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21. 发明专利

JP2008306048A Electronic unit case 审中-公开
标题翻译：电子单元案例
公开(公告)号：JP2008306048A
公开(公告)日：2008-12-18
申请号：JP2007152828
申请日：2007-06-08
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： ONO KOYO , FURUKAWA SUKEYUKI , NARUSE MIKIO
IPC分类号： H05K5/06 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic unit case superior in the material yield, while satisfying the three functions such as radiation, electromagnetic shield, and waterproof properties.
SOLUTION: The gasket 7 of the electronic unit case 1 includes a plurality of metal plates 71 and a sealing component 72 which links a plurality of these metal plates so as to constitute a circular gasket corresponding to the shape of upper edge of a sidewall, and the sealing component 72 has a first sealing portion 721, which seals a space between a cover 5 and the metal plates and a second sealing portion 722, which seals the space in between the metal plates and an upper edge of the sidewall 4.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供优异的材料产量的电子单元壳体，同时满足辐射，电磁屏蔽和防水性能三个功能。解决方案：电子单元壳体1的垫片7包括多个金属板71和密封部件72，该多个金属板71和密封部件72连接多个这些金属板，以构成与上述边缘的形状对应的圆形密封垫片侧壁，并且密封部件72具有密封盖5和金属板之间的空间的第一密封部分721和密封金属板之间的空间和侧壁4的上边缘的第二密封部分722 版权所有（C）2009，JPO＆INPIT

22. 发明专利

JP2008124129A Solid-shaped insulating member and manufacturing method therefor 审中-公开
标题翻译：固体绝缘构件及其制造方法
公开(公告)号：JP2008124129A
公开(公告)日：2008-05-29
申请号：JP2006303962
申请日：2006-11-09
申请人： Fuji Polymer Industries Co Ltd , Nissan Motor Co Ltd , 富士高分子工業株式会社 , 日産自動車株式会社
发明人： FURUKAWA SUKEYUKI , SHIBUYA AKIHIRO , OTA HIROTOMO
IPC分类号： H01L23/373
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an insulating member which shows superior electric insulation and heat conductivity, and is molded easily. SOLUTION: The insulating member includes a flat insulating portion 11 made of an insulating material containing a heat conductive filler, and a solid-shaped insulating portion 12 which is made of an insulating material that contains relatively less heat conductive filler or does not contain the heat conductive filler at all. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有优异的电绝缘性和导热性并且容易模制的绝缘构件。解决方案：绝缘构件包括由包含导热填料的绝缘材料制成的平坦绝缘部分11和由绝缘材料制成的固体绝缘部分12，绝缘材料包含相对较少的导热填料或不含有导热填料。版权所有（C）2008，JPO＆INPIT

23. 发明专利

JP2007059602A Circuit module 审中-公开
标题翻译：电路模块
公开(公告)号：JP2007059602A
公开(公告)日：2007-03-08
申请号：JP2005242732
申请日：2005-08-24
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： ONO KOYO , SHIBUYA AKIHIRO , FURUKAWA SUKEYUKI , NARUSE MIKIO
IPC分类号： H05K7/20 , H01L25/07 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To provide a circuit module which prevents certainly that a cooling medium adheres to the connective material which connects mutually the electric circuits allocated in two or more case members.
SOLUTION: A through-hole 31 is bored in a laminated state where an upper side case member 3 having an electric circuit and a lower side case member 5 are brought into contact, and the connective material is allocated in this through-hole 31. The circuit module wherein a channel for cooling media is also formed and a cooling medium is circulated to this channel for cooling media is provided with a sealing member 45 in the periphery of the through-hole 31. Further, in the perimeter side of this sealing member 45, a discharge groove 49 is formed for discharging a cooling medium which infiltrates between both the case members 3 and 5 to the exterior of the case members 3 and 5.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路模块，其可以防止冷却介质粘附到连接在两个或多个壳体中分配的电路的连接材料。解决方案：在具有电路和下侧壳体构件5的上侧壳体构件3接触的层叠状态下，通孔31被钻孔，并且将连接材料分配在该通孔中电路模块，其中还形成用于冷却介质的通道，并且冷却介质循环到该通道用于冷却介质，在通孔31的周边设置有密封构件45.此外，在通孔31的外周侧该密封构件45形成有用于将在两个壳体3和5两者之间渗透的冷却介质排出到壳体构件3和5的外部的排放槽49.版权所有（C）2007，JPO＆INPIT

24. 发明专利

JP2006318950A Pressure-welded type semiconductor device 审中-公开
标题翻译：压力式半导体器件
公开(公告)号：JP2006318950A
公开(公告)日：2006-11-24
申请号：JP2005136997
申请日：2005-05-10
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： NARUSE MIKIO , UENO DAIGO , FURUKAWA SUKEYUKI
IPC分类号： H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device that can be miniaturized, and can improve the pressure-welding performance.
SOLUTION: A buffer member 6 has a coefficient of linear expansion, that is nearly the same as that of a diode D2, and is placed on the diode D2 packaged onto a bus bar 15d; and a conductive member 5 is placed on the buffer member 6. The bus bar 17 is placed on the conductive member 5, and pressure in the direction of the diode D2 is applied to the bus bar 17, the conductive member 5, and the buffer member 6 by a spring member 23 fitted to a shaft 32b of an alignment member 32. Shafts 32a, 32b of the alignment member 32 are formed coaxially, and the center of the spring member 23 and the conductive member 5 are aligned coaxially 100, by engaging a recess 5a formed at the center on the upper surface of the conductive member 5 with the shaft 32a.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以小型化的半导体器件，并且可以提高压焊性能。解决方案：缓冲部件6具有与二极管D2大致相同的线膨胀系数，并且被放置在封装在母线15d上的二极管D2上; 并且导电构件5放置在缓冲构件6上。汇流条17放置在导电构件5上，并且将二极管D2的方向上的压力施加到母线17，导电构件5和缓冲器构件6由安装到对准构件32的轴32b上的弹簧构件23构成。对准构件32的轴32a，32b同轴地形成，并且弹簧构件23和导电构件5的中心同轴地对齐100，由将形成在导电部件5的上表面的中心的凹部5a与轴32a接合。版权所有（C）2007，JPO＆INPIT

25. 发明专利

JP2004327533A Semiconductor device and its manufacturing method 审中-公开
公开(公告)号：JP2004327533A
公开(公告)日：2004-11-18
申请号：JP2003117008
申请日：2003-04-22
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： OGAWA KAZUHIRO , EHIRA ATSUSHI , SHIBUYA AKIHIRO , FURUKAWA SUKEYUKI , NARUSE MIKIO
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which is equipped with a semiconductor module capable of transmitting heat released from it to a cooler well and a semiconductor chip that is built in the semiconductor module and excellent in cooling performance, and to provide its manufacturing method.
SOLUTION: The semiconductor device is equipped with the non-insulated semiconductor module 2 provided with a built-in semiconductor chip, the cooler 3 cooling the semiconductor chip, and silicone grease 6 that is insulating liquid material and sandwiched between the non-insulated semiconductor module 2 and the cooler 3. The silicone grease 6 contains synthetic zeolite 7 as an adsorbent adsorbing air.
COPYRIGHT: (C)2005,JPO&NCIPI

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