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21. 发明专利

JP2009031067A Sensor device 审中-公开
标题翻译：传感器设备
公开(公告)号：JP2009031067A
公开(公告)日：2009-02-12
申请号：JP2007193832
申请日：2007-07-25
申请人： Denso Corp , 株式会社デンソー
发明人： USUI KAZUO
IPC分类号： G01F1/692
摘要： PROBLEM TO BE SOLVED: To provide a sensor device which ensures the state of electrical connection between a sensor chip and an external connection terminal and suppresses damage to a thin wall portion and change in sensor characteristics. SOLUTION: The sensor device has the sensor chip which has a detecting part and a wiring part formed on a semiconductor substrate having a hollow portion and which has a resistor constituting the detecting part and formed in the thin wall portion on the hollow portion, a support member on one surface of which the sensor chip is fixed by adhesion, with the lower side thereof made a mounting surface, the external connection terminal which is connected electrically to the wiring part, and a sealing resin which is disposed integrally so that it covers the part of connection of the wiring part and the external connection terminal and that the detecting part and the thin wall portion are exposed. At least one first recess is formed in at least either a part of the lower side of the sensor chip or a part of the area on one side of the support member being opposite to the lower side of the chip, so that the recess is not adjacent to an opening area of the hollow part or to an area corresponding to the opening area. An adhesive is disposed in the first recess and thereby the part of the lower side of the sensor chip is fixed by adhesion to the support member. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种确保传感器芯片和外部连接端子之间的电连接状态并且抑制对薄壁部分的损害并改变传感器特性的传感器装置。解决方案：传感器装置具有传感器芯片，该传感器芯片具有检测部分和形成在具有中空部分的半导体基板上的布线部分，并且具有构成检测部分的电阻器并形成在中空部分的薄壁部分中，一个表面上的支撑构件，其传感器芯片通过粘合固定，其下侧形成安装表面，电连接到布线部分的外部连接端子和一体地设置的密封树脂，使得它覆盖了布线部分和外部连接端子的连接部分，并且检测部分和薄壁部分被暴露。至少一个第一凹部形成在传感器芯片的下侧的至少一部分中，或者支撑构件一侧的区域的一部分与芯片的下侧相对，使得凹部不是邻近中空部分的开口区域或对应于开口区域的区域。粘合剂设置在第一凹部中，由此传感器芯片的下侧的一部分通过粘附固定在支撑构件上。版权所有（C）2009，JPO＆INPIT

22. 发明专利

JP2008039431A Humidity detector 有权
标题翻译：湿度检测器
公开(公告)号：JP2008039431A
公开(公告)日：2008-02-21
申请号：JP2006210288
申请日：2006-08-01
申请人： Denso Corp , 株式会社デンソー
发明人： USUI KAZUO
IPC分类号： G01N27/22 , G01N27/04 , G01N27/12
摘要： PROBLEM TO BE SOLVED: To provide a humidity detector capable of efficiently heating a humidity-sensitive film.
SOLUTION: The humidity detector is equipped with a substrate 2 attached to a housing 1, a pair of the electrodes 4 installed on the substrate 2, the humidity-sensitive film 5 formed between at least a pair of the electrodes 4 and changed in either one of a specific dielectric constant and a resistance value corresponding to a humidity change, the heating part 3 installed on the substrate 2 to heat the humidity-sensitive film 5, and an air layer 8 for thermally separating the housing 1 and the substrate 2.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够有效地加热湿敏膜的湿度检测器。＆lt; P＆gt;解决方案：湿度检测器配备有附接到壳体1的基板2，安装在基板2上的一对电极4，形成在至少一对电极4之间的湿度敏感膜5，并且改变在特定介电常数和对应于湿度变化的电阻值中的任一个中，安装在基板2上的加热部分3以加热湿度敏感膜5，以及空气层8，用于将壳体1和基板 2.版权所有（C）2008，JPO＆INPIT

23. 发明专利

JP2005345015A Sensor mounting apparatus 审中-公开
标题翻译：传感器安装设备
公开(公告)号：JP2005345015A
公开(公告)日：2005-12-15
申请号：JP2004165838
申请日：2004-06-03
申请人： Denso Corp , 株式会社デンソー
发明人： USUI KAZUO
IPC分类号： G01K1/14 , B60H1/00 , F24F11/02 , F25B49/02
摘要： PROBLEM TO BE SOLVED: To provide a sensor mounting apparatus capable of stably fixing a temperature sensor. SOLUTION: The sensor mounting apparatus 10 fixes the temperature sensor 1 while the tip side of the temperature sensor 1 is inserted between fins 21 of an evaporator 20. The sensor mounting apparatus 10 comprises an extending section 11 that is disposed insertably between the fins 21 and extends substantially in parallel with a case 2 of the temperature sensor 1, a protrusion 12 that projects and contacts with the fins 21 while the extending section 11 is inserted between the fins 21, and a fixing section 13 for fixing the extending section 11 to the temperature sensor 1 in a non-insertion section between the fins 21 of the temperature sensor 1. The protrusion 12 is disposed so that the contact part with the extending section 11 is positioned on the insertion tip side of the extending section 11 more than the projection vertex in the longitudinal direction of the extending section 11. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够稳定地固定温度传感器的传感器安装装置。解决方案：传感器安装装置10固定温度传感器1，同时温度传感器1的末端侧插入蒸发器20的翅片21之间。传感器安装装置10包括延伸部分11，翅片21并且基本上与温度传感器1的壳体2平行地延伸，突出部12在翼片21插入翅片21的同时突出并与翅片21接触，并且固定部分13用于固定延伸部分 11相对于温度传感器1的翅片21之间的非插入部分中的温度传感器1.突起12设置成使得与延伸部分11的接触部分位于延伸部分11的插入末端侧比扩展部分11的纵向方向上的投影顶点更大。（C）2006年，JPO＆NCIPI

24. 发明专利

JP2000321147A MANUFACTURE OF TEMPERATURE SENSOR 失效
公开(公告)号：JP2000321147A
公开(公告)日：2000-11-24
申请号：JP13316199
申请日：1999-05-13
申请人： DENSO CORP
发明人： USUI KAZUO
IPC分类号： G01K7/22
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a temperature sensor inexpensively while reducing the labor required for manufacturing by eliminating the need for sealing the temperature detecting part with sealant in order to secure the temperature detecting part in a case. SOLUTION: A temperature detecting part 10a formed by connecting a temperature sensing element 12 with an output transmission terminal 14 through lead wires 13, a first molding die 20 shaped to correspond with the outer shape of a case 11 and provided with a hollow section 21 opening on one end side, and a second molding die 30 shaped to correspond with a hole forming part 32 for securing the terminal 14 and the space part 15 of the case 11 and provided with a rod-like protrusion 33 projecting from the hole forming part 32 are prepared. The temperature sensing element 12 is then arranged at the forward end part of the protrusion 33 and the terminal 14 is secured to the hole forming part 32. Under that state, the protrusion 33 of the second molding die 30 is inserted into the hollow section 21 of the first molding die 20 and both molding dies are matched. Subsequently, resin molding is carried out to form a case 11 where the temperature detecting part 10a is molded.

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