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11. 发明专利

JP2000077091A Battery having spiral electrode body and its manufacture 有权
标题翻译：具有螺旋电极体的电池及其制造
公开(公告)号：JP2000077091A
公开(公告)日：2000-03-14
申请号：JP24189698
申请日：1998-08-27
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TAKEMURA DAIGO , URUSHIBATA HIROAKI , OZAKI HIROCHIKA , ICHIMURA HIDEO , KAWAGUCHI KENJI , MORIYASU MASAHARU , OKAMURA MASAMITSU , OGA TAKUYA , SHIODA HISASHI , ARAKANE ATSUSHI , YOSHIOKA SEIJI , KICHISE MAKIKO , AIHARA SHIGERU , DAITOKU OSAMU
IPC分类号： H01M10/04 , H01M4/139 , H01M10/05 , H01M10/0587 , H01M10/38 , H01M10/40
CPC分类号： Y02E60/122 , Y02P70/54
摘要： PROBLEM TO BE SOLVED: To enhance productivity and reliability by preventing adhesion of a adhesive to a winding core.
SOLUTION: A positive electrode and a negative electrode prepared by forming active material layers 3, 6 on current collector 2, 5 are wound through a separator 7 and opposingly disposed, and at least one of the positive electrode and the negative electrode and the separator 7 are stuck with an adhesive 9 to from an electrode body of a battery. A part of the positive electrode and the separator 7, the negative electrode and the separator 7, the positive electrode, the negative electrode, or the separator 7 is partly held between a pair of facing winding cores 8, the winding cores 8 are rotated so as to be covered, and the remaining part of the positive electrode, the negative electrode, and the separator is stuck with the adhesive 9, and they are wound to form the electrode body. This battery continuously has three layers of a stacked body of the current collector of one electrode and the separator 7, the current collector of one electrode, or the separator 7 in the central part, and the current collector of the other electrode and the current collector of one electrode are wound in the outer circumference of the three layers to form the electrode body.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：通过防止粘合剂粘附到卷芯上，提高生产率和可靠性。解决方案：通过在集电器2,5上形成活性物质层3,6而制备的正极和负极通过隔板7卷绕并相对设置，并且正电极和负极和隔板7中的至少一个从电池的电极体粘附有粘合剂9。正极和隔离物7，负极和隔板7，正极，负极或隔板7的一部分部分地保持在一对相对的绕组芯8之间，绕组芯8旋转被覆盖，并且将正极，负极和隔板的剩余部分粘贴在粘合剂9上，并且它们被卷绕以形成电极体。该电池连续地具有一个电极的集电体和中间部分的隔膜7，一个电极的集电体或隔板7的三个层叠体，另一个电极的集电体和集电体在三层的外周缠绕一根电极，形成电极体。

12. 发明专利

JP2002110743A BONDING APPARATUS 失效
公开(公告)号：JP2002110743A
公开(公告)日：2002-04-12
申请号：JP2000303566
申请日：2000-10-03
申请人： MITSUBISHI ELECTRIC CORP
发明人： HASE HIROAKI , KISHI TOSHINOBU , NAGAI KIYOHARU , OKAMURA MASAMITSU , OGA TAKUYA
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain a bonding apparatus in which parallelism of a press surface of a head and a stage surface can be adjusted easily and precisely. SOLUTION: This apparatus comprises a head measuring instrument 74 for measuring the distance to the press surface of the head 12, a stage-measuring instrument 72 for measuring the distance to the surface of the stage 20, a stage movement mechanism 30 for moving the head-measuring instrument 74 relatively along the press surface of the head 12 horizontally, an inclination adjustment mechanism 50 for adjusting an inclination between the press surface of the head 12 and the surface of the stage 20, an operation part 88 for operating the inclination between the press surface of the head 12 and the surface of the stage 20, on the basis of the operated value obtained by calculating the inclinations of the press surface of the head 12 and the surface of the stage 20 on the basis of the measured values at each three points, from the stage measuring instrument 72 and the head measuring instrument 74, corresponding to the three points of positions on the non-identical straight line along which the stage movement mechanism 30 is moved horizontally, and a table control part 84 for adjusting the inclination of the press surface of the head 12 by the inclination adjustment mechanism 50 on the basis of the operated values in the operation part.

13. 发明专利

JP2001230596A METHOD AND APPARATUS FOR MOUNTING ELECTRONIC COMPONENT 失效
公开(公告)号：JP2001230596A
公开(公告)日：2001-08-24
申请号：JP2000036492
申请日：2000-02-15
申请人： MITSUBISHI ELECTRIC CORP
发明人： HASE HIROAKI , KISHI TOSHINOBU , NAGAI KIYOHARU , OKAMURA MASAMITSU , OGA TAKUYA
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a mounting apparatus of an electronic component which is easy to conduct calibration. SOLUTION: There are provided a chip camera 32 for imaging an upper-point mark 103a, a board camera 34 for image pickup of a lower-point mark 105a, and a relative position camera 101 for image pickup of the upper-point mark 103a and the lower-point mark 195a. Here, an image process 201 is provided, where based on the information imaged with the chip camera 32 and the board camera 34, the position of point marks 103a and 105a in first and second coordinate systems of the chip camera 32 and the board camera 34 are acquired, while based on the information image picked up by the relative position camera 101, third and fourth positions of point marks 103a and 105a in a third coordinate system of the relative position camera 101 are acquired. Furthermore, a calculation step 203 is provided, where a calibration amount for the first and second positions is acquired based on the third and the fourth positions with one of coordinate systems from among first to third coordinate systems as a reference.

14. 发明专利

JP2001032996A MANUFACTURE OF SANDWICH PLATE AND SANDWICH PLATE 失效
公开(公告)号：JP2001032996A
公开(公告)日：2001-02-06
申请号：JP20742699
申请日：1999-07-22
申请人： MITSUBISHI ELECTRIC CORP
发明人： TOYODA NORIHIKO , OKAMURA MASAMITSU , TAKAYAMA HIROSHI , KUNUGI TOSHIAKI , KAWASAKI MASAKATSU
IPC分类号： F16S1/00 , B29C70/86 , B32B3/06 , B32B3/12 , F16B5/01 , F16B5/10
摘要： PROBLEM TO BE SOLVED: To provide the manufacturing method sandwich plate of a high quality and productivity incorporated with an insert. SOLUTION: The manufacturing method of a sandwich plate comprises the first steps (a), (b) of mounting the other end of an insert 1 having one end sharpened, inside a previously holed facing material 2, the second step (c) pushing the insert 1 into a core material 4 in such a manner that the one end of the insert 1 forcibly cuts the core material 4, and the third step (d) of mounting the facing material 2 on the face of the core material 4 at its side opposite to the insert push-in side.

15. 发明专利

JP2000099152A XY AXES HEAD POSITIONING DEVICE 失效
公开(公告)号：JP2000099152A
公开(公告)日：2000-04-07
申请号：JP26640998
申请日：1998-09-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUNAOKA KOJI , OGA TAKUYA , KIMURA YASUKI , OKAMURA MASAMITSU
IPC分类号： H01L21/60 , G05D3/00
摘要： PROBLEM TO BE SOLVED: To enable a positioning with high acceleration/deceleration and high accuracy by providing an XY axes head positioning device light in weight and high in rigidity which can obtain high feedback controllability. SOLUTION: This device is provided with a head 30 installed on an XY plane guiding device 41 movable in the XY directions, X-axis table 1 installed on a straight move guiding device 6 straight-linearly movable in the X-axis direction and provided with a flat coil 34 so as to drive the head 30 in the X-axis direction, Y-axis table 2 installed on the straight move guiding device 6 enabled in straight-linearly movable in the Y-axis direction and provided with the flat coil 34 so as to drive the head 30 in the Y-axis direction, electromagnetic driving device with the flat coils 34 of the X-axis and Y-axis tables 1 and 2 as movable elements and link guiding device 40 for sliding the head 30 along with the end faces of the X-axis table 1 and Y-axis table 2, and the center of gravity of the said head 30, X-axis table 1, Y-axis table 2 and link guiding device 40 are arranged on almost the same plane.

16. 发明专利

JPH11238786A SEMICONDUCTOR CHIP-SUCKING DEVICE 失效
公开(公告)号：JPH11238786A
公开(公告)日：1999-08-31
申请号：JP4057298
申请日：1998-02-23
申请人： MITSUBISHI ELECTRIC CORP
发明人： KATO MITSUHIRO , OKAMURA MASAMITSU , OGA TAKUYA
IPC分类号： H01L21/683 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To set a proper pressurization force by fitting a collet shaft to a collet head via a gap for suppressing vacuum leak without interfering with the sliding of the collet shaft on an inner-periphery surface. SOLUTION: A semiconductor chip-sucking device is provided with a collet 11 where a suction hole 11a is formed through a center part and a collet shaft 12 that is formed integrally with the collet 11. Also, the device is provided with a cylindrical collet head 14, that is filled to the collet shaft 12 via a gap C for suppressing vacuum leakage without interfering with the sliding of the collet shaft 12 at an inner-periphery side. An annular recess 14a is formed along the inner-periphery surface that faces an opening hole 12b of the collet shaft 12, and a suction port 14b that communicates with the recess 14a is formed at an outer-periphery side. In this manner, the gap C of the engagement part between the collet shaft 12 and the collet head 14 is set, and vacuum leak can be suppressed without interfering with the sliding of the collet shaft 12, thus a vacuum pressure required for sucking a semiconductor chip 13.

17. 发明专利

JPH09237574A ELECTRON GUN ASSEMBLING DEVICE AND ITS METHOD 失效
公开(公告)号：JPH09237574A
公开(公告)日：1997-09-09
申请号：JP4196996
申请日：1996-02-28
申请人： MITSUBISHI ELECTRIC CORP
发明人： KIMURA YASUKI , SHIRASE TAKASHI , OKAMURA MASAMITSU , MAEZONO SHIYUUICHI
IPC分类号： H01J9/18
摘要： PROBLEM TO BE SOLVED: To provide an electron gun assembling device having the optimum cutoff voltage characteristic by providing a laser displacement gauge and electric micrometers measuring the height of the surface of a cathode, the height of the upper face of the first electrode, and the height of the lower face of the second electrode respectively on an electron gun assembly. SOLUTION: A reference jig 17 has a known thickness to , and it is honzontally driven by a driving mechanism 18 between the position of a laser displacement gauge and the retreat position. Electrodes are assembled while the center positions of electron passing holes are aligned in an electron gun assembly 24 assembled with the electrodes except for a cathode 1. A positioning shaft 9a is inserted into the electron passing holes of the electrodes except for the first electrode 3 and the second electrode 4, and it is fixed by a holding mechanism 9. The probe 8a of an electric micrometer 8 is arranged in the positioning shaft 9a, the lower face position of the second electrode 4 is measured by the electric micrometer 8, and the upper face position of the first electrode 3 is measured by an electric micrometer 11. An electron gun having the optimum cutoff voltage characteristic as the accurate G1K interval is finally obtained.

18. 发明专利

JP2522330B2 失效
公开(公告)号：JP2522330B2
公开(公告)日：1996-08-07
申请号：JP28996287
申请日：1987-11-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： IKUTA YOSHIKAZU , OKAMURA MASAMITSU
IPC分类号： H01L21/60

19. 发明专利

JPH0428136B2 失效
公开(公告)号：JPH0428136B2
公开(公告)日：1992-05-13
申请号：JP9848484
申请日：1984-05-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： ICHIMURA HIDEO , OKAMURA MASAMITSU
IPC分类号： B23K20/00 , B23K20/14 , B23K20/16 , H01L21/60
摘要： PURPOSE:To maintain the circumferential part of a ball in a reducing or inert atmosphere during the period between the time when the ball is formed and the point of bonding by a method wherein reducing or inert gas is jetted into a cylinder from the side face of the cylindrical cover which is positioned enveloping a capillary. CONSTITUTION:A cylindrical cover 1 is fixed to a bonding head or an X-Y table, it is electrically insulated and constituted in such a manner that it envelopes a capillary 2. A gas sucking hole 3 is provided on the side face of the cylindrical cover 1, gas is injected, and inside the cylindrical cover 1 is maintained in a reducing atmosphere or an inert atmosphere. Accordingly, as the oxidization of the ball 7, which is formed when it is fused by the heat of electric discharge, is prevented and an excellent and stabilized bonding can be performed at all times even when the wire other than a gold wire such as an aluminum wire and a copper wire are used.

20. 发明专利

JPS63257237A WIRE BONDING 失效
公开(公告)号：JPS63257237A
公开(公告)日：1988-10-25
申请号：JP9271787
申请日：1987-04-14
申请人： MITSUBISHI ELECTRIC CORP
发明人： OKAMURA MASAMITSU , ICHIMURA HIDEO , OSHIGE TOYOMI
IPC分类号： H01L21/60
摘要： PURPOSE:To stabilize a wire loop and to prevent a short circuit at an edge and a bend by moving a capillary in such a way that the tension is exerted on the wire loop just before a bonding point. CONSTITUTION:After a capillary 4 has bonded a wire 2 to a first bonding point a, it is lifted, passes through a highest rise point b and then descends; the capillary 4 stops descending once at a prior point c and is shifted horizontally to an upper point d; after that, it descends again and bonds the wire 2 to a second bonding point e. If the capillary 4 is shifted according to this locus, the tension is exerted on a wire loop 7; a curved point on the side of the capillary 4 is shifted from A to B; accordingly, it is possible to prevent a short circuit at an edge irrespective of a bonding distance and a type of a semiconductor device.

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