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    • 21. 发明专利
    • Underwater welding equipment
    • 水下焊接设备
    • JP2011016153A
    • 2011-01-27
    • JP2009162735
    • 2009-07-09
    • Toshiba Corp株式会社東芝
    • TAMURA MASAKIKONO WATARUSHIIHARA KATSUNORITANAKA YOSHIMIUEHARA TAKUYAYODA MASAKIHAMAMOTO YOSHIOOKADA SATOSHIKATO HIROMIMAEHARA TAKESHITAKEUCHI MASAHIRO
    • B23K26/06B23K26/12B23K26/14B23K26/20
    • PROBLEM TO BE SOLVED: To provide underwater welding equipment which suppresses a degradation in a shielding cover and stably performs welding work in water over a long term as a result.SOLUTION: The underwater welding equipment includes an underwater welding head which is connected with a laser beam oscillator and shielding gas supply source and has a welding wire supplying system and an optical system for condensing a laser beam, and welds parts to be welded of a structure in water by arranging the underwater welding head in water. In the underwater welding equipment, a reflected beam absorber for absorbing the reflected beam of the laser beam is provided in the periphery of a nozzle part which is situated on the side of the distal end of the underwater welding head and emits the laser beam, and the shielding cover which is composed of an elastic member and forms a gas-space on the side of the distal end of the underwater welding head is provided in the periphery of the reflected beam absorber.
    • 要解决的问题:提供一种能够抑制屏蔽罩劣化的水下焊接设备,从而长期稳定地进行水中的焊接作业。解决方案:水下焊接设备包括与激光连接的水下焊接头 射束振荡器和保护气体供应源,并具有焊丝供给系统和用于冷凝激光束的光学系统,并且通过将水下焊接头布置在水中来将待结构的待焊接部件焊接在水中。 在水下焊接设备中,在位于水下焊接头的远端一侧的喷嘴部的周围设置用于吸收激光束的反射光束的反射光束吸收体,发射激光束, 在反射光束吸收体的周边设有由弹性部件构成并在水中焊接头的前端侧形成气体空间的屏蔽盖。
    • 22. 发明专利
    • Device and method for machining metal structure
    • 用于加工金属结构的装置和方法
    • JP2007125657A
    • 2007-05-24
    • JP2005320949
    • 2005-11-04
    • Toshiba Corp株式会社東芝
    • UEHARA TAKUYAMUKAI SHIGEHIKOKURIHARA KENJITODA MASAMIKUBO TATSUYA
    • B23H3/10
    • PROBLEM TO BE SOLVED: To provide a device and a method for removing and cutting a metal structure with a little consumption of electrolytic solution and at high machining speed by electrochemical machining.
      SOLUTION: This device is provided with a machining head 101 provided with a machining electrode 10 and installed on a surface of the metal structure 5 to be a machining object to form an electrolytic solution environment between the machining electrode 10 and the metal structure 5, a power source device 12 to impress dc voltage between the machining electrode 10 and the metal structure 5, an electrolytic solution recovery path 34 connected to the machining head 101 to recover the electrolytic solution 7 from the machining head 101, an electrolytic solution supply path 33 connected to the machining head 101 to supply the electrolytic solution 7 to the machining head 101, and an electrolytic solution reproducing system 22 connected to the electrolytic solution recovery path 34 and the electrolytic solution supply path 33 to adjust components for reusing the recovered electrolytic solution 7.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种通过电化学加工以少量电解溶液和高加工速度去除和切割金属结构的装置和方法。 解决方案:该装置设置有加工头101,该加工头101设置有加工电极10,并且安装在金属结构5的作为加工对象的表面上,以在加工电极10和金属结构之间形成电解液环境 如图5所示,在加工电极10和金属结构体5之间施加直流电压的电源装置12,与加工头101连接的电解液回收路径34,从加工头101回收电解液7,电解液供给 连接到加工头101的路径33将电解液7供应到加工头101,以及连接到电解液回收路径34和电解溶液供应路径33的电解液再现系统22,以调节用于再利用回收的电解质的元件 解决方案7.版权所有(C)2007,JPO&INPIT
    • 23. 发明专利
    • Optical measuring method and device
    • 光学测量方法和器件
    • JP2005214721A
    • 2005-08-11
    • JP2004020041
    • 2004-01-28
    • Toshiba Corp株式会社東芝
    • UEHARA TAKUYAKOBAYASHI NORIYASUYAMAMOTO TETSUO
    • G01B11/00
    • PROBLEM TO BE SOLVED: To provide an optical measuring method and a device capable of bringing quickly a focal vibration center position close to a focusing point position even when the focal vibration center position is separated greatly from the focusing point on a measuring object, and thereby performing efficient and safe optical measurement.
      SOLUTION: This device has a constitution having an irradiation head 4 for condensing measuring light 2 and irradiating the measuring object 3 therewith, a light receiving element 16 for detecting return light when irradiating the measuring object with the measuring light from the irradiation head, periodical optical path length changing devices 7, 20 for changing periodically the optical path length from the measuring object to the light receiving element, a return light detection device 17 for receiving a signal from the light receiving element and detecting a return light intensity change caused by an optical path length change by the periodical optical path length changing devices, an operation device 18 for receiving a signal from the return light detection device, detecting synchronously a return light intensity change signal by a periodical optical path length changing response, and outputting a control command which is different corresponding to the magnitude of the result to a prescribed threshold to optical path length correction mechanisms 8, 19, and the optical path length correction mechanisms 8, 19 for receiving the control command from the operation device, driving the irradiation head in the optical axis direction, and allowing the focal vibration center position of laser light to agree with the focusing point on the measuring object 3.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了提供一种光学测量方法和能够即使当聚焦振动中心位置与测量对象上的聚焦点大大分离时也能够使焦点振动中心位置接近聚焦点位置的装置 ,从而进行有效且安全的光学测量。 解决方案:该装置具有一个结构,其具有用于冷凝测量光2并照射测量对象3的照射头4,用于在用来自照射头的测量光照射测量对象时检测返回光的光接收元件16 用于周期性地改变从测量对象到光接收元件的光程长度的周期光路长度变化装置7,20,用于从光接收元件接收信号并检测返回光强度变化的返回光检测装置17 通过周期性光路长度改变装置的光程长度变化,用于接收来自返回光检测装置的信号的操作装置18,通过周期性光程长度改变响应同步地检测返回光强度变化信号,并输出 控制命令根据结果的大小不同而不同 光路长度校正机构8,19的规定阈值和用于从操作装置接收控制命令的光路长度校正机构8,19,沿着光轴方向驱动照射头,并且允许焦点振动中心位置 的激光符合测量对象3上的聚焦点。版权所有(C)2005,JPO&NCIPI
    • 26. 发明专利
    • Optical component diagnostic method for laser processing device, and the laser processing device
    • 用于激光加工装置的光学部件诊断方法和激光加工装置
    • JP2013086110A
    • 2013-05-13
    • JP2011226829
    • 2011-10-14
    • Toshiba Corp株式会社東芝
    • TOKUNAGA YASUAKISHIIHARA KATSUNORIUEHARA TAKUYASENDA ITARU
    • B23K26/00H01S3/00
    • PROBLEM TO BE SOLVED: To provide an optical component diagnostic method for a laser processing device which can accurately detect deterioration of an optical component without depending on a state of a processed portion, and to provide the laser processing device.SOLUTION: The method of diagnosing deterioration of the optical component of the laser processing device which performs laser processing by irradiating a workpiece with laser beams oscillated from a laser oscillator via the optical component installed within a laser processing head includes: an optical path changing unit which has a reflection mechanism reflecting the laser beams and a drive mechanism driving the reflection mechanism and changes an optical path of the laser beams from an optical path during laser processing of the workpiece to an optical path during diagnosis; and a laser beam measuring unit disposed on the optical path during diagnosis changed by the optical path changing unit. Based on the intensity of the laser beams measured by the laser beam measuring unit, deterioration of the optical component is diagnosed.
    • 解决的问题:提供一种激光加工装置的光学部件诊断方法,其能够不依赖于加工部的状态而精确地检测光学部件的劣化,并提供激光加工装置。 解决方案:通过经由安装在激光加工头中的光学部件从激光振荡器振荡的激光束照射工件来进行激光加工的激光加工装置的光学部件的劣化诊断方法包括:光路 改变单元,其具有反射激光束的反射机构,驱动机构驱动反射机构,并且在诊断期间将工件的激光加工期间的激光加工期间的激光束的光路从光路改变; 以及在由光路改变单元改变的诊断期间设置在光路上的激光束测量单元。 基于由激光束测量单元测量的激光束的强度,诊断光学部件的劣化。 版权所有(C)2013,JPO&INPIT
    • 28. 发明专利
    • Laser irradiation apparatus
    • 激光辐射装置
    • JP2010051999A
    • 2010-03-11
    • JP2008218556
    • 2008-08-27
    • Toshiba Corp株式会社東芝
    • UEHARA TAKUYAMUKAI SHIGEHIKOHIROTA KEIICHISENDA ITARUYODA MASAKISAEKI AYAICHI
    • B23K26/06B23K26/12C21D7/06
    • PROBLEM TO BE SOLVED: To enlarge the processable range of a laser beam on an optical axis, which is the range of energy density required for suppressing breakdown and obtaining the effect of laser peening. SOLUTION: A laser irradiation apparatus includes: a laser beam source 1, a laser beam transmitting means 19 for transmitting the laser beam emitted from the laser beam source, an irradiation position moving means 5 for arbitrarily moving the irradiation position of the laser beam to a solid material, a condensing means 12 for condensing a laser beam to be irradiated, and a projection area adjustment means for arbitrarily adjusting the projecting area of the laser projected on the surface of the solid material. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:扩大激光束在光轴上的可加工范围,这是抑制击穿所需的能量密度的范围并获得激光喷丸的效果。 解决方案:激光照射装置包括:激光束源1,用于透射从激光束源发射的激光束的激光束发射装置19,用于任意移动激光照射位置的照射位置移动装置5 光束到固体材料,用于冷凝待照射的激光束的聚光装置12和用于任意调节投影在固体材料的表面上的激光的投影面积的投影区域调节装置。 版权所有(C)2010,JPO&INPIT
    • 29. 发明专利
    • Laser beam impact hardening treatment method and laser beam impact hardening treatment apparatus
    • 激光束冲击硬化处理方法和激光束冲击硬化处理装置
    • JP2008248270A
    • 2008-10-16
    • JP2007087616
    • 2007-03-29
    • Toshiba Corp株式会社東芝
    • SANO YUJIMUKAI SHIGEHIKOYODA MASAKIUEHARA TAKUYASAEKI RIYOUICHI
    • C21D1/09
    • PROBLEM TO BE SOLVED: To enable treating of a laser beam peening at high velocity to a large area with which in a laser beam impact treatment method, the coating on the surface is unnecessary and the raising of hardness and the improving effect of residual stress of a member to be treated, are extended to the deep range. SOLUTION: In this laser beam impact hardening treatment method, the pulse-state laser beam 51 is applied on the surface of the member 41 to be treated, contacted with liquid 22 through the liquid 22 to perform the surface treatment of the member 41 to be treated. The emitting spot of the laser beam formed with one pulse on the surface of the member 41 to be treated, are constituted with a plurality of small ranges having the same shape and arranged in the same intervals, The shape of respective small range can be obtained to a slender long-state, round-state or square-state. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:为了能够以高速度对激光束冲击处理方法的大面积进行激光束喷丸处理,在表面上不需要涂层,并且提高硬度和改善效果 要处理的构件的残余应力延伸到深度范围。 解决方案:在该激光束冲击硬化处理方法中,将脉冲状态激光束51施加在被处理部件41的表面上,并通过液体22与液体22接触,对该部件进行表面处理 41待处理。 在待处理的构件41的表面上形成有一个脉冲的激光束的发射点由具有相同形状并以相同间隔布置的多个小范围构成。可以获得各个小范围的形状 到一个细长的长期状态,圆形状态或平方状态。 版权所有(C)2009,JPO&INPIT
    • 30. 发明专利
    • Monitoring device of structure and monitoring method therefor
    • 监测其结构和监测方法
    • JP2008241658A
    • 2008-10-09
    • JP2007086573
    • 2007-03-29
    • Toshiba Corp株式会社東芝
    • MUKAI SHIGEHIKOOCHIAI MAKOTOUEHARA TAKUYAYAMAMOTO SATOSHITAKABAYASHI JUNICHISANO YUJI
    • G01M99/00G01N21/954G01V8/10G21C17/003G21C17/08
    • PROBLEM TO BE SOLVED: To perform state monitoring, abnormality monitoring, foreign matter monitoring and remote monitoring, having furthermore heightened discrimination capacity than the case wherein observation is performed by an ordinary camera, by changing a photographing condition of a monitoring image flexibly in accordance with a spectrum characteristic, an optical polarization characteristic or a time change characteristic of a monitoring object. SOLUTION: This monitoring device 1 of a structure is a device for monitoring the monitoring object 30 which is a structure. The monitoring device 1 of the structure is equipped with a monitoring part 2 and an operation part 3. The monitoring part 2 is equipped with a light source part 4, a photographing part 5 and a monitoring part support member 6. The operation part 3 is equipped with a photographing part control unit 7, a computer 8 for system control, a light source part driver 9, a display device 10 and an input device 11. The light source part 4 is equipped with a light source 4A. The photographing part 5 is equipped with a camera 5A, and the camera 5A is equipped with a lens optical system 5B and a monochromatic imaging element 5C. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题为了进行状态监视,异常监视,异物监视和远程监视,还具有比通过普通摄像机进行观察的情况更高的识别能力,通过灵活地改变监视图像的拍摄条件 根据频谱特性,监视对象的光学偏振特性或时间变化特性。 解决方案:结构的监视装置1是用于监视作为结构的监视对象30的装置。 该结构的监视装置1配备有监视部2和操作部3.监视部2配备有光源部4,拍摄部5和监视部支撑部6.操作部3为 配备有拍摄部控制单元7,用于系统控制的计算机8,光源部驱动器9,显示装置10和输入装置11.光源部4配备有光源4A。 拍摄部件5配备有照相机5A,照相机5A配备有透镜光学系统5B和单色成像元件5C。 版权所有(C)2009,JPO&INPIT