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    • 22. 发明专利
    • Manufacture of semiconductor substrate
    • 半导体基板的制造
    • JPS57118631A
    • 1982-07-23
    • JP438081
    • 1981-01-14
    • Fujitsu Ltd
    • KOYAMA MASATAKATERAJIMA MINORUHARA TOSHITO
    • H01L21/20H01L21/86
    • H01L21/2026
    • PURPOSE:To manufacture a semiconductor substrate economically by a method wherein a single crystal semiconductor layer is formed on the whole upper surface or on a part of it for a relatively wide region of an insulative substrate. CONSTITUTION:A means, by which laminated layers of polycrystalline or amorphous semiconductor layer and protecting layer etched selectively and after the semiconductor layer is made single crystal by laser beam exposure the second film forming process and the second laser beam exposing process are included, is provided. For instance, amorphous silicon layer 12 is formed on the surface of an SiO2 substrate 11. Then Si3N4 layer 14 of approximately 0.1mum thickness is formed on the silicon layer 12 and these laminated layers are selectively removed by etching means to form strip-shaped pattern 15. Then laser beam is scanned along the longitudinal direction of the pattern 15 and transforms the amorphous silicon layer 12 into the single crystal silicon layer 12'.
    • 目的:为了通过在绝缘基板的较宽区域的整个上表面或其一部分上形成单晶半导体层的方法经济地制造半导体基板。 构成:包括通过激光束曝光将半导体层制成单晶的多晶或非晶半导体层和保护层的层叠层的方法,包括第二成膜工艺和第二激光束曝光工艺 。 例如,在SiO 2衬底11的表面上形成非晶硅层12.然后,在硅层12上形成厚度约为0.1μm的Si 3 N 4层14,通过蚀刻手段选择性地去除这些叠层,形成带状图案 然后沿图案15的纵向扫描激光束,并将非晶硅层12转换成单晶硅层12'。
    • 24. 发明专利
    • Thermal head
    • 热头
    • JPS5745075A
    • 1982-03-13
    • JP11984280
    • 1980-09-01
    • Fujitsu Ltd
    • NAKA TOSHIAKITANMACHI HARUOTERAJIMA MINORUHARA TOSHITO
    • B41J2/35B41J2/345
    • B41J2/345
    • PURPOSE:To eliminate the unevenness of printing by providing a resistor for correcting the unevenness of printing by a method in which plural heating resistors arranged on the base plate of thermal head are grouped into equal numbers of resistors and connected with one another by groups. CONSTITUTION:A large number of heating resistors R connected in series to diodes 1 for preventing reverse current are grouped into 38 groups, each having 32 heating resistors, and then the heating resistors having equal attendant numerals are connected together. Thus, since the width of conductors provided in the vertical direction, as shown in Fig., is very narrow, a considerable dispersion is produced in the resistance values of conductors connecting the heating resistor R and the select terminal S due to the difference in the lengths l1-l32 in this direction. Accordingly, the difference is corrected by providing correcting resistors r1-r32 on a wiring pattern. Thus, the amount of power consumed in the heating resistors R can be equalized, the amount of heat produced is equalized, and therefore, the unevenness of printing is eliminated.
    • 目的:为了通过设置用于校正印刷不均匀性的电阻来消除打印不均匀性,其中布置在热敏头基板上的多个加热电阻器被分组成相等数量的电阻器并且通过组彼此连接的方法。 构成:串联连接到二极管1用于防止反向电流的大量加热电阻R被分组为38组,每组具有32个加热电阻器,然后将具有相同附加数字的加热电阻器连接在一起。 因此,如图所示,由于在垂直方向上设置的导体的宽度非常窄,所以在连接加热电阻R和选择端子S的导体的电阻值中产生相当大的分散, 长度l1〜l32在这个方向。 因此,通过在布线图案上设置校正电阻器r1-r32来校正差异。 因此,可以使加热电阻器R中消耗的功率量相等,产生的热量相等,因此消除了印刷不均匀性。
    • 25. 发明专利
    • Thermal head
    • 空值
    • JPS5736676A
    • 1982-02-27
    • JP11124380
    • 1980-08-13
    • Fujitsu Ltd
    • NAKA TOSHIAKISUGANO TATEOTERAJIMA MINORUHARA TOSHITO
    • B41J2/335B41J2/345
    • B41J2/345
    • PURPOSE:To obtain a thermal head not susceptible to the influence of defects of glaze, excellent in the printing quality and having a long life, by displacing the pitch of lower thick film condutors by 1/2 with respect to that of upper thin film conductors so that heating resistors are not positioned just above the thick film conductors. CONSTITUTION:The thick film conductors 28 are formed on an aluminium base 26, and connected to a common conductors 25, an the tick film conductors 28 is formed a glaze layer 27, and on the glaze layer 27 are formed the thin film conductors 30 that in turn are connected to the common conductor 25. The thin film conductors 30 are bent upward to the right with respect to the common conductor 25 in order that the thick film conductors 28 and the thin film conductors 30 may be displaced regarding to each other by 1/2 of their pitches. Accordingly, as the heating resistors 31 are not positioned right over the thick film conductors 28, there is no influence of defects of the glaze layer 27, i.e. projections and pinholes thereof.
    • 目的:为了获得不易受釉料缺陷影响的热敏头,其印刷质量优异并具有长寿命,通过将下层厚膜调节器的间距相对于上薄膜导体的间距移位1/2, 使得加热电阻器不位于厚膜导体的正上方。 构成:厚膜导体28形成在铝基体26上,与公共导体25连接,刻薄膜导体28形成有釉层27,在釉层27上形成薄膜导体30,薄膜导体 又连接到公共导体25.薄膜导体30相对于公共导体25向上向右弯曲,以便厚膜导体28和薄膜导体30可以通过 一半的球场。 因此,由于加热电阻器31不位于厚膜导体28的正上方,所以不会影响釉层27的缺陷,即其突起和针孔。
    • 26. 发明专利
    • Thin film diode and manufacture thereof
    • 薄膜二极管及其制造
    • JPS5721871A
    • 1982-02-04
    • JP9636280
    • 1980-07-15
    • Fujitsu Ltd
    • KOYAMA MASATAKATERAJIMA MINORUHARA TOSHITO
    • H01L31/10H01L29/861
    • H01L29/861
    • PURPOSE:To integrally form many diodes of a diode matrix circuit without necessity of bonding step by laminating N type semiconductor thin film and P type semiconductor thin film on a substrate. CONSTITUTION:A Ti film 2 is formed on a ceramic substrate 1, and a Cd-Sn film 3 is deposited on the film 2. After Se-I film 4, Se-Te film 5 and Ni film 6 are sequentially formed then, aluminum film 7 is deposited thereon, and drawing electrode 7a, 7b are formed by etching. Thereafter, it is heat treated at 300 deg.C, mutual diffusion is performed between the Cd-Sn film 3 and the Se-I film 4 to form a CdSe diffused film 8, and a P-N junction is formed between the N type CdSe diffused film 8 and the P type Se-I film 4.
    • 目的:通过在基板上层叠N型半导体薄膜和P型半导体薄膜,可以整体形成二极管矩阵电路的多个二极管,无需粘合步骤。 构成:在陶瓷基板1上形成Ti膜2,在膜2上沉积Cd-Sn膜3.在Se-I膜4之后依次形成Se-Te膜5和Ni膜6,然后将铝 在其上沉积膜7,并且通过蚀刻形成拉制电极7a,7b。 然后,在300℃下进行热处理,在Cd-Sn膜3与Se-I膜4之间进行相互扩散,形成CdSe扩散膜8,在N型CdSe扩散层之间形成PN结 薄膜8和P型Se-I薄膜4。
    • 29. 发明专利
    • OPTICAL INFORMATION READER
    • JPS5671370A
    • 1981-06-13
    • JP14746679
    • 1979-11-14
    • FUJITSU LTD
    • FUJIMORI MASATOSHIYAMADA FUMIAKITERAJIMA MINORUHARA TOSHITO
    • G06T1/00H04N1/028H04N1/031
    • PURPOSE:To make easily small sized reader, by locating illuminating light source and its drive circuit, photodetection element and its signal processing circuit and photoconductors on a slope of each support block, and combining the blocks into one unit. CONSTITUTION:At the bottom of a light shield case 1 of metal-made box type, a light emission and photodetection opening 1a in slit shape lengthwise the width of original is made, and the 1st, 2nd and 3rd support blocks 3-5 of prism shape made of epoxy resin are fixed in the case 1. Further, an illumination light source 6 is located near the lower end of the 1st slope plane 3a of the block 3, and a drive circuit 7 for the light source 6 is fixed to the slope 3a. Further, the 2nd slope 4a having opposite angle as the slope 3a of the block 3 is formed on the block 4, a photodetector 8 is located near the upper end of the slope 4a, and a signal processing circuit 9 is located on the slope 4a. Further, a photoconductor 11 which receives a reflection light 10 from the original 2 and introduces it to the element 8, is located on the slope 5a of the block 5, allowing to make the size of device small.