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11. 发明专利

JP2000079518A IMAGE RECOGNITION DEVICE IN AUTOMATIC ASSEMBLY DEVICE AND IMAGE RECOGNITION METHOD 失效
公开(公告)号：JP2000079518A
公开(公告)日：2000-03-21
申请号：JP24806398
申请日：1998-09-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ABE HISAKI , EGUCHI TOMOFUMI , ARIYOSHI HIROSHI
IPC分类号： H04N5/225 , B23P19/00 , G06T1/00 , G06T7/00 , H01L21/52 , H04N7/18
摘要： PROBLEM TO BE SOLVED: To improve the operability and reduce the workload imposed on an operator. SOLUTION: The size 60 of an image frame of a camera for photographing an object to be recognized, or a chip 5, and the size of a chip 5 are stored and when the object to be recognized is photographed by a photographing part having a zoom optical system, the zoom magnification of the photographing part is automatically determined by a magnification determining-processing part so that the display size of the chip 5 in the field of view falls in 1/2 of the image frame. Thus, the need of determination of the magnification by an operator is eliminated, the operability is improved, and the image recognition can be performed in the constantly fixed, good condition.

12. 发明专利

JP2002063565A DEVICE AND METHOD FOR IMAGE RECOGNITION 失效
公开(公告)号：JP2002063565A
公开(公告)日：2002-02-28
申请号：JP2000246836
申请日：2000-08-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ABE HISAKI , EGUCHI TOMOFUMI
IPC分类号： G01B11/00 , G06T1/00 , G06T7/00 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for image recognition which make is possible to set a criterion by a proper and easy method. SOLUTION: This is an image recognizing method for judging the status of a chip by picking up and recognizing an image of the chip on a wafer sheet, and when a match rate as the criterion used to judge the status of the chip by obtaining a match value by matching the image data obtained by picking up the image of the chip with reference patterns and making a comparison with the match value is set, match values obtained by picking up images of chips are compared with the match rate to display temporary decision results and the images of the chips, correction input for matching the temporary judging results with the correct judgement result based upon the images is carried out, and a match rate having consistency to judgement logic deriving the correct judgement result from the match values is computed.

13. 发明专利

JP2000321024A POSITION DETECTING METHOD UTILIZING IMAGE RECOGNITION 失效
公开(公告)号：JP2000321024A
公开(公告)日：2000-11-24
申请号：JP12960599
申请日：1999-05-11
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： EGUCHI TOMOFUMI , ABE HISAKI
IPC分类号： H05K13/08 , G01B11/00
摘要： PROBLEM TO BE SOLVED: To provide a position detecting method utilizing image recognition by which the efficiency of a discriminating device can be improved by preventing the occurrence of recognition errors. SOLUTION: In a position detecting method utilizing image recognition in which the position of an electrode 3b' is detected by pattern matching by taking the image of a substrate 3, a camera is moved to a target position P which is offset from a pickup reference position which is specified by the position of the electrode 3' of the substrate 3 set to a normal position by offsetting amounts DX and DY calculated based on the relative positional relations between a reference area 43 set as the extent of the electrode 3b' in a reference pattern 45 and reference areas 44A and 44B set in the other area of the pattern 45. Therefore, the occurrence of recognition errors can be prevented by reducing the probability that the reference pattern 45 comes off the searching area 40 of the taken picture.

14. 发明专利

JPH11330117A DEVICE AND METHOD FOR LOADING CONDUCTIVE BALL 失效
公开(公告)号：JPH11330117A
公开(公告)日：1999-11-30
申请号：JP12570298
申请日：1998-05-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： EGUCHI TOMOFUMI
IPC分类号： B23P19/00 , B23P21/00 , H01L21/50 , H01L21/60 , H01L23/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To realize conductive ball loading device and method capable of highly accurately detecting the existence of a conductive balls. SOLUTION: At the time of a conductive ball existence inspection in a conductive ball loading process for sucking conductive balls by a suction head and loading the sucking balls on a work, the head is relatively horizontally moved from a light-proof type optical sensor 43 to acquire waveform data 62 which indicate a change in the degree of light-proofing. The peak value data of a reference waveform obtained, when the head normally sucks conductive balls are compared with the peak value data of a waveform obtained at the time of practically loading conductive balls for detecting the existence of conductive balls excessively stuck to the work. Consequently, an error in the degree of light-proofing due to the inclination of the suction head or the working errors of suction holes can be removed and the existence of conductive balls can be highly accurately detected.

15. 发明专利

JPH10261675A METHOD OF LOADING CONDUCTIVE BALL 失效
公开(公告)号：JPH10261675A
公开(公告)日：1998-09-29
申请号：JP6407597
申请日：1997-03-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SAKAI TADAHIKO , MATSUZAKI HIROFUMI , NAKAZATO SHINICHI , KASAI TERUAKI , EGUCHI TOMOFUMI , TAKAHASHI KOICHI
IPC分类号： B23P21/00 , H01L21/60 , H05K3/34 , H01L21/321
摘要： PROBLEM TO BE SOLVED: To provide the method of loading conductive balls, which can surely detect a pickup error and a mis-placing. SOLUTION: A camera 30 is provided for the moving route of a chuck head 11 of conductive balls 1. The lower face of the chuck head 11 is image-picked up. A first search region which is set by surrounding all the chuck holes 11a is set and a second search region in a range except for the first search region, based on the arranging pattern of the chuck holes 11a, which are previously stored in a screen obtained by image-pickup. The presence or absence of the pickup error of the conductive balls is detected according to the first and second search regions. Then, whether or not the conductive balls that are left by means of the placing error exist is detected with the whole range of the lower face of the chuck head 11 as the search regions after the loading of the conductive balls 1.

16. 发明专利

JP2001244290A METHOD OF MOUNTING CONDUCTIVE BALL 失效
公开(公告)号：JP2001244290A
公开(公告)日：2001-09-07
申请号：JP2001014163
申请日：2001-01-23
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SAKAI TADAHIKO , MATSUZAKI HIROFUMI , NAKAZATO SHINICHI , KASAI TERUAKI , EGUCHI TOMOFUMI , TAKAHASHI KOICHI
IPC分类号： H05K3/34 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting a conductive ball by which pick-up errors and placement errors can be detected with high reliability. SOLUTION: A camera 30 is installed in the path of a chuck head 11 for conductive balls 11 to pickup an image of the lower face of the chuck head 1 before and after mounting the conductive balls 1. Based on an arrangement pattern of chucking holes 11a preliminarily stored in the image picked up by the camera, a first search area surrounding each chuck hole and a second search area which is the other part than the first search area are set. Whether there are pick-up errors for the conductive balls or not is detected based on the first and second search areas. After mounting the conductive balls, the entire lower face of the chuck head is set as a search area to detect whether there are residual conductive balls due to placement errors.

17. 发明专利

JP2000079517A AUTOMATIC ASSEMBLY DEVICE AND AUTOMATIC ASSEMBLY METHOD 失效
公开(公告)号：JP2000079517A
公开(公告)日：2000-03-21
申请号：JP24806298
申请日：1998-09-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ABE HISAKI , EGUCHI TOMOFUMI , ARIYOSHI HIROSHI
IPC分类号： H04N5/225 , B23P19/00 , G05B19/401 , G06T1/00 , G06T7/00 , H01L21/52 , H04N7/18 , H05K13/02
摘要： PROBLEM TO BE SOLVED: To improve the operability to reduce the workload imposed on operators. SOLUTION: The die-bonder is provided with an image recognition device having a zoom optical system 9 to align a chip 5 based on the image recognized results. In this case, recognition offset data or data on picture element rate for specifying relative positional relation between an optical coordinate system and a mechanical coordinate system of the die-bonder are stored in a correction magnification data storage part 42 in relation to the zoom magnification, and based on the zoom magnification at the time of photographing chip 5 by an image recognition part 11 data are selected, and the recognition results are converted from positional information on the optical coordinate system into positional information on the actual dimension on the mechanical coordinate system of the die-bonder, using the selected data. Thus, the data setting work at the time of changing the magnification is automated, and thus the operability can be improved.

18. 发明专利

JP2003258008A METHOD FOR PICKING UP ELECTRONIC COMPONENT 审中-公开
公开(公告)号：JP2003258008A
公开(公告)日：2003-09-12
申请号：JP2002055620
申请日：2002-03-01
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： EGUCHI TOMOFUMI , ABE HISAKI
IPC分类号： H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide a method for picking up electronic components by which labor and a time for setting the starting point of pickup is eliminated and productivity is improved. SOLUTION: With respect to the pickup starting point setting process which is performed prior to a pickup operation for taking chips 5a from a semiconductor wafer 5 which is attached to a wafer sheet 4 and has an irregular outer shape, the wafer sheet 4 is searched in an imaging filed 22 having a field size larger than that of an imaging field 23 for chip recognition for positioning chips. If the component region corresponding to the semiconductor wafer 5 is detected, the uppermost and leftmost point of the component region is stored as a starting point option, and the uppermost and leftmost point of the starting point options in the search position [X, Y] belonging to the same row is set a pickup starting point Ps. In this way, the number of times of imaging for setting the pickup starting point is reduced and the time necessary for search can be reduced. COPYRIGHT: (C)2003,JPO

19. 发明专利

JP2000243763A METHOD FOR PICKING UP SEMICONDUCTOR CHIP 失效
公开(公告)号：JP2000243763A
公开(公告)日：2000-09-08
申请号：JP4438099
申请日：1999-02-23
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ABE HISAKI , EGUCHI TOMOFUMI , ARIYOSHI HIROSHI
IPC分类号： H01L21/52
摘要： PROBLEM TO BE SOLVED: To carry out efficient pick-up works by shortening image recognition time. SOLUTION: In a method for picking up a semiconductor chip which picks up a chip 6 on a wafer sheet 5, in a step of recognizing an image for detecting a position of the chip 6, two large and small search areas having different sizes are established in an image pick-up visual field, and when a detection of a position of the chip 6 of a single wafer sheet is made in a prescribed sequence, if the position of the single chip 6 is detected normally, in a detection of a position of a semiconductor chip to be recognized at a time subsequent to the chip 6, the small search area is used. Thus, frequencies of using the large search area are decreased, and a recognition time is reduced, so that image recognition can be performed efficiently.

20. 发明专利

JPH11354993A WORK CARRIER 失效
公开(公告)号：JPH11354993A
公开(公告)日：1999-12-24
申请号：JP16314198
申请日：1998-06-11
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KASAI TERUAKI , EGUCHI TOMOFUMI
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide a work carrier in which the operation efficiency can be enhanced in work line. SOLUTION: In a system 1 for inspecting a board 5, a passage for carrying the board 5 is arranged with a plurality of inspection stages A, B having means for lifting the board 5 on the carrying passage and carriage of the board to/from the work stages A, B is controlled by a control means. The control means comprises a sensor F for detecting approach of the board 5 from the upstream side, means for determining an inspection stage for carrying the board 5, means for storing presence of the board 5 at the inspection stages A, B, and means for controlling carriage of the board at each inspection stage. According to the arrangement, a board can be carried at other inspection stages even when another board is inspected at one inspection stage.

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