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11. 发明专利

JP2005167233A Heat-pipe embedded honeycomb sandwich panel 审中-公开
标题翻译：热管嵌入式蜂窝三明治板
公开(公告)号：JP2005167233A
公开(公告)日：2005-06-23
申请号：JP2004334589
申请日：2004-11-18
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAO AKIRA
IPC分类号： F28D15/02 , H01L23/427 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a honeycomb sandwich panel capable of reducing a space required for wiring a power source line and a signal line connected with an electronic apparatus and mounting the electronic apparatus on the panel with a high density with respect to a heat-pipe embedded honeycomb sandwich panel that is used as a panel for mounting the apparatus of a spacecraft and a satellite and required for demands as a structural material and the heat dissipating plate of the mounted electronic apparatus. SOLUTION: In a heat-pipe embedded honeycomb sandwich panel formed of a honeycomb sandwich panel and a heat pipe 3 embedded in this honeycomb sandwich panel, a power source line 6 and a signal line 7 for an electronic apparatus 5 attached to one surface or both surfaces of the panel are provided in a printed circuit board embedded in the honeycomb sandwich panel. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种蜂窝夹层板，其能够减少与电子设备连接的电源线和信号线的布线所需的空间，并且将电子设备以相对于高密度的高密度安装在面板上一种热管嵌入式蜂窝夹层板，其用作用于安装作为结构材料的要求的飞船和卫星的装置的面板以及所安装的电子设备的散热板。解决方案：在嵌入蜂窝夹层板的蜂窝夹层板和热管3形成的热管嵌入式蜂窝夹层板中，安装有电源线6和电子设备5的信号线7 面板的表面或两个表面设置在嵌入蜂窝夹层板中的印刷电路板中。版权所有（C）2005，JPO＆NCIPI

12. 发明专利

JP2003312600A Developing radiator and artificial satellite body provided with the same 有权
标题翻译：开发散热器和人造卫星身体
公开(公告)号：JP2003312600A
公开(公告)日：2003-11-06
申请号：JP2002116520
申请日：2002-04-18
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OGUSHI TETSURO , ISHIKAWA HIROAKI , UMEMOTO TOSHIYUKI , YAO AKIRA
IPC分类号： B64G1/50 , F25B23/00 , F28D15/02
CPC分类号： F28D15/0266
摘要： PROBLEM TO BE SOLVED: To provide developing radiator capable of improving the heat transport capacity of a loop type heat pipe.
SOLUTION: Among loop type heat pipes 3 connected with a panel arranged in an artificial satellite body 1, a team header pipe 3c comprising branch pipes (uppers steam header pipe 3c
1 and lower steam header pipe 3c
2 ) vertically branched to two (heat discharging side and its lower side), a condensation pipe 3d
1 connecting the upper steam header pipe 3c
1 and an upper liquid header pipe 3e
1 , a condensation pipe 3d
2 connecting the lower steam header pipe 3c
2 and a lower liquid header pipe 3e
2 , and a liquid header pipe comprises a branch pipe vertically branched to two (the upper liquid header pipe 3e
1 and the lower liquid header pipe 3e
2 ) are buried in the developing radiator 4.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供能够提高环型热管的传热能力的显影散热器。解决方案：在与配置在人造卫星体1中的面板连接的环路型热管3中，设有分支管（上部蒸汽总管3c＆lt; SB＆gt; 1＆lt; SB＆gt;和下部蒸汽集管垂直分支到两个（放热侧及其下侧）的冷凝管3d 连接上部蒸汽集管3c 1 ，连接下部蒸汽总管3c 2 的冷凝管3d 和下部液体集管 3e 2 ，并且液体总管包括垂直分支为两个的分支管（上液体总管3e 1 和下液体总管3e 2 < / SB>）埋在发展中的散热器4中。版权所有（C）2004，JPO

13. 发明专利

JP2003291900A Heat control device for artificial satellite 审中-公开
标题翻译：人造卫星热控制装置
公开(公告)号：JP2003291900A
公开(公告)日：2003-10-15
申请号：JP2002104299
申请日：2002-04-05
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OGUSHI TETSURO , ISHIKAWA HIROAKI , UMEMOTO TOSHIYUKI , YAO AKIRA
IPC分类号： B64G1/50 , F25D9/00 , F28D15/02
CPC分类号： F28D15/0266
摘要： PROBLEM TO BE SOLVED: To provide a heat control device for an artificial satellite, capable of heat control without consuming any electric energy of the artificial satellite.
SOLUTION: The heat control device comprises a plurality of inner panels 2 with electronics equipment 2a mounted thereon, being arranged inside an artificial satellite structure 1, a loop type heat pipe 3 being connected to the inner panels 2, having an evaporator 3a, a condenser 3b, a liquid pipe 3c connecting the evaporator 3a and the condenser 3b, where vapor phase operating fluid is flowing, and a liquid pipe 3d connecting the evaporator 3a and the condenser 3b, where liquid phase operating fluid is flowing, a connecting part 8a connecting the inner panels 2 and the loop type heat pipe 3, and an expandable type radiator panel 4 being connected to the inner panel 2 via a loop type heat pipe 3, as well as being foldably and expandably supported in the artificial satellite structure.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于人造卫星的热控制装置，其能够在不消耗人造卫星的任何电能的情况下进行热量控制。解决方案：热控制装置包括安装有电子设备2a的多个内板2，布置在人造卫星结构1内部，环形热管3连接到内板2，其具有蒸发器3a 冷凝器3b，连接蒸发器3a和冷凝器3b的液体管3c，气相工作流体流动，液相工作流体流过的蒸发器3a和冷凝器3b连接的液体管3d，连接内板2和环型热管3的部分8a，以及通过环型热管3连接到内板2的可膨胀型散热板4，并且可折叠地且可膨胀地支撑在人造卫星结构。版权所有（C）2004，JPO

14. 发明专利

JP2002249099A MULTILAYER HEAT INSULATING SHEET FOR SPACECRAFT AND INSULATING METHOD FOR SPACECRAFT 失效
公开(公告)号：JP2002249099A
公开(公告)日：2002-09-03
申请号：JP2001052082
申请日：2001-02-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： YAMASHITA SHINTARO , YAO AKIRA , NOZAWA TAKAYASU , FUTAKI YASUNARI
IPC分类号： B64G1/58 , B32B7/02 , F16L59/00
摘要： PROBLEM TO BE SOLVED: To provide a multilayer heat insulating sheet for a spacecraft preventing the heat intrusion from the outside and having superior permeability. SOLUTION: This multilayer heat insulating sheet for the spacecraft with a multilayer structure has permeable interlayer clearances between respective layers. This insulating sheet is characterized in that air passages are formed from the front side and the rear side of the multilayer heat insulating sheet for the spacecraft, the both air passages from the front side and the rear side are formed by deviating their positions so as to prevent the direct communication between the both passages, and the length of the both air passages are so formed as to reach arbitrary interlayer clearances.

15. 发明专利

JPH11198260A HONEYCOMB SANDWICH PANEL 失效
公开(公告)号：JPH11198260A
公开(公告)日：1999-07-27
申请号：JP850698
申请日：1998-01-20
申请人： MITSUBISHI ELECTRIC CORP
发明人： YAO AKIRA , SHIGEMASA HIROYUKI , OZAKI TAKESHI , HARUNA KAZUSHI , SEKO HIROMI , ODAWARA YASUSHI
IPC分类号： B64G1/50 , B32B3/12 , B32B3/30 , B32B5/00 , B32B5/18 , B64G1/66
摘要： PROBLEM TO BE SOLVED: To generate the irregular reflection on the skin of a honeycomb sandwich panel and increase the infrared ray radiation dose rate. SOLUTION: Carbon black 4 containing a large amount of π electrons is mixed into an outermost face 1 of a panel skin, and a rugged panel skin larger 8 containing a carbon black 9 is laminated to form an irregular reflection face on the surface of a panel, and also the infrared ray radiation is higher by 5-30% than what is heretofore available. As carbon containing a number of π electrons is used, the foam resistance rate of the panel outer surface can be minimized to the 1-10 Ωcm level even when the loadings are as small as 2-15%, and also as the loadings are small, the molding of complicated shape of the panel with bending surface or the like can be carried out.

16. 发明专利

JPH11148787A HEAT PIPE SANDWICH PANEL 失效
公开(公告)号：JPH11148787A
公开(公告)日：1999-06-02
申请号：JP31525997
申请日：1997-11-17
申请人： MITSUBISHI ELECTRIC CORP
发明人： SHIGEMASA HIROYUKI , YAO AKIRA , OZAKI TAKESHI , SEKO HIROMI , HARUNA KAZUSHI , ODAWARA YASUSHI
IPC分类号： B64G1/50 , B32B3/12 , F28D15/02
摘要： PROBLEM TO BE SOLVED: To obtain a heat pipe sandwich panel constituting the structure of a satellite in which a heating apparatus is prevented effectively from temperature rise by employing carbon fiber reinforced carbon at a part of a skin material touching a heat pipe. SOLUTION: A heat pipe sandwich panel comprises a skin material 6 of carbon fiber reinforced plastic composed of continuous carbon fiber and matrix of organic material for in-plane reinforcement, an aluminum honeycomb core 2, an adhesive 3 and an embedded heat pipe 1 wherein a heating apparatus 4 is fixed to the outside of the skin material 6. A part of the skin material 6, preferably the part for mounting the heating apparatus 4, is made of a skin material 7 employing carbon fiber reinforced carbon. Since the skin material 7 exhibits excellent thermal conductivity even in the out-plane direction, heat resistance can be decreased between the heating apparatus 4 and the heat pipe and the heating apparatus is prevented from temperature rise.

17. 发明专利

JPH09262917A HEAT TRANSFER ELEMENT 失效
公开(公告)号：JPH09262917A
公开(公告)日：1997-10-07
申请号：JP7461196
申请日：1996-03-28
申请人： MITSUBISHI ELECTRIC CORP
发明人： YAO AKIRA
IPC分类号： B32B5/02 , B32B5/12 , F28F13/00 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To reduce the heat resistance of an elastic heat transfer element and a heat absorbing element/a heat generating element by adding a carbon fiber anew to the end part of a carbon fiber in the carbon fiber direction. SOLUTION: A carbon fiber is added anew to the end part of a carbon fiber in the fiber direction. A heat generated by a heat generating element runs from the end of a carbon fiber 1 as shown by an arrow 5a, and at the same time, runs to the carbon fiber 10 of a fixed part to find its way into the carbon fiber 1. In addition, the thermal conductivity of the carbon fiber is exceedingly higher than that of an adhesive used for adhesion with a heating absorbing element/a heat generating element. Therefore, the end face of the carbon fiber 10 of the fixed part can be regarded as the heat transfer face of the carbon fiber 1. Thus it is possible to widen a heat transfer face on the end part of the carbon fiber 1 and reduce the thermal resistance of the flexible heat transfer element and the heat absorbing element/the heat generating element.

18. 发明专利

JPH0853100A HONEYCOMB SANDWHICH PANEL WITH HEAT PIPE EMBEDDED IN IT 失效
公开(公告)号：JPH0853100A
公开(公告)日：1996-02-27
申请号：JP18844194
申请日：1994-08-10
申请人： MITSUBISHI ELECTRIC CORP
发明人： YAO AKIRA , SEKO HIROMI
IPC分类号： B64G1/50 , B64G1/58 , F24D3/16 , F24D7/00 , F28D15/02 , H01L23/427
摘要： PURPOSE:To secure the rigidity of a panel and improve heat irradiation performance by directly joining a fin installed on a heat pipe on the surface skin of a panel and directly exposing a part of the heat pipe on the outer surface of a panel, as for the panel used as the panel for mounting the equipment such as cosmos plane and artificial satellite. CONSTITUTION:A honeycomb sandwhich panel has a surface skin 1 as outer surface and a honeycomb core 2 for providing rigidity to the panel, and inside the panel, a heat pipe 3 is embedded in order to improve the heat transmission inside or putside the surface of the panel. Inside the satelite body of the panel, the heat generating equipment 4 is mounted, and the second surface mirror 5 is installed on the cosmos space side of the panel, and the heat of the heat generating equipment is irradiated into the cosmos space. In this case, a fin 7 is installed on the heat pipe 3, and the surface skin 1 of the panel is joined with the cutting-in part of the fin 7. Accordingly, a part of the heat pipe 3 is exposed to the outer surface of the panel, and the heat resisitance is reduced.

19. 发明专利

JP2003185370A CAPILLARY FORCE DRIVING-TYPE TWO-PHASE FLUID LOOP, ITS EVAPORATOR AND HEAT TRANSPORTING METHOD 审中-公开
公开(公告)号：JP2003185370A
公开(公告)日：2003-07-03
申请号：JP2001384944
申请日：2001-12-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： MASUMOTO HIROMITSU , YAO AKIRA
IPC分类号： F28D15/02
摘要： PROBLEM TO BE SOLVED: To reduce the heat leakage from working fluid vapor to a liquid pipe or an evaporator core. SOLUTION: An end plate 14A recessed in the evaporator core 8 direction at the neighborhood of its joining part with the liquid pipe 6, is used as an end plate of a wick 2. As a heat conductive passage is elongated by the recessed part in comparison with a case when the end plate free from the recessed part is used, the heat leaked from the wick 2 to the liquid pipe 6 side through the end plate 14A is reduced. An end plate projecting to a vapor passage 3 side at the neighborhood of its joining part with the liquid pipe 6 may be used as the end plate of the wick 2. An end plate projecting to the outside of the evaporator at the neighborhood of its joining part with the liquid pipe 6, or an end plate recessed to the vapor passage 3 side at the neighborhood of its joining part with the liquid pipe 6 may be used as an end plate of a evaporator case 1. The neighborhood of the joining part with the end plate of the evaporator case 1 or the wick 2, of the liquid pipe 6 may have a double wall structure. COPYRIGHT: (C)2003,JPO

20. 发明专利

JP2003172589A LOOP-TYPE HEAT PIPE AND EVAPORATOR 审中-公开
公开(公告)号：JP2003172589A
公开(公告)日：2003-06-20
申请号：JP2001372509
申请日：2001-12-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： ISHIKAWA HIROAKI , OGUSHI TETSURO , UMEMOTO TOSHIYUKI , YAO AKIRA
IPC分类号： F28D15/02
摘要： PROBLEM TO BE SOLVED: To prevent the natural convection of working fluid in a liquid reservoir with a simple constitution, and to stably operate a loop-type heat pipe to accelerate the heat exchange among working fluid. SOLUTION: When the liquid cooled by a condenser 20 flows inside through a liquid supply pipe 17, a flat plate 50 is cooled as the liquid supply pipe 17 is thermally joined to the flat plate 50. Here, as the flat plate 50 is dipped in the liquid of the working fluid in the liquid reservoir 6, the liquid 13a of the working fluid is efficiently cooled, and the natural convection of the liquid 13a of the working fluid is inhibited by the flat plate 50. As a temperature in the liquid reservoir 6 is uniformly and sufficiently lowered in comparison with a temperature of an outer peripheral face of a wick 2, and the vapor 13b of the working fluid is generated only from the outer peripheral face of the wick 2, the loop-type heat pipe is stably operated. COPYRIGHT: (C)2003,JPO

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