOLUTION: A method of producing an adhesive composition for making a wafer adhere to a support of the wafer includes a purifying step of removing a conglutination-preventing agent contained in the adhesive composition.
摘要翻译：要解决的问题：提供一种粘合剂组合物，其中当将粘合剂组合物用于将晶片粘附到晶片的载体上时，防止在晶片上发生残余物，然后通过溶剂溶解进行清洁。制造用于使晶片粘附到晶片的支撑体上的粘合剂组合物的方法包括：除去粘合剂组合物中所含的凝固防止剂的净化步骤。

26. 发明专利

JP2013189622A Adhesive composition and adhesive film 有权
标题翻译：胶粘组合物和粘合膜
公开(公告)号：JP2013189622A
公开(公告)日：2013-09-26
申请号：JP2012268812
申请日：2012-12-07
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： IMAI HIROFUMI , OGATA HISAYUKI , KUBO ATSUSHI , YOSHIOKA TAKAHIRO
IPC分类号： C09J125/08 , B32B25/08 , B32B27/00 , C09J7/02 , C09J11/06 , C09J133/00 , C09J153/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition capable of adhering without applying high temperature or high pressure.SOLUTION: An adhesive composition comprises an elastomer containing the styrene unit as a main chain constituent unit and an acrylic resin of which 5% thermal weight loss temperature is ≥280°C.
摘要翻译：要解决的问题：提供能够在不施加高温或高压的情况下粘附的粘合剂组合物。溶液：粘合剂组合物包含含有苯乙烯单元作为主链构成单元的弹性体和丙烯酸树脂，其具有5％的热重量损失温度≥280℃。

27. 发明专利

JP2013184863A Substrate having rod-like molecule on surface thereof and method for producing the same 有权
标题翻译：在其表面上具有类似轴分子的基底及其生产方法
公开(公告)号：JP2013184863A
公开(公告)日：2013-09-19
申请号：JP2012052177
申请日：2012-03-08
申请人： Nara Institute Of Science & Technology , 国立大学法人奈良先端科学技術大学院大学 , Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： NAITO MASANOBU , NAKAMURA HIROAKI , OGATA HISAYUKI , TAKAYAMA JUICHI , HOSONO TAKAYUKI
IPC分类号： C01B31/02
CPC分类号： B05D7/24 , C09K19/02 , Y10T428/24736
摘要： PROBLEM TO BE SOLVED: To provide a method for orienting and self-organizing rod-like molecules in a specific direction on a specific place of a substrate surface, even when using rod-like molecules having a wide molecular length distribution, and to provide a substrate obtained by the method.SOLUTION: A substrate having rod-like molecules on a surface thereof, wherein the molecular length Lof the rod-like molecule is 2.0 or less times L, which is a length of the rod-like molecule in the molecular length direction within the convex portion includes: a substrate in which a pattern having a convex portion with a flat upper surface is formed on at least a part of the surface thereof; and a plurality of rod-like molecules, which are formed into rod-like shape, are aligned in line in a direction crossing a molecular length direction mutually on the upper surface of the convex portion, and show liquid crystallinity. A method for producing a substrate having rod-like molecules on the surface thereof has an adsorption step in which a solution or a dispersion liquid containing rod-like molecules showing liquid crystallinity is poured along the surface of the substrate in which the pattern having the convex portion with the flat upper surface is formed on at least the part of the surface thereof, to thereby adsorb the rod-like molecules onto the upper surface of the convex portion in the linearly aligned state in the direction crossing the molecular length direction mutually.
摘要翻译：要解决的问题：为了提供一种在基板表面的特定位置上在特定方向上定向和自组织棒状分子的方法，即使使用具有宽分子量分布的棒状分子，并且提供通过该方法获得的底物。溶液：其表面上具有棒状分子的底物，其中所述棒状分子的分子长度L为所述分子中棒状分子的长度的2.0倍以下凸部内的长度方向包括：在其表面的至少一部分上形成有具有平坦的上表面的凸部的图案的基板; 并且形成为棒状形状的多个棒状分子在与凸部的上表面相互分离的分子长度方向的方向上排成一行，显示出液晶性。在其表面具有棒状分子的基板的制造方法具有吸附工序，其中将含有液晶性的棒状分子的溶液或分散液沿着具有凸状的图案的基板的表面注入在其表面的至少一部分上形成有平坦的上表面的部分，从而在与分子长度方向相交的方向上以直线排列状态吸附棒状分子到凸部的上表面。

28. 发明专利

JP2009149743A Removal composition for removing adhesive 审中-公开
标题翻译：去除粘合剂的去除组合物
公开(公告)号：JP2009149743A
公开(公告)日：2009-07-09
申请号：JP2007327752
申请日：2007-12-19
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： IMAI HIROFUMI , MISUMI KOICHI , OGATA HISAYUKI , ASAI TAKAHIRO , TAKAHASHI MOTOKI
IPC分类号： C09D9/00 , C09D9/04 , C09J5/00
摘要： PROBLEM TO BE SOLVED: To provide a removal composition for adhesive removal, capable of speedily removing an adhesive.
SOLUTION: The removal composition for removing an adhesive contains at least one of a ketone type solvent and a nonionic surfactant.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够快速去除粘合剂的用于粘合剂去除的去除组合物。解决方案：用于除去粘合剂的去除组合物含有酮型溶剂和非离子表面活性剂中的至少一种。版权所有（C）2009，JPO＆INPIT

29. 发明专利

JP2009144092A Adhesive composition and adhesive film 审中-公开
标题翻译：胶粘组合物和粘合膜
公开(公告)号：JP2009144092A
公开(公告)日：2009-07-02
申请号：JP2007324516
申请日：2007-12-17
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： MISUMI KOICHI , ASAI TAKAHIRO , OGATA HISAYUKI , TAKAHASHI MOTOKI , IMAI HIROFUMI
IPC分类号： C09J125/08 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition having low hygroscopicity as well as high bonding strength, high heat resistance and alkali resistance.
SOLUTION: The adhesive composition consists primarily of a polymer obtained by copolymerizing a monomer composition including styrene, a (meth)acrylic ester having a cyclic structure, an alkyl (meth)acrylate having a chain structure, and a carboxylic acid having an ethylenic double bond. The adhesive composition is inhibited from absorbing moisture.
COPYRIGHT: (C)2009,JPO&INPIT

30. 发明专利

JP2009144048A Method for treating adhesive 有权
标题翻译：用于处理粘合剂的方法
公开(公告)号：JP2009144048A
公开(公告)日：2009-07-02
申请号：JP2007322571
申请日：2007-12-13
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： IMAI HIROFUMI , MIYANARI ATSUSHI , MISUMI KOICHI , OGATA HISAYUKI , ASAI TAKAHIRO , TAKAHASHI MOTOKI
IPC分类号： C09J5/06 , C09J7/02 , C09J125/08 , C09J133/06 , C09J201/02
摘要： PROBLEM TO BE SOLVED: To provide a method for treating an adhesive for obtaining an adhesive which, even in a high-temperature environment, shows suppressed foaming and keeps a high adhesive strength. SOLUTION: The method for treating an adhesive composition according to this invention includes the heat treatment step of heat-treating an adhesive comprising a composition containing a polymer having structural units each containing a hydrogen bond-forming substituent at above 100 to 150°C. This makes it possible to obtain an adhesive which shows suppressed foaming even when the adhesive is subjected to a high-temperature heat treatment. A good adhesive strength can be attained by sticking adherends together through the adhesive with suppressed foaming. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决问题的方案：提供一种处理粘合剂以获得粘合剂的方法，即使在高温环境下也显示抑制发泡并保持高粘合强度。解决方案：根据本发明的用于处理粘合剂组合物的方法包括热处理步骤，该粘合剂包含含有各自含有形成氢键的取代基的结构单元的聚合物的组合物在100〜150℃以上 C。这使得可以获得即使当粘合剂进行高温热处理时也显示抑制发泡的粘合剂。通过粘合剂将被粘物粘在一起，抑制发泡，可以获得良好的粘合强度。版权所有（C）2009，JPO＆INPIT

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