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    • 22. 发明专利
    • GROWING METHOD OF COMPOUND SEMICONDUCTOR SINGLE CRYSTAL HAVING VOLATILITY
    • JPS6090895A
    • 1985-05-22
    • JP19533883
    • 1983-10-20
    • FURUKAWA ELECTRIC CO LTD
    • OZAWA SHIYOUICHIKIJIMA TAKASHIAZUMA KATSUMIKASHIYANAGI YUUZOU
    • C30B27/02C30B15/10H01L21/208
    • PURPOSE:To grow a uniform and high-quality single crystal by covering the upper layer of the melt with a liquid capsuling material layer, and incorporating a specific melt floating layer into the lower layer in pulling up a III-V group compd. semiconductor single crystal from the melt in a crucible and drying. CONSTITUTION:The surface of a GaAs melt layer 23 in a quartz crucible 21 is covered with a liquid capsuling material layer (B2O3)22, and a melt floating material layer (Bi2O3)24 which does not react with the melt 23 and whose specific gravity and specific heat are higher than those of the melt 23 is placed under the layer 22. In addition, a film 25 of the melt floating material is formed on the inner surface of the crucible 21 contacting with the melt 24. Under said conditions, a seed crystal 29 supported by a lifting shaft 28 is passed through the liquid capsuling material layer 22, brought into contact with the melt layer 23, and lifted up while rotating to gradually grow a GaAs single crystal 30. The change of thermal conditions due to the decrease in the amt. of the melt during the growth of the single crystal is prevented by the liquid capsuling material layer 22, and the optimum conditions are maintained. The intrusion of impurities from the crucible 21 is prevented by the melt floating material layers 24 and 25, and the high-quality single crystal 30 can be obtained.
    • 27. 发明专利
    • PRODUCTION OF SEMICONDUCTOR SINGLE CRYSTAL
    • JPS62230696A
    • 1987-10-09
    • JP7524186
    • 1986-04-01
    • FURUKAWA ELECTRIC CO LTD
    • NAKAYAMA HIROSHIKIJIMA TAKASHIAZUMA KATSUMIKASHIYANAGI YUZO
    • C30B27/02H01L21/18H01L21/208
    • PURPOSE:To prevent formation of polycrystals and occurrence of twins and obtain a complete single crystal in improved wafer yield without insufficient diameter, by relatively controlling the pulling up speed of the single crystal and temperature decreasing rate of a heater when a given solidification ratio is attained. CONSTITUTION:A raw material for semiconductor a single crystal is put in a PBN crucible 6 placed in a susceptor 5 on a crucible pushing up shaft (crucible shaft) 4 in a high-pressure vessel 1 and melted by heating with a heater 2 to give a raw material melt 9. The surface of the raw material melt 9 is then covered with B2O3 melt 8 and a seed crystal 10 at the tip of a crystal pulling up shaft (seed shaft) 3 is dipped to the compatible with the surface of the raw material melt 9 and then the resultant single crystal 7 is pulled up by pulling up only the seed shaft 3 at 5.3mm/hr speed up to, e.g. 2.5% solidification ratio, at 5.3mm/hr speed. When the solidification ratio attains 2.5%, the crucible shaft 4 is pushed up at 1.4mm/hr speed to reduce the crystal pulling up speed to 3.9mm/hr. When the solidification ratio attains 50%, the crystal pulling up speed is dropped to 3.0mm/hr which is about decreased by 23%. During that time, temperature is decreased at a temperature decreasing rate corresponding to the speed to pull up the aimed single crystal while controlling the diameter.