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21. 发明专利

JP2011035334A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2011035334A
公开(公告)日：2011-02-17
申请号：JP2009182937
申请日：2009-08-06
申请人： Panasonic Corp , パナソニック株式会社
发明人： KUWABARA RYO , YAMAGUCHI ATSUSHI , MIYAGAWA HIDEKI
IPC分类号： H01L23/29 , H01L23/31
CPC分类号： H01L2224/48091 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To simultaneously improve fillability of a material, to prevent a wire displacement and to improve heat dissipation characteristics of a package. SOLUTION: A sealing material 1 with small filling amount of filler performs resin sealing around a wire 5 and a sealing material 2 with large filling amount of filler performs resin sealing to the entire wire 5, thereby simultaneously improving fillability of the material, preventing the wire displacement, and improving the heat dissipation characteristics of the package. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：同时提高材料的填充性，防止线移动并改善包装的散热特性。解决方案：填充量小的密封材料1在线材5周围进行树脂密封，填充量大的密封材料2对整个线材进行树脂密封，从而同时改善材料的填充性，防止线排列，提高封装的散热特性。版权所有（C）2011，JPO＆INPIT

22. 发明专利

JP2010074086A Cream solder and method of manufacturing mounting structure using the same 审中-公开
标题翻译：乳胶焊接机及其使用方法制造安装结构
公开(公告)号：JP2010074086A
公开(公告)日：2010-04-02
申请号：JP2008242934
申请日：2008-09-22
申请人： Panasonic Corp , パナソニック株式会社
发明人： MATSUNO KOSO , MIYAGAWA HIDEKI , YAMAGUCHI ATSUSHI , OWADA HIROE , TSUJIMURA HIDEYUKI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a cream solder that facilitates the repairing of electronic parts and a mounting structure where a solder joint is selectively protected with coating.
SOLUTION: The cream solder includes a solder, a flux, a volatile solvent, the components of a coating agent, wherein a hydrocarbon system solvent is used for the volatile solvent, and one kind out of olefin system resin, acrylic resin, rubber-base resin, urethane resin, and epoxy resin or a mixture of these components for the components of the coating agent. If BGA2 or the electronic parts 3 are mounted on a printed circuit board 1 using this cream solder, when the solder is melted, the components of the coating agent selectively cover a solder joint portion 4 and a circumferential portion on the board with film, and the volatile solvent is volatilized to form a protective film 5 is provided.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供有助于修复电子部件的膏状焊料和其中通过涂覆选择性地保护焊点的安装结构。解决方案：膏状焊料包括焊剂，焊剂，挥发性溶剂，涂料的组分，其中烃系溶剂用于挥发性溶剂，以及烯烃体系树脂，丙烯酸树脂，橡胶基树脂，聚氨酯树脂和环氧树脂或这些组分的混合物用于涂层剂的组分。如果BGA2或电子部件3使用这种膏状焊膏安装在印刷电路板1上，则当焊料熔化时，涂层剂的组分选择性地用膜覆盖焊接部分4和板上的圆周部分，并且挥发性溶剂挥发形成保护膜5。版权所有（C）2010，JPO＆INPIT

23. 发明专利

JP2009295968A Surface mount adhesive, mounting structure including the same, and method for producing the mounting structure 审中-公开
标题翻译：表面安装胶粘剂，包括其的安装结构以及生产安装结构的方法
公开(公告)号：JP2009295968A
公开(公告)日：2009-12-17
申请号：JP2009106741
申请日：2009-04-24
申请人： Panasonic Corp , パナソニック株式会社
发明人： KUWABARA RYO , YAMAGUCHI ATSUSHI , MIYAGAWA HIDEKI
IPC分类号： H05K3/34 , C09J11/04 , C09J11/06 , C09J163/00
CPC分类号： H05K3/305 , C08K3/34 , C09J163/00 , H05K2201/0209 , H05K2201/0266 , H05K2201/10689 , Y02P70/613
摘要： PROBLEM TO BE SOLVED: To restrain a defect at the time of coating an adhesive agent for surface mount for improving coating stability. SOLUTION: The adhesive agent for surface mount includes an epoxy resin, a hardening agent, a hardening accelerator, a first filler, and a second filler. The specific gravity of the second filler is 1.1 to 3 times that of the first filler, and the hardness of the second filler is larger than that of the first filler. A maximum grain diameter of the first filler is 1 to 100 μm, and a maximum grain diameter of the second filler is 1 to 100 μm. The second filler has a specific gravity of 1.7 to 4.5 with a modified Mohs hardness of 2 to 12, the ratio of weight of the first filler to the second filler is 1:3 to 3:1, and the specific gravity as a whole is 1.2 to 1.5. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了抑制涂布用于表面贴装的粘合剂时的缺陷，以提高涂料的稳定性。解决方案：用于表面贴装的粘合剂包括环氧树脂，硬化剂，硬化促进剂，第一填料和第二填料。第二填料的比重为第一填料的比重的1.1〜3倍，第二填料的硬度比第一填料的硬度大。第一填料的最大粒径为1〜100μm，第二填料的最大粒径为1〜100μm。第二填料的比重为1.7〜4.5，改性莫氏硬度为2〜12，第一填料与第二填料的重量比为1:3〜3:1，整体比重为 1.2〜1.5。版权所有（C）2010，JPO＆INPIT

24. 发明专利

JP2009135479A Mounted structure 有权
标题翻译：安装结构
公开(公告)号：JP2009135479A
公开(公告)日：2009-06-18
申请号：JP2008282666
申请日：2008-11-04
申请人： Panasonic Corp , パナソニック株式会社
发明人： YAMAGUCHI ATSUSHI , MIYAGAWA HIDEKI , SAKATANI SHIGEAKI , MATSUNO KOSO
IPC分类号： H05K3/34 , H01L21/56 , H01L25/04 , H01L25/18 , H05K3/28 , H05K3/32
CPC分类号： H05K3/3484 , B23K35/264 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/284 , H05K3/321 , H05K3/3463 , H01L2924/3512 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounted structure for simplifying solder processing and achieving a low-temperature junction. SOLUTION: A plurality of semiconductor elements are adjacently mounted on a substrate by a solder with a melting point of 200°C and lower or a conductive adhesive including a solder with a melting point of 200°C and lower as conductive particles, an electronic component other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by the solder with the melting point of 200°C and lower or the conductive adhesive including the solder with the melting point of 200°C and lower as the conductive particles, and spaces between the plurality of the semiconductor elements and the substrate, spaces between the electronic component and the substrate, and spaces between the plurality of the semiconductor elements and the electronic component are integrally sealed with a sealing resin. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于简化焊接处理和实现低温结的安装结构。解决方案：多个半导体元件通过熔点为200℃或更低的焊料或包含熔点为200℃以下的焊料的导电粘合剂作为导电颗粒相邻地安装在基板上，除了半导体元件之外的电子部件通过熔点为200℃以下的焊料或包含熔点在200℃以下的焊料的导电性粘接剂安装在相邻安装的半导体元件之间的基板上，作为导电粒子和多个半导体元件与基板之间的空间，电子部件与基板之间的空间以及多个半导体元件与电子元件之间的空间与密封树脂一体地密封。版权所有（C）2009，JPO＆INPIT

25. 发明专利

JP2008303264A Electroconductive adhesive, and conduction connection part 有权
标题翻译：电磁粘接和导电连接部分
公开(公告)号：JP2008303264A
公开(公告)日：2008-12-18
申请号：JP2007150233
申请日：2007-06-06
申请人： Panasonic Corp , パナソニック株式会社
发明人： YAMAGUCHI ATSUSHI , MIYAGAWA HIDEKI , MATSUNO KOSO
IPC分类号： C09J201/00 , C09J9/02 , C09J11/04 , C22C5/06 , C22C14/00 , C22C19/03 , H01B1/22 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an electroconductive adhesive forming a conduction connection part at relatively low temperature, wherein, in the case that abnormal current is caused to flow after the formation of a conduction connection part, the conduction connection part functions as a protective device for a circuit, for reducing or cutting-off electric conduction. SOLUTION: The electroconductive adhesive contains at least shape memory alloy filler particles as an electroconductive filler component in addition to a resin component. Further, a conduction connection part formed by curing the electroconductive adhesive exhibits low resistance in the case of less than a prescribed temperature range, but exhibits high resistance when temperature reaches the prescribed temperature range or exceeds the same temperature range. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供在相对低的温度下形成导电连接部件的导电粘合剂，其中，在形成导电连接部件之后使异常电流流动的情况下，导电连接部件作为用于电路的保护装置，用于减少或切断电传导。解决方案除了树脂组分之外，导电粘合剂至少含有形状记忆合金填料颗粒作为导电填料组分。此外，在小于规定的温度范围的情况下，通过固化导电粘合剂形成的导电连接部显示低电阻，但是当温度达到规定的温度范围或超过相同的温度范围时，表现出高的电阻。版权所有（C）2009，JPO＆INPIT

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