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    • 22. 发明专利
    • Actuator element
    • 执行元件
    • JP2003339173A
    • 2003-11-28
    • JP2002147539
    • 2002-05-22
    • Hitachi Cable Ltd日立電線株式会社
    • TSUCHIYA TADAITSU
    • H02N2/00
    • PROBLEM TO BE SOLVED: To provide an actuator element having a large displacement and displacement stress and proper stress crack resistance. SOLUTION: The actuator element 10 comprises an ion exchange resin molding 11; and metal electrodes 13a, 13b provided in an insulating state from each other on the surface of the molding 11. Thus, a potential difference is applied between the electrodes 13a and 13b, to generate a bend or a deformation. The molding 11 is impregnated with a polar organic solvent 12. COPYRIGHT: (C)2004,JPO
    • 要解决的问题:提供具有大的位移和位移应力和适当的抗应力开裂性的致动器元件。 解决方案:致动器元件10包括离子交换树脂模制件11; 以及在成型体11的表面上彼此隔开的金属电极13a,13b。因此,在电极13a和13b之间施加电位差,产生弯曲或变形。 模塑料11用极性有机溶剂12浸渍。版权所有(C)2004,JPO
    • 27. 发明专利
    • METHOD FOR EPITAXIAL GROWTH
    • JP2001002494A
    • 2001-01-09
    • JP17241099
    • 1999-06-18
    • HITACHI CABLE
    • TAKANO KAZUTOTSUCHIYA TADAITSUSAKAGUCHI HARUNORI
    • H01L21/205C30B25/10
    • PROBLEM TO BE SOLVED: To provide a method for epitaxially growing, by which lowering of the temp. at the peripheral part of a substrate is suppressed when the substrate is heated, thereby the temp. distribution in the substrate can be kept uniform, and the thermal decomposition of the source gas and the growing of a thin film are uniformly executed over the whole surface of the crystal substrate when the crystal is grown, while preventing the constitution from becoming complicated and expensive. SOLUTION: In an epitaxial growing method, in which a gaseous starting material 15 is fed into a growing chamber 4 and a thin film crystal is grown on a substrate of a semiconductor or an insulative material, the substrate 1 is heated while allowing the amount of the heat given to the substrate 1 to have an inclination such that the amount of heat to be given to the peripheral part of the substrate is lager than the amount of heat to be given to the center part of substrate. The substrate 1 is heated by the radiant heat of a radiation-type heater 5 through a soaking control plate 6 having a spherical recessed part and an annular projecting part at the periphery of the recessed part. The substrate 1 is heated in such a manner that the amount of heat used for heating the center part of the substrate is given through the spherical recessed part and the amount of the heat used for heating the periphery of the substrate is given through the annular projecting part.
    • 29. 发明专利
    • HIGH-ELECTRON MOBILITY TRANSISTOR
    • JPH09260643A
    • 1997-10-03
    • JP7064496
    • 1996-03-26
    • HITACHI CABLE
    • TSUCHIYA TADAITSUWADA JIROTAKANO KAZUTO
    • H01L29/872H01L21/338H01L29/47H01L29/778H01L29/812
    • PROBLEM TO BE SOLVED: To make a control of the interface between the metal layer of a gate electrode, which is provided on a carrier feeding layer, and a GaInP layer, which is the carrier feeding layer possible and, at the same time, to prevent the device characteristics of an HEMT from being reduced, so as to prevent an adverse effect from being exerted on the device characteristics by the Schottky junction characteristics in the interface. SOLUTION: A buffer layer 102, a channel layer (undoped InGaAs layer) 103, and a spacer layer 104 are laminated in order on a semi-insulative GaAs substrate 101, and a carrier feeding layer (n-type GaInP layer) 105 is provided on this layer 104. Moreover, an n-type Al0.22 Ga0.78 As layer 106 for interface control use and a contact layer (n-type GaAs layer) 107 are laminated, in order to form a wafer. The deterioration of a Schottky junction characteristics in the interface between the n-type GaInP layer and the metal layer of the gate electrode, which is provided on the carrier feeding layer 105 which is the n-type GaInP layer, is prevented from being generated by the layer 106, and the enhancement of the characteristics of a device, which is formed by using a GaInP material, becomes possible.