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    • 25. 发明专利
    • MAGNETO-RESISTANCE EFFECT TYPE THIN FILM HEAD
    • JPS60185220A
    • 1985-09-20
    • JP3874884
    • 1984-03-02
    • NIPPON TELEGRAPH & TELEPHONE
    • NAGAI YASUHIROTOSHIMA TOMOYUKI
    • G11B5/39H01L43/08
    • PURPOSE:To generate a semi-simple magnetic domain structure easily and to improve an output by setting the aspect ratio (length/width) of a thin film stripe to a value within the formation of the semi-simple magnetic domain structure. CONSTITUTION:Although circulated magnetic domains 6a-6d appear on both the end sides of stripes of a thin film head 4, a semi-simple magnetic domain structure having no magnetic wall is formed on the center part other than both the sides of the stripes which is used as a magnetic sensor. When the aspect ratio is changed, a critical aspect ratio divided into a multi-magnetic domain structure and the semi-simple magnetic domain exists and the aspect ratio depends upon the film thickness or the like of MR stripes. If the aspect ratio is set to 8 or more by changing the film thickness of the stripes of the MR head 4 and the aspect ratio variously, the semi-simple magnetic domain state appears stably at the normally used film thickness. If the stripe ratio is increased moreover, the area ratio of the magnetic domains 6a-6d to the whole is reduced and the greater part of the head 4 is operated at a state close to the simple magnetic domain structure.
    • 27. 发明专利
    • FLATTENING METHOD OF SUBSTRATE
    • JPS60173839A
    • 1985-09-07
    • JP2434184
    • 1984-02-14
    • NIPPON TELEGRAPH & TELEPHONE
    • NAGAI YASUHIROYANAGISAWA KEIICHINISHIMURA TSUTOMUTOSHIMA TOMOYUKI
    • H01L21/302H01L21/3065H01L21/31
    • PURPOSE:To flatten the irregularities of the surface of a substrate through a simple process by a method wherein an inorganic insulating film as a flattening material is formed on the substrate, an organic resist is applied, the surface of the resist is flattened once through heat treatment, the substrate is disposed to an ion-beam axis at a specific angle and etching the surface by ion beams. CONSTITUTION:An inorganic insulating film 4 is formed on the surface of a substrate in thickness of approximately twice as large as the thickness of a conductor pattern film as a flattening material so as to coat the irregular surface of the conductor pattern 2. The surface of the insulating film 4 is shaped in an irregular surface corresponding to the surface of the conductor pattern 2 at that time. An organic resist is applied on the irregular surface on the insulating film 4 so as to coat the surface of the insulating film 4, and a resist film 3a with a flat surface is formed on the insulating film 4 and the surface of the substrate is flattened once by thermally treating the organic resist. When the surface of the substrate is flattened through ion beam etching, the substrate 1 is arranged to the axis of ion beams 10 at an angle theta of 50-70 deg.C, and the resist film 3a and the upper layer section of the insulating film 4 are etched simultaneously by ion beams.