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    • 21. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR DEVICE
    • JPS5457861A
    • 1979-05-10
    • JP12347877
    • 1977-10-17
    • HITACHI LTD
    • MIYAO MASANOBUTOKUYAMA KON
    • H01L21/265H01L21/324
    • PURPOSE:To form a high-density shallow junction layer excellent in electric characteristic thourgh annealing at a low temperature between 400 and 800 deg.C, by double-implanting two kinds of impurity elements in the surface of a silicon substrate. CONSTITUTION:To attain the reduction of channeling components and the improvement of electrical characteristics after annealing, an element, whose atomic number is greater than sixteen, among impurity elements of a desired conduction type is implanted in silicon substrate 1 as much as or more than the substrate surface becomes non-crystal, thereby forming non-crystal layer 2. For the purpose of controlling a resistance value after the annealing, more III-group or V-group impurity element of a desired conduction type than the amount of the 1st implantation is implanted by enough energy to make it stay inside non-crystal layer 2, thereby forming impurity layer 3. In order to activate the implantation layer electrically, this is heat-treated at a temperature between 400 and 800 deg.C.