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23. 发明专利

JPS644668B2 失效
公开(公告)号：JPS644668B2
公开(公告)日：1989-01-26
申请号：JP23039982
申请日：1982-12-23
申请人： TOKYO SHIBAURA ELECTRIC CO
发明人： MIZUNOYA NOBUYUKI , KOHAMA HAJIME , SUGIURA YASUYUKI
IPC分类号： H01L23/12 , C04B41/88 , H01L21/48 , H01L21/52 , H01L23/15 , H05K1/03 , H05K3/38

26. 发明专利

JPS57182461A HEAT DISSIPATING SUBSTRATE 失效
公开(公告)号：JPS57182461A
公开(公告)日：1982-11-10
申请号：JP6815281
申请日：1981-05-08
申请人： TOKYO SHIBAURA ELECTRIC CO
发明人： MIZUNOYA NOBUYUKI
IPC分类号： H05K1/02 , B41J2/335 , B41J2/375 , H05K1/05
摘要： PURPOSE:To efficiently dissipate heat produced by a heating element and at the same time to avoid deformation of the ceramic thin plate by attaching the metal plate to the undersurface of the ceramic thin plate for a dissipating substrate for the thermal head. CONSTITUTION:A dissipating substrate for thermal head is constituted with metal plate 8 made up of good heat conductive materials such as alumina glue and silica glue, and where a thermal resistant layer is formed on its top surface. As materials for the metal plate and glue have higher heat conductivity than the ceramic thin plate, the quantity of in-flowing heat of the ceramic thin plate dissipates efficiently into the atmosphere after flowing in, and the rise of temperature of the ceramic thin plate is supressed. Consequently, the thermal deformation of ceramic thin plate is reduced.

28. 发明专利

JPS5541268A SENSIBLE HEAT HEAD 失效
公开(公告)号：JPS5541268A
公开(公告)日：1980-03-24
申请号：JP11489778
申请日：1978-09-19
申请人： TOKYO SHIBAURA ELECTRIC CO
发明人： SUZUKI SHIGEO , MIZUNOYA NOBUYUKI , MIHARA KAKUO
IPC分类号： B41J2/335 , B41J2/345 , H01L49/02
摘要： PURPOSE:To expand a range that thick film wiring is formed, by connecting thick film conductors mounted to the upper and lower portions of the first and second glass layers made up on a substrate by building up a thick film connecting conductor between said glass layers, in this sensible heat head provided with the thick film wiring. CONSTITUTION:The first glass layer 3 and the second glass layer 4 are formed on the same plane of a substrate 1, a thick film conductor 2 is made up on the substrate 1 as an inaulating layer and conductors 6, 7 are built up on the upper surfaces of both glass layers. The thick film conductor 2 is esdily drawn and connected to the conductors 6, 7 on the glass layers by forming a thick film connecting conductor 5 between both glass layers. Thus, a large number of thick film conductors can be made up at narrow locations where length is limited because conductors at the upper side and the conductor at the lower side can mutually be built up without being restricted in dimensional shapes as multilayer wiring structure.

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