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    • 17. 发明专利
    • Insulating high-thermal conductivity resin composite material
    • 绝缘高导电性树脂复合材料
    • JP2010024406A
    • 2010-02-04
    • JP2008190498
    • 2008-07-24
    • Mitsubishi Gas Chemical Co Inc三菱瓦斯化学株式会社
    • MATSUMOTO TAKAHIROYAMADA TOSHIAKIBAN HAJIMEOKAMOTO TAKANOBU
    • C08L101/00C08K9/00
    • PROBLEM TO BE SOLVED: To provide an insulating high-thermal conductivity resin composite material. SOLUTION: The resin composite material contains a resin (1) and insulating superfine powder (2) and has ≥0.8 W/mK thermal conductivity, ≤2 specific gravity and ≥10 10 Ωcm volume resistivity. In the insulating superfine powder, electrically-conductive superfine powder is obtained by forming a film of an insulating metal oxide or its hydrate on the surface of the electrically-conductive superfine powder composed of a spherical carbon material having 1-500 nm particle diameter, a fibrous carbon material having 1-500 nm cross-sectional diameter or a plate-shaped carbon material having 1-500 nm thickness. The thickness of the film is ≥0.3 nm and is not larger than the particle diameter when the spherical carbon material is used as the electrically-conductive superfine powder, is not larger than the cross-sectional diameter when the fibrous carbon material is used, or is not larger than the thickness when the plate-shaped carbon material is used. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供绝缘的高导热性树脂复合材料。 解决方案:树脂复合材料含有树脂(1)和绝缘超细粉(2),具有≥0.8W/ mK导热率,≤2比重和≥10 10 Ωcm体积电阻率 。 在绝缘超细粉末中,通过在由具有1-500nm粒径的球形碳材料构成的导电超细粉末的表面上形成绝缘金属氧化物或其水合物的膜来获得导电超细粉末, 具有1-500nm截面直径的纤维状碳材料或厚度为1-500nm的板状碳材料。 当使用球形碳材料作为导电超细粉末时,膜的厚度≥0.3nm,不大于使用该纤维状碳材料时的截面直径,或者 不大于使用板状碳材料时的厚度。 版权所有(C)2010,JPO&INPIT