专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明专利

JP2010039496A Mirror device, mirror array and optical switch 有权
标题翻译：镜子设备，镜像阵列和光学开关
公开(公告)号：JP2010039496A
公开(公告)日：2010-02-18
申请号：JP2009252460
申请日：2009-11-02
申请人： Nippon Telegr & Teleph Corp , 日本電信電話株式会社
发明人： UCHIYAMA SHINGO , SHIMOKAWA FUSAO , YAMAGUCHI JOJI , SATO MAKOTO , SASAKURA KUNIHIKO , MORITA HIROBUMI , INAGAKI HIDEICHIRO , MURAKAMI MAKOTO , MACHIDA KATSUYUKI , ISHII HITOSHI
IPC分类号： G02B26/08 , B81B3/00
CPC分类号： B81B3/004 , B81B3/0086 , B81B2201/045 , B81B2203/058 , G02B6/3518 , G02B6/3556 , G02B6/3584 , G02B26/0841 , Y10T29/49885 , Y10T156/10
摘要： PROBLEM TO BE SOLVED: To decrease a tilting angle of a mirror. SOLUTION: Movable frame connecting parts 211a, 211b and mirror connecting parts 221a, 221b are paired members and different in spring constant. Thus, the mirror enters a tilting state by a predetermined angle in its initial state, so that the tilting angle of the mirror can be decreased. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：降低反射镜的倾斜角度。解决方案：可移动框架连接部分211a，211b和反射镜连接部分221a，221b是成对构件，弹簧常数不同。因此，反射镜在其初始状态下进入预定角度的倾斜状态，从而可以减小反射镜的倾斜角度。版权所有（C）2010，JPO＆INPIT

22. 发明专利

JP2008109005A Wiring board, electronic circuit apparatus and manufacturing method thereof 有权
标题翻译：接线板，电子电路设备及其制造方法
公开(公告)号：JP2008109005A
公开(公告)日：2008-05-08
申请号：JP2006292216
申请日：2006-10-27
申请人： Nippon Telegr & Teleph Corp , 日本電信電話株式会社
发明人： SATO NORIO , ISHII HITOSHI , MORIMURA HIROKI
IPC分类号： H01L25/065 , H01L21/3205 , H01L23/52 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/16
摘要： PROBLEM TO BE SOLVED: To uniformize a signal delay time of each of through electrode wirings.
SOLUTION: A semiconductor device 101 comprises a plurality of semiconductor chips 102a, 102b. The semiconductor chips 102a, 102b are each provided with a plurality of through electrodes 106 (106a or 106b), and the through electrodes 106 are electrically connected to input-output terminals 103 via through electrode wirings 110, 111 coupled along a laminate direction. At least one part of the through electrodes 106 is a through electrode for signal delay adjustment having a profile molded corresponding to the length of the through electrode wirings 110, 111 including this through electrode so that the signal delay time of each of the through electrode wirings 110, 111 can be equalized.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：使通孔电极布线的信号延迟时间均匀化。解决方案：半导体器件101包括多个半导体芯片102a，102b。半导体芯片102a，102b分别设置有多个贯通电极106（106a或106b），并且贯通电极106通过沿着层叠方向连接的电极配线110,111与输入输出端子103电连接。通孔电极106的至少一部分是用于信号延迟调整的通孔，其具有对应于包括该贯穿电极的贯通电极布线110,111的长度模制的轮廓，使得每个通孔电极布线的信号延迟时间 110,111可以相等。版权所有（C）2008，JPO＆INPIT

23. 发明专利

JP2007044847A Electrodeposition method 有权
标题翻译：电沉积法
公开(公告)号：JP2007044847A
公开(公告)日：2007-02-22
申请号：JP2005234188
申请日：2005-08-12
申请人： Nippon Telegr & Teleph Corp , 日本電信電話株式会社
发明人： SAKATA TOMOMI , ISHII HITOSHI , SATO NORIO , KUWABARA HIROSHI , MACHIDA KATSUYUKI
IPC分类号： B81C1/00 , C25D13/00 , C25D13/12
摘要： PROBLEM TO BE SOLVED: To provide an electrodeposition method for use in forming an organic film, by which the organic film can be selectively formed in an area where voltage application is desired such as an electrode while preventing abnormal deposition in an area where voltage is not applied. SOLUTION: According to the method, oxygen plasma is applied to carbon-based contaminants (organic matter) remaining on surfaces of a control electrode 118 and a mobile portion electrode 109, in order to eliminate the contaminants. Next a substrate 101 subjected to oxygen plasma treatment, is treated with an hydrochloric acid, and the substrate is soaked in a hydrofluoric acid solution of a 0.5% concentration for 30 seconds, for instance. Thereafter the substrate 101 is washed with water, and immediately electrodeposited, whereby the organic film 110 is formed by electrodeposition only on a surface where the control electrode 118 is exposed. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于形成有机膜的电沉积方法，通过该电沉积方法，可以在需要电压的区域中选择性地形成有机膜，例如电极，同时防止在不施加电压。解决方案：根据该方法，将氧等离子体施加到残留在控制电极118和可移动部分电极109的表面上的碳基污染物（有机物质）上，以消除污染物。接下来，进行氧等离子体处理的基板101，用盐酸处理，将基板浸渍在例如0.5％浓度的氢氟酸溶液中30秒钟。此后，将基板101用水洗涤，并立即电沉积，由此仅在暴露控制电极118的表面上通过电沉积形成有机膜110。版权所有（C）2007，JPO＆INPIT

24. 发明专利

JP2006196655A Manufacturing method of microstructure 有权
标题翻译：微结构的制造方法
公开(公告)号：JP2006196655A
公开(公告)日：2006-07-27
申请号：JP2005006247
申请日：2005-01-13
申请人： Nippon Telegr & Teleph Corp , 日本電信電話株式会社
发明人： SATO NORIO , ISHII HITOSHI , KODATE JUNICHI , MACHIDA KATSUYUKI
IPC分类号： H01L27/12 , B81C3/00 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To uniformly seal a hollow microstructure through formation of a sealing film using a transfer method such as lamination or STP method or the like.
SOLUTION: First, a filling structure 103 is formed on a substrate 100 between the adjacent microstructures 110 to fill the periphery of substrate 100a. Almost identical flat surfaces are formed with the upper surface of the microstructure 110 and the upper surface of the filling structure 103. Moreover, since a recess 103a is provided to the filling structure 103, the surface conditions of the planes formed become almost uniform. Thereafter, a sealing film 105 of the uniformed structure is formed, for example, with the STP method on the microstructure 110 and filling structure 103.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过使用诸如层压或STP方法等的转印方法通过形成密封膜来均匀地密封中空微结构。解决方案：首先，在相邻微结构110之间的基板100上形成填充结构103以填充基板100a的周边。几乎相同的平面形成有微结构110的上表面和填充结构103的上表面。此外，由于在填充结构103中设置有凹部103a，所以形成的平面的表面状态变得几乎均匀。此后，例如通过STP法在微结构110和填充结构103上形成均匀结构的密封膜105.版权所有（C）2006，JPO＆NCIPI

25. 发明专利

JP2005315694A Electronic component device 有权
标题翻译：电子元器件
公开(公告)号：JP2005315694A
公开(公告)日：2005-11-10
申请号：JP2004133226
申请日：2004-04-28
申请人： Nippon Telegr & Teleph Corp , 日本電信電話株式会社
发明人： SHIMAMURA TOSHISHIGE , URANO MASAMI , ISHII HITOSHI , MACHIDA KATSUYUKI
IPC分类号： G01P15/125 , B81B3/00 , B81B7/02 , G01B7/00 , G01R27/26
摘要： PROBLEM TO BE SOLVED: To detect the capacity of a variable capacity structure at high speed, while suppressing deterioration of detection accuracy, even when a parasitic capacity is large to the capacity of the variable capacity structure. SOLUTION: This device has a variable shape structure 1 displaced corresponding to a control signal or a physical quantity to be detected, and a structure displacement detection unit 2 for detecting the capacity showing displacement of the variable shape structure 1. The variable shape structure 1 is equipped with the variable capacity structure 10 whose capacity is changed corresponding to its displacement. The structure displacement detection unit 2 is equipped with an electric field generation part 20 for generating an electric field on the variable capacity structure 10, a guide signal generation part 22 for outputting a guide signal Sd which is a base for electric field generation to the electric field generation part 20, a capacity information extraction part 23 for extracting an information signal Si showing the capacity of the variable capacity structure 10 from a capacity signal Scap of the variable capacity structure 10, and an output adjusting part 24 for converting the information signal Si into a format capable of information processing. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使当寄生容量大到可变容量结构的容量时，为了在抑制检测精度的降低的同时，高速地检测可变容量结构的容量。解决方案：该装置具有对应于要检测的控制信号或物理量移位的可变形状结构1，以及用于检测表示可变形状结构1的位移的能力的结构位移检测单元2.可变形状结构1配备有容量根据其位移而变化的可变容量结构10。结构位移检测单元2配备有用于在可变容量结构10上产生电场的电场产生部20，导向信号生成部22，用于将作为电场产生的基底的引导信号Sd输出到电场产生部分20，容量信息提取部分23，用于从可变容量结构10的容量信号Scap提取示出可变容量结构10的容量的信息信号Si;以及输出调节部分24，用于将信息信号Si 成为能够进行信息处理的格式。版权所有（C）2006，JPO＆NCIPI

26. 发明专利

JP2004240011A Optical switch system 有权
公开(公告)号：JP2004240011A
公开(公告)日：2004-08-26
申请号：JP2003026837
申请日：2003-02-04
申请人： Nippon Telegr & Teleph Corp , 日本電信電話株式会社
发明人： SHIMAMURA TOSHISHIGE , URANO MASAMI , ISHII HITOSHI , TANABE YASUYUKI
IPC分类号： G02B26/08
摘要： PROBLEM TO BE SOLVED: To enable a mirror to be turned with less force at the center of a shaft through which a connection part passes.
SOLUTION: The connection part 161 for connecting a frame 130 to a movable frame 132 is arranged in a connection part area 302 of a notch formed on the frame 130 from the side of an opening area of the frame 130. A mirror connection part 162 for connecting the movable frame 132 to the mirror 131 is arranged in a mirror connection part area 322 of a notch formed on the movable frame 132 from the side of an opening area of the movable frame 132.
COPYRIGHT: (C)2004,JPO&NCIPI

27. 发明专利

JP2004133212A Optical switch 有权
公开(公告)号：JP2004133212A
公开(公告)日：2004-04-30
申请号：JP2002297817
申请日：2002-10-10
申请人： Nippon Telegr & Teleph Corp , 日本電信電話株式会社
发明人： ISHII HITOSHI , TANABE YASUYUKI , MACHIDA KATSUYUKI , URANO MASAMI , SHIMAMURA TOSHISHIGE
IPC分类号： G02B26/08 , B81B3/00
摘要： PROBLEM TO BE SOLVED: To manufacture an optical switch integrally formed with mirror elements on a semiconductor substrate formed with an integrated circuit including a driving control circuit etc., in a manner more easily than heretofore in the state of suppressing the degradation in the scale of integration and the degradation in yield.
SOLUTION: The optical switch has a semiconductor substrate 101 consisting of silicon, has the integrated circuit composed of a plurality of elements on the semiconductor substrate 101 and has an interlayer insulating film 102 on the integrated circuit. The switch further has a wiring layer 104 and an interlayer insulating film 105 on the film 102. Also, a support member 120 is fixed on the semiconductor substrate 101 via the insulating films 102 and 105. The support member 120 supports the mirror structures.
COPYRIGHT: (C)2004,JPO

28. 发明专利

JP2004130507A Electronic component device 审中-公开
公开(公告)号：JP2004130507A
公开(公告)日：2004-04-30
申请号：JP2003326917
申请日：2003-09-18
申请人： Nippon Telegr & Teleph Corp , 日本電信電話株式会社
发明人： URANO MASAMI , SHIMAMURA TOSHISHIGE , ISHII HITOSHI , TANABE YASUYUKI , MACHIDA KATSUYUKI
IPC分类号： G02B26/08 , B81B3/00 , B81B7/02
摘要： PROBLEM TO BE SOLVED: To provide an extremely small electronic component device such as an optical switch device used for communication, instrumentation, or the like.
SOLUTION: A plurality of units having a movable parts for constituting an MEMS are monolithically mounted on a semiconductor substrate 1 having an integrated circuit including a driving circuit 22, sensor circuits 24-1, 24-2, a memory 25, and a processor 26. Each unit has a processor 26, the memory 25, the driving circuit 22, the sensor circuits 24-1 and 24-2.
COPYRIGHT: (C)2004,JPO

29. 发明专利

JP2004130449A Mems element and method for manufacturing mems element 审中-公开
公开(公告)号：JP2004130449A
公开(公告)日：2004-04-30
申请号：JP2002297863
申请日：2002-10-10
申请人： Nippon Telegr & Teleph Corp , 日本電信電話株式会社
发明人： ISHII HITOSHI , MACHIDA KATSUYUKI , TANABE YASUYUKI , SAKATA TOMOMI
IPC分类号： B81B3/00 , B81C1/00
摘要： PROBLEM TO BE SOLVED: To provide method for suppressing the adhesion of the mobile portion of a Micro Electro Mechanical System (MEMS) element with a structural body arranged closely to the element due to the surface tension of liquid used in a MEMS manufacturing process using water or other liquid, without requiring expensive processing equipment.
SOLUTION: After a base board 101 is dipped in liquid-form Teflon (R) and is withdrawn from the Teflon (R) subsequently, the base board 101 is subject to heat treatment which is first carried out in air at a temperature of 170°C for 5 minutes, and then in a nitric atmosphere at 300°C for 1 hour. Through these treatments, Teflon (R) films 109 (a film composed of fluorocarbon) are formed on surfaces of individual structural bodies.
COPYRIGHT: (C)2004,JPO

30. 发明专利

JP2011109117A Method for treating surface of gold 有权
标题翻译：处理金表面的方法
公开(公告)号：JP2011109117A
公开(公告)日：2011-06-02
申请号：JP2010280799
申请日：2010-12-16
申请人： Nippon Telegr & Teleph Corp , 日本電信電話株式会社
发明人： SAKATA TOMOMI , ISHII HITOSHI , SATO NORIO , KUWABARA HIROSHI , MACHIDA KATSUYUKI
IPC分类号： H01L21/60 , H01L21/304 , H01L21/3065
CPC分类号： H01L24/02 , H01L2224/85009 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To normally form a bonding wire or an electrodeposited film on the surface of a structure formed of gold even after treatment with oxygen turned into an active state. SOLUTION: A substrate 101 is kept irradiated with oxygen plasma for removing residual carbon based contaminants (organic matters) on the surfaces of a control electrode 118 and a movable part electrode 109. Then, the substrate 101 subjected to the treatment with oxygen plasma is subjected to a heat treatment, for example, in a vacuum, inert or reducing atmosphere. As a result of the heat treatment, gold oxide is removed which is formed by the irradiation with plasma including oxygen on the surfaces of the control electrode 118 and the movable part electrode 109 formed of gold. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：即使在氧变成活性状态的处理后，也可以在由金形成的结构的表面上形成接合线或电沉积膜。解决方案：用氧等离子体照射基板101，以除去控制电极118和可移动部分电极109的表面上残留的碳基污染物（有机物质）。然后，用氧气进行处理的基板101 对等离子体进行例如在真空，惰性或还原气氛中的热处理。作为热处理的结果，通过在由金形成的控制电极118和可动部电极109的表面上等离子体等离子体照射而形成氧化金属。版权所有（C）2011，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式