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21. 发明专利

JP2005238288A Method and device for solidifying grinding or polishing swarf 有权
标题翻译：用于固结研磨或抛光的方法和装置
公开(公告)号：JP2005238288A
公开(公告)日：2005-09-08
申请号：JP2004051561
申请日：2004-02-26
申请人： Mori Tekko Kk , Nachi Fujikoshi Corp , Nifuko Plant Kk , ニフコプラント株式会社 , 株式会社不二越 , 森鉄工株式会社
发明人： MIWA SHIGEKI , IWANAMI TADASHI , MORI KOICHI
IPC分类号： B24B55/12 , B30B9/28 , C02F11/00 , C02F11/12
CPC分类号： B30B9/327 , B30B9/067
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for solidifying coolant containing grinding or polishing swarf of several μm to 150 μm whose control is easy, in which no energy losses are present, and in which binder is unnecessary. SOLUTION: In the solidifying method, grinding swarf 30 or the like containing coolant charged in a cylinder 1 is pressed by a piston 21 to discharge the contained coolant, and grinding swarf or the like is solidified. A main hydraulic cylinder 51 and a sub hydraulic cylinder 52 are mounted on the piston, and the swarf is solidified by a first step of reducing the volume of the coolant content of grinding waste or the like in the cylinder by the pressing force of only the sub hydraulic cylinder, and a second step of solidifying grinding swarf by the pressing force of the main hydraulic cylinder. When the average grain size of the grinding swarf or the like is ≥ 1 μm to ≤ 5 μm, the feed rate in the first step is set to be ≥1 mm/sec and ≤5 mm/sec. The coolant content of the grinding waste after the first step and before the second step is set to be ≥ 10% and ≤ 30%. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种固化含有研磨或抛光数十μm至150μm的切屑的冷却剂的方法和装置，其控制容易，其中不存在能量损失，并且不需要粘合剂。解决方案：在固化方法中，通过活塞21对包含在气缸1中的冷却剂的研磨切屑30等进行挤压，以使所容纳的冷却剂排出，并且研磨切屑等固化。主液压缸51和副液压缸52安装在活塞上，并且通过第一步骤使切屑固化，第一步骤是通过仅压缩气缸的压力来减小气缸中的研磨废料等的冷却剂含量的体积副液压缸，以及通过主液压缸的按压力固化研磨切屑的第二步骤。当研磨切屑等的平均粒径≥1μm〜≤5μm时，第一步骤中的进给速度设定为≥1mm/ sec，≤5mm/ sec。第一步骤之后和第二步骤之前的研磨废料的冷却剂含量设定为≥10％和≤30％。版权所有（C）2005，JPO＆NCIPI

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