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    • 23. 发明专利
    • ELECTRONIC COMPONENT MOUNTER AND MOUNTING METHOD THEREOF
    • JPH11177288A
    • 1999-07-02
    • JP33832997
    • 1997-12-09
    • MATSUSHITA ELECTRIC IND CO LTD
    • MURATA KAZUHIROINUZUKA RYOJISAKON HIDEO
    • B23P21/00H05K13/04H05K13/08
    • PROBLEM TO BE SOLVED: To provide an electronic component mountier in which an electronic component sucking nozzle is rotated, while the sucking nozzle is recognized by a recognition camera directly from under and a recognition camera directly from its side and 'chippings' of the sucking nozzle can be detected in advance. SOLUTION: A mounter comprises a sucking nozzle 15 for sucking an electronic component, a drive part for rotating the sucking nozzle 15 for sucking electronic component, a recognition camera for recognizing the sucking nozzle directly from under, and a recognition camera for recognizing it directly it from its side. In this case, by the drive part which rotates the sucking nozzle 15 for sucking electronic components from a component supply part 11 of the electronic components, whenever the sucking nozzle is rotated to one direction by predetermined angular range, the nozzle 15 is recognized by the recognition camera for recognizing the nozzle directly from under and the recognition camera for recognizing it directly from its side, to process images, and an inspection is made in advance whether or not there is an abnormality such as 'chippings' in the nozzle 15 for sucking the electronic components.
    • 24. 发明专利
    • BOARD MARK RECOGNITION CONTROL METHOD FOR ELECTRONIC PART MOUNTING EQUIPMENT
    • JPH10242700A
    • 1998-09-11
    • JP3930997
    • 1997-02-24
    • MATSUSHITA ELECTRIC IND CO LTD
    • MURATA KAZUHIROMURAMAKI KATSUYAINUZUKA RYOJI
    • H05K13/04H05K13/08
    • PROBLEM TO BE SOLVED: To enhance productivity of electronic part and to realize continuous opera tion. SOLUTION: The number of circuit board to be carried in is initialized (S1) and a circuit board is carried in at a carrying rail section and held while being regulated by a board regulation unit (S2). An XY robot for recognizing a board mark is positioned at a recognition positron where the centers of a camera and the mark are aligned (S3). The difference of distance between the centers of the camera and the mark is measured, by a board camera, as a shift in the holding of the circuit board thus determining a positional correction amount (S4). The XY robot is then shifted to a part feeding section where an electronic part is sucked by means of a suction nozzle (S5). The sucked electronic part is measured by means of a part recognition camera and a suction correction amount is determined (S6). Mounting position of the electronic part is corrected according to the position correction amount and the suction correction amount before the electronic part is mounted on the circuit board (S7). Subsequently, the number of circuit boards is counted (S8) and compared with a set number (S9) and the recognition position of the XY robot is corrected according to the position correction amount and the number of circuit boards thus setting a new recognition position (S10).
    • 27. 发明专利
    • Mounting method of electronic part
    • 电子部件安装方法
    • JP2005101083A
    • 2005-04-14
    • JP2003330152
    • 2003-09-22
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • OMURA TAKASHIMURATA KAZUHIROEGUCHI SHINZO
    • H05K13/02
    • PROBLEM TO BE SOLVED: To provide an electronic part mounting method which prevents a productivity slowdown by recognition of a conventional separate bad mark, by carrying out an electronic part mounting operation utilizing bad mark information on an unmounted part contained in a visual field of recognition in a mounting position recognition process when an electronic part is mounted. SOLUTION: The electronic part mounting method comprises, at least, a step S1 of specifying the mounting position of a non-defective mounting part selected by the recognition of bad marks from parts where defective parts with bad marks are mixedly present and a bad mark information detecting step S7 of detecting whether bad mark information as to an unmounted part included in the visual field of recognition is present in the step S1 of specifying the position of the part. When the unmounted part having the bad mark information is introduced into a mounting process, a detection of bad mark information as to the above unmounted part is dispensed with. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种电子部件安装方法,其通过识别常规单独的不良标记来防止生产率下降,通过在包含在视野中的未安装部分上执行使用不良标记信息的电子部件安装操作 当安装电子部件时,在安装位置识别处理中识别。 解决方案:电子部件安装方法至少包括步骤S1,其指定通过混合存在具有不良标记的缺陷部分的部分识别不良标记而选择的无缺陷安装部分的安装位置,以及 在指定部件的位置的步骤S1中,检测是否存在包含在识别视野中的未安装部分的坏标记信息的不良标记信息检测步骤S7。 当将具有不良标记信息的未安装部件引入到安装过程中时,就省去了关于上述未安装部件的不良标记信息的检测。 版权所有(C)2005,JPO&NCIPI
    • 29. 发明专利
    • METHOD FOR CONTROLLING MOVEMENT RANGE IN ELECTRONIC COMPONENT MOUNTER
    • JPH11177287A
    • 1999-07-02
    • JP33832897
    • 1997-12-09
    • MATSUSHITA ELECTRIC IND CO LTD
    • MURATA KAZUHIROYABUKI KOICHINAGAI YOSHIYUKI
    • B23P21/00H05K13/04H05K13/08
    • PROBLEM TO BE SOLVED: To provide a method for controlling which contrives to enhance the rate of operation and improve quality of an electronic component mounter. SOLUTION: An electronic component mounter comprises an XY robot 6 which moves a mounting head 4 in two direction sin the horizontal direction between a sucking position and a mounting position ofd electronic components. A position input part 7 inputs data such as the sucking portion or the mounting position of electronic components where the XY robot 6 moves and checks previously whether or not the input moving position data are within a movable range of the XY robot 6 or the mounting head 4, and if not within the movable range, after an error is notified, it is transmitted to a control part 8. Just before the XY robot 6 is driven, the position data input part 7 checks whether or not the input data are data within the movable range, and if not within the range, electronic parts mounting operations do not start. Therefore, a reduction in the rate of operation of the electronic component mounter is prevented, since it sucks the components in the middle of sucking or mounting operations without stopping the machine. Therefore, it is possible to lower quality at the time of mounting operations.