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21. 发明专利

JPS55114326A CONCENTRATING METHOD FOR OXYGEN AND DEVICE THEREFOR 失效
公开(公告)号：JPS55114326A
公开(公告)日：1980-09-03
申请号：JP2083379
申请日：1979-02-26
申请人： HITACHI LTD
发明人： TOMOMURA MASAOMI , YOKOYAMA HIROSHI , NOKITA SHIYUNSUKE , OOTANI KOUJI
IPC分类号： B01D53/04 , B01D53/02
摘要： PURPOSE:To reduce the pressure of adsorbing towers rapidly by a method wherein negative pressure is utilized which is produced by compressed air bypassed when an adsorbent for adsorbing N2 is used and gas abounding in O2 is recovered from air by pressurizing for adsorption and pressure reducing for removing. CONSTITUTION:Air supplied by a pipe 4 is compressed by means of a pressure forwarding pump 5, moisture is removed by means of a waterdrop separator 6, the air is introduced to an adsorbing tower 1 through a pipe 29 and valves 26, 23, N2 is adsorbed and separated, gas abounding in O2 is collected to a tank 30 through a valve 14, and one portion is utilized for a feedback process of an adsorbing tower 2 through a valve 18. After the adsorbing tower 1 is saturated, the gas is adsorbed in the adsorbing tower 2 by operating valves, the inside of the adsorbing tower 1 is opened to atmospheric air through a valve 20, a pipe 33 and an ejector 32, a valve 27 is opened just before pressure in the tower reaches atmospheric pressure, and the pressure inside of the tower is quickly reduced by negative pressure formed by compressed air.

22. 发明专利

JPS53143695A PREPARATION OF POLYESTER 失效
公开(公告)号：JPS53143695A
公开(公告)日：1978-12-14
申请号：JP5767677
申请日：1977-05-20
申请人： HITACHI LTD
发明人： YOKOYAMA HIROSHI
IPC分类号： C08G63/00 , C08G63/78
摘要： PURPOSE:To reduce the polycondensation time of a bis(oxyalkylene) terephthalate by adding a stabilizer when the polymerization degree reaches specific value.

23. 发明专利

JPS51140564A FORMING ELECTRODE AND WIRING LAYER 失效
公开(公告)号：JPS51140564A
公开(公告)日：1976-12-03
申请号：JP6430375
申请日：1975-05-30
申请人： HITACHI LTD
发明人： YOKOYAMA HIROSHI
IPC分类号： H01L21/3205 , H01L21/28 , H01L21/306 , H01L23/52
摘要： PURPOSE:To provide a method of forming electrodes and wiring layer composed of aluminum containing silicon, without leaving residual silicon enough to produce current on the insulation film surface.

24. 发明专利

JPS51102558A 失效
公开(公告)号：JPS51102558A
公开(公告)日：1976-09-10
申请号：JP2713975
申请日：1975-03-07
申请人： HITACHI LTD
发明人： SASAKI TOSHINORI , FUKUSHIMA KENJI , NAKAMOTO NOBUYUKI , YOKOYAMA HIROSHI
IPC分类号： H01L21/3205 , H01L21/28 , H01L21/306

25. 发明专利

JPS516667A HANDOTAISOCHINO DENKYOKUHAISENSOKEISEIHOHO 失效
公开(公告)号：JPS516667A
公开(公告)日：1976-01-20
申请号：JP7639174
申请日：1974-07-05
申请人： HITACHI LTD
发明人： FUKUSHIMA KENJI , YOKOYAMA HIROSHI
IPC分类号： H01L21/3213 , H01L21/28 , H01L21/82

26. 发明专利

JPH03105956A COOLING MODULE 失效
公开(公告)号：JPH03105956A
公开(公告)日：1991-05-02
申请号：JP24209389
申请日：1989-09-20
申请人： HITACHI LTD
发明人： NAGANUMA YOSHIO , MORIHARA ATSUSHI , OUCHI KAZUNORI , SATO YASUSHI , YOKOYAMA HIROSHI
IPC分类号： H05K7/20 , H01L23/473
摘要： PURPOSE:To eliminate a need for making a hole used to position a cooling element and to keep a low thermal resistance at a contact face stably for a long time by a method wherein transverse holes which have been bored through are made in side faces of cooling elements, the cooling elements are connected by inserting coil-shaped springs into the transverse holes and positions of the discrete cooling elements are supported and fixed. CONSTITUTION:Semiconductor elements 2 are mounted on a module substrate 1 provided with pins 6 to be connected electrically to a large-sized board of a computer. Heat generated by an operation is conducted to a cooling jacket 14 as a cooling part via cooling elements 3 mounted on the discrete semiconductor elements and via a heat-conducting sheet 4. Springs 7 are pressed between the semiconductor elements 2 and the heat conductor 4 as if a wedge is driven in; they act to bring the semiconductor elements, the cooling elements and the heat conductor into close contact with one another. In addition, coil springs 5 of a length traversing the module substrate 1 are used as elastic bodies; they are inserted into through holes made in side faces of the cooling elements 3 to keep a positional relationship of the discrete cooling elements.

27. 发明专利

JPH0344065A SEMICONDUCTOR COOLING METHOD 失效
公开(公告)号：JPH0344065A
公开(公告)日：1991-02-25
申请号：JP17813389
申请日：1989-07-12
申请人： HITACHI LTD
发明人： NAGANUMA YOSHIO , MORIHARA ATSUSHI , OUCHI KAZUNORI , SATO YASUSHI , YOKOYAMA HIROSHI
IPC分类号： H01L23/473
摘要： PURPOSE:To disturb the flow of cooling medium by air bubble, and accelerate heat transfer, by making air bubble compulsorily mix with the cooling medium flowing along the heat transfer surface of a cooling jacket. CONSTITUTION:At the prestage of a cooling jacket, air is supplied to cooling medium by a compressor 8, so the cooling medium 5 can flow in the two-phase state of gas and liquid in a cooling medium channel 15. In order to obtain the optimum heat transfer state by said two-phase flow, suitably dispersed air bubble is generated in the case of air mixing by using an air bubble producing nozzle 10. The quantity of air to be mixed is controlled by an adjusting valve 13. The cooling medium in the two-phase state of gas and liquid formed in this manner is capable of high heat transfer as compared with the conventional case of single phase flow, and the heat is effectively absorbed by the cooling jacket. After that, the cooling medium is sent to a heat exchanger 11 for heat dissipating. Since the two-phase state of gas and liquid of the cooling medium is kept also in the heat exchanger, heat transfer in the heat exchanger 11 also is excellently executed.

28. 发明专利

JPH0279452A SEMICONDUCTOR DEVICE AND ITS COOLING METHOD 失效
公开(公告)号：JPH0279452A
公开(公告)日：1990-03-20
申请号：JP23116288
申请日：1988-09-14
申请人： HITACHI LTD
发明人： NAGANUMA YOSHIO , MORIHARA ATSUSHI , OUCHI KAZUNORI , YOKOYAMA HIROSHI
IPC分类号： H01L23/467 , H05K7/20
摘要： PURPOSE:To provide possibility of cooling with low level of noises or without the same by cooling the heat emitting parts elsewhere than high heat emitting part of a semiconductor device consisting of an aggregate of electronic parts by means of forced convexion through utilization of the liquid stream, which is generated in linkage with natural convexion to be produced at the high heat emitting part. CONSTITUTION:Semiconductor devices are installed on three boards 2 with their respective heat resistances taken into consideration, wherein an LSI 4 for cooling having the least heat resistance is situated below the board 2 while a one 6 having heat resistance comparatively above the board 2. A resistance heat radialing body 8 is arranged in a heat emitting part which brings about natural convexion, and the ambient air is heated. The density of this heated air becomes smaller, and the air produces natural convexion as a heated fluid 10. As a result, the air below the boards 2 rises along them to cause introduction of the fluid to be heated 12 along the boards 2 from outside anew, and a standing flow along the boards 2 is formed. Thus calm cooling of semiconductors is accomplished through utilization of the fluid stream due to natural convexion.

29. 发明专利

JPH01167403A CLOSED PLATE INSTALLATION PART STRUCTURE FOR HIGH PRESSURE CASING PIPE BOARD 失效
公开(公告)号：JPH01167403A
公开(公告)日：1989-07-03
申请号：JP32401987
申请日：1987-12-23
申请人： HITACHI LTD
发明人： WATANABE KATSUYOSHI , MATSUURA KENJI , YOKOYAMA HIROSHI , WAKITA TOMONORI , YAMAGUCHI EIZO
IPC分类号： F01D25/00 , F01D25/24
摘要： PURPOSE:To improve the welding performance and workability by installing a cross-around pipe onto a high pressure turbine casing pipe base, after installing a short pipe which is made of soft steel and onto which a closed plate is welded previously is installed. CONSTITUTION:A ring 2 is welded onto a short pipe 1 made of soft steel, and a closed plate 3 is welded onto the ring 2. The short pipe 1 is welded onto a high pressure turbine casing 4. In this state, the pressureproof test is carried out, and the turbine casing 4 is transported at the site, and a cross-around pipe 5 is welded onto the short pipe 1. Therefore, the need of the opened top adjustment of the short pipe at the site can be obviated, and welding performance and workability can be improved.

30. 发明专利

JPS6356161B2 失效
公开(公告)号：JPS6356161B2
公开(公告)日：1988-11-07
申请号：JP8142980
申请日：1980-06-18
申请人： HITACHI LTD
发明人： YAHAGI TOSHIO , TOMOMURA MASAOMI , YOKOYAMA HIROSHI , OOTANI KOJI , NOKITA SHUNSUKE
IPC分类号： B01D53/04 , C01B13/02 , C01B21/04

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