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    • 22. 发明专利
    • Base plate for magnetic disc
    • 磁盘基板
    • JPS59217225A
    • 1984-12-07
    • JP9129083
    • 1983-05-24
    • Kobe Steel Ltd
    • YAMADA YASUYUKIHIRAI HIROSHINAKAGAMI AKIMITSUKAWAGUCHI MASAHIROKITAO YOSHINOBU
    • G11B5/66G11B5/73G11B5/738G11B5/82G11B5/85G11B5/64
    • G11B5/7315
    • PURPOSE:To provide a base plate which has excellent surface accuracy after polishing with less defects such as projections and holes and is highly resistant to wear and heat treatment by providing the film deposited by evaporation of any one among Si, TiN and Si3N4 in a specific thickness range on the surface of an aluminum alloy base plate. CONSTITUTION:A PVD or CVD method of vapor deposition by resistance heating, vapor deposition by an electron beam, ion plating, sputtering, etc. is used for forming the film deposited by evaporation on a base plate for a magnetic disc. The temp. of the aluminum alloy base plate in the stage of forming the thin film is =10mum thickness and is economically wasteful.
    • 目的:提供一种在抛光后具有优异的表面精度的基板,具有较少的突起和孔缺陷,并且通过将特定的Si,TiN和Si 3 N 4中的任一种蒸发沉积的膜提供,耐高温耐磨和热处理 铝合金基板表面的厚度范围。 构成:通过电阻加热,通过电子束气相沉积,离子镀,溅射等的PVD或CVD方法用于将通过蒸发沉积的膜形成在用于磁盘的基板上。 温度 在考虑处理时的基板的变形等时,形成薄膜的阶段的铝合金基板的厚度为<= 400℃,更优选<= 350℃。 温度 需要每次充分选择热处理作为具有膜厚和基板温度的薄膜的耐热处理。 在治疗阶段。 通过蒸发沉积的膜的厚度在Si,TiN和Si 3 N 4中的任一个之间为1-10μm。 空洞缺陷如孔难以在<= 1m厚度厚度和satn处消除。 出现在= 10m厚度,并且在经济上是浪费的。
    • 25. 发明专利
    • OPTICAL MODULATING SEMICONDUCTOR ELEMENT
    • JPH03265825A
    • 1991-11-26
    • JP6590190
    • 1990-03-15
    • KOBE STEEL LTD
    • MATSUI YUICHINARITA KATSUHIKONAKAGAMI AKIMITSU
    • G02F1/35H01L27/00
    • PURPOSE:To change the output light intensity with respect to input light intensity according to the intensity of probe light as information by irradiating this element with the probe light absorbed by the window layer alone and the input light absorbed by the superlattice structure part alone from a window layer side and taking out the output light through the superlattice structure part. CONSTITUTION:The superlattice structure part 12 and the window layer 13 are successively crystal-grown on one main surface of a semiconductor substrate 11 and a transparent rear electrode 14 is formed on the surface of the substrate 11 on the side opposite form the superlattice structure part 12 side thereof. Further, a transparent front electrode 15 is formed on the front surface of the window layer 13. The probe light intensity is then changed by impressing a specified bias voltage with the electrode 15 side made as negative between the two electrodes 14 and 15 and making the input light and probe light having the specified intensity incident from the electrode 15 side. Consequently, the intensity of the output light taken out through the electrode 14 with an increase in the probe light intensity decreases. The output light intensity with respect to the input light intensity is continuously changed in this way according to the probe light intensity.
    • 26. 发明专利
    • SEMICONDUCTOR THIN-FILM FORMING METHOD
    • JPH03203226A
    • 1991-09-04
    • JP34460689
    • 1989-12-28
    • KOBE STEEL LTD
    • MATSUI YUICHINARITA KATSUHIKONAKAGAMI AKIMITSU
    • H01L21/203
    • PURPOSE:To prevent contamination of the surface of a semiconductor thin film due to impurity atoms by forming the semiconductor thin film, forming a specific protection film on the surface, and then carrying it to a second growth chamber. CONSTITUTION:After forming an n-type III-V compound semiconductor thin film for example as a conductive type by the MBE method in a first growth chamber 2, a protection film consisting of a V element constituting this n-type III-V compound semiconductor thin film is formed on the surface, and then it is carried to a second growth chamber 3. Then, a III-V compound semiconductor multilayer structure with a pn junction is formed within the second growth chamber 3 by the MBE method. In that case, by increasing the temperature of the substrate, only the protection film consisting of V elements evaporates along with impurity atoms being adhered during transportation due to high evaporation pressure of the V element and omitted, thus keeping the surface of the n-type III-V compound semiconductor thin film to be clean.
    • 28. 发明专利
    • METHOD AND DEVICE FOR DETECTING POSITION AND DISPERSION OF LIGHT INPUT
    • JPH02310433A
    • 1990-12-26
    • JP13152289
    • 1989-05-26
    • KOBE STEEL LTD
    • NAKAGAMI AKIMITSUONISHI YOSHIHIKOTACHIBANA HIROYUKIINOUE TAKAYOSHINISHIMOTO YOSHIROYONEDA YASUSHIIMAOKA SHINICHINAKAI YASUHIDE
    • G01B11/00G01J1/44G01N21/88G02B7/32
    • PURPOSE:To detect the position of a light input and the information of dispersion with accuracy by detecting a primary output which is proportioned to the mean value of a distance between the end part of a photoelectric converting body and the position of the light input and a secondary output which is proportioned to the square mean value of the distance. CONSTITUTION:At first, the light intensity of the light input is obtained by using the photoelectric converting bodies 19-1 to 19-3 and also the 1st or the 2nd mean value of the distance from the one end part or the other end part of the photoelectric converting bodies 19-1 to 19-3 which are weighted by the light intensity to the position of the light input and the 1st or the 2nd square mean value of the distance from the one end part or the other end part of the photoelectric converting bodies 19-1 to 19-3 to the position of the light input are detected. And then, after fetching the primary output which is proportioned to the 1st or the 2nd mean value of the distance between the photoelectric converting bodies 19-1 to 19-3 on the basis of the detected light intensity and the 1st or the 2nd mean value, and also fetching the secondary output which is proportioned to the square mean value of the distance between the photoelectric converting bodies 19-1 to 19-3 on the basis of the detected light intensity and the 1st or the 2nd square mean value, the position of the light input is calculated and furthermore, the dispersion of the light input is calculated on the basis of the primary and the secondary outputs.
    • 30. 发明专利
    • MANUFACTURE OF FILM GRATING PATTERN
    • JPS63142629A
    • 1988-06-15
    • JP28919086
    • 1986-12-04
    • KOBE STEEL LTD
    • TOJO SHIGEKIHIRAI HIROSHINAKAGAMI AKIMITSU
    • H01L21/205H01L21/263
    • PURPOSE:To be able to efficiently form the patterns of an LSI and a diffraction grating by photovoltaically reacting reaction gas through the interference moire of a laser beam to deposit the fine pattern on a substrate surface. CONSTITUTION:After a laser beam 2 irradiated from a laser light source 1 passes a pinhole 3 and a beam expander 4, it is reflected on a mirror 5, and then divided by a half mirror 6 into two laser beams 2a, 2b. The beams 2a, 2b are respectively reflected on mirrors 7, fed through the optical windows 9, 9 of a vacuum vessel 8, and irradiated to the surface of a substrate 10 disposed in the vessel 8. Thus, the beams 2a, 2b are interfered from one another. As a result, an interference moire is generated on the surface of the substrate 10. When reaction gas which becomes the material of a pattern flows on the surface of the substrate 10 through a gas introduction tube 12 in this state, the reaction gas is photovoltaically reacted in the section of the interference moire, its product is deposited on the substrate 10, thereby forming the pattern equivalent to the interference moire.